372results about How to "Good joint" patented technology

Coronary sinus ring apparatus, including an elongated body for deployment in a coronary sinus, an aperture in a long side of the body, at least a partial lumen extending from one end of the elongated body to at least the aperture, and a guide within the elongated body positioned and shaped to guide an element inserted along the lumen to the aperture. Apparatus for treating a heart, including a delivery tube sized for and adapted for insertion into a body, a sharp tip adapted to be pushed through cardiac muscle, an elongate tensioning element, and a foldable anchor adapted to couple the elongate tension element to cardiac muscle tissue, wherein the delivery tube encloses one or both of the elongate tensioning element and the foldable anchor. Related apparatus is also described.

Devices and methods for improving the function of a valve (e.g., mitral valve) by positioning a spacing filling device outside and adjacent the heart wall such that the device applies an inward force against the heart wall acting on the valve. A substantially equal and opposite force may be provided by securing the device to the heart wall, and/or a substantially equal and opposite outward force may be applied against anatomical structure outside the heart wall. The inward force is sufficient to change the function of the valve, and may increase coaptation of the leaflets, for example. The space filling device may be implanted by a surgical approach, a transthoracic approach, or a transluminal approach, for example. The space filling portion may be delivered utilizing a delivery catheter navigated via the selected approach, and the space filling portion may be expandable between a smaller delivery configuration and a larger deployed configuration.

A method of fabricating a substrate placing stage includes the step of providing a plate-shaped ceramic base having a substrate placing surface on a side of the ceramic base. The method includes the step of providing a plate-shaped ceramic base formed of a composite material containing components of a ceramic material and an aluminum alloy. The method includes the step of inserting a joint material including an aluminum alloy layer between the ceramic base and the cooling member. The method includes the step of heating the joint material at a temperature in a range from TS ° C. to (TS-30) ° C. (TS ° C.: a solidus temperature of the aluminum alloy). The method includes the step of pressing substantially normally joint surfaces of the ceramic base and the cooling member, thereby joining the ceramic base and the cooling member via the joint material to obtain a joint layer including the aluminum alloy layer having a thickness in a range from 50 μm to 200 μm after joining.

Embodiments of a dynamically adjustable artificial chordae tendinae implant are described. In some embodiments the implant includes a body portion, including an adjustable portion. In some embodiments, the implant includes a plurality of adjustable portions. In some embodiments the adjustable element can include a shape memory material. The adjustable portion can be configured to transform from a first conformation to a second conformation in response to an activation energy. In some embodiments, the activation energy can be one of electromagnetic energy, acoustic energy, light energy, thermal energy, electrical energy, mechanical energy, or a combination of energies. The implant couples a heart valve leaflet to a papillary muscle. Activation of the shape memory material regulates tension between the muscle and valve leaflet improving coaptation of heart valve leaflets, and reducing or eliminating regurgitation.

An insulating ceramic composition forming insulating ceramic layers (3) stacked in a multilayer ceramic substrate (2) used in a monolithic ceramic electronic component, such as a multilayer ceramic module (1). The insulating ceramic composition contains a first ceramic powder mainly containing forsterite, a second ceramic powder mainly containing at least one compound selected from the group consisting of CaTiO₃, SrTiO₃, and TiO₂, and a borosilicate glass powder. The borosilicate glass powder contains 3 to 15 percent by weight of lithium in terms of Li₂O, 30 to 50 percent by weight of magnesium in terms of MgO, 15 to 30 percent by weight of boron in terms of B₂O₃, 10 to 35 percent by weight of silicon in terms of SiO₂, 6 to 20 percent by weight of zinc in terms of ZnO, and 0 to 15 percent by weight of aluminum in terms of Al₂O₃. The insulating ceramic composition can be fired at a temperature of 1000° C. or less, and the resulting sintered compact has a low relative dielectric constant, a resonance frequency with a low temperature coefficient, and a high Q value.

Methods and systems for improving the competency of a venous valve wherein one or more compressor(s) (e.g., space occupying material(s) or implantable device(s)) is/are delivered to one or more location(s) adjacent to a venous valve to compress the venous valve in a manner that causes one or both leaflets of the valve to move toward the other, thereby improving closure or coaptation of the valve leaflets. The compressor(s) may be delivered by an open surgical approach, by a direct percutaneous approach or by a transluminal catheter-based approach.

The invention discloses a method for manufacturing a double-stress membrane CMOS, comprising: a semiconductor substrate which comprises a first transistor and a second transistor is provided; a doped first stress membrane is formed on the first transistor; a second stress membrane is formed on the first stress membrane and the second transistor, wherein, the thickness of the second stress membrane is at least equal to the sum of the thicknesses of a grid medium layer, a grid and the first stress membrane of the first transistor; the second stress membrane is flattened, so that the surface of the first stress membrane is exposed out; photoresist patterns are formed on the exposed surface of the first stress membrane and the second stress membrane above a grid of the second transistor, wherein, the line width of the photoresist patterns above the grid of the second transistor and on the second stress membrane is larger than the line width of the grid of the second transistor; the second stress membrane which is not covered by the photoresist patterns is etched until the second stress membrane on the first stress membrane is removed. No bossed defects can be produced at the joint of a tension stress membrane and a compressive stress membrane layer.

The invention discloses a double-layer fried bread stick machine. The method comprises a rack and a conveyor belt mounted on the rack, a front dough feeding mechanism located in a material feeding end of the conveyor belt, and a first dough pressing mechanism, an oil brushing mechanism, a water brushing mechanism, a second dough pressing mechanism, a round cutter mechanism, a medium press roller mechanism, a cutting table mechanism which are arranged from the material feeding end to a material discharging end; a rear dough feeding mechanism is located on the conveyor belt, and the output end of the rear dough feeding mechanism is located at an input end of the second dough pressing mechanism; a dough rolling mechanism and a three circular cutter mechanism are at least arranged on the front dough feeding mechanism. According to the double-layer fried bread stick machine, imitating manual rolling of the fried bread stick dough can be achieved; through brushing oil and water alternately, the edges of the fried bread sticks can rise easily when fried, the middle connections are good and do not explode, so that two layers of fried bread sticks stick well together, and it is not possible to cause dough stickiness for the fried bread sticks; the rising effect is good, it is ensured that the yield of finished products is 100%, the appearance is beautiful, the prepared double layer fried bread sticks are fed into a frying pan mechanism automatically, and the degree of automation is higher.

The present invention provides an electronic part mounting method which enables joining of electrodes at a low temperature and within a short time, can obtain the high reliability and, further, enables joining at a fine pitch. In an electronic part mounting method which joins circuit electrodes which are formed over a circuit board and die electrodes which are formed over the electronic parts thus mounting the electronic parts on the circuit board, a low-melting-point metal layer is preliminarily formed over the circuit electrode and/or the die electrode and, thereafter, the circuit electrode and the die electrode are arranged to face each other and are heated and pressurized for melting low-melting-point metal thus diffusing the low-melting-point metal into the circuit electrode and the die electrode by solid-liquid diffusion.

The invention relates to a composition for increasing bone mineral density, a preparation agent containing the composition, and the preparation method of same. The composition comprises the following raw materials according to the weight portions: 0.5 to 35 portions of calcium carbonate, 0.5 to 30 portions of sulfuric acid dextrosamine, 0.05 to 2 portions of sulfuric acid chondroitin, 0.1 to 10 portions of collagen, and 0.08 to 5 portions of turmeric yellow extractive. In the composition, except a calsium supplement and a calcium absorbing promoting agent, the composition further comprises nutrients and anti-inflammatory mitigative, and can be used for preventing and treating osteoporotic symptom from multiply angles and ways.

The invention relates to an assembled steel-concrete combination structure bridge. At least two prefabricated combination beams are jointed in the width direction of the bridge; each combination beam includes a concrete prefabricated bridge face plate and a steel beam for supporting the concrete prefabricated bridge face plate; a top flange steel plate positioned under the concrete prefabricated bridge face plate is arranged above the steel beam; shearing connection members for integrally connecting the concrete prefabricated bridge face plate and the top flange steel plate together are welded onto the top flange steel plate; longitudinal rib plates are arranged on edges of the top flange steel plate at two sides of the combined beam; and two adjacent combined beams are connected together through two adjacent rib plates. The invention also provides a construction method which can form an assembled steel-concrete combination structure bridge by performing bolting and cast-in-place joint concrete on prefabricated single combined beams. The assembled steel-concrete combination structure bridge is rapid and simple in construction, can avoid on-site modeling, and can avoid the problems of large area concrete cast-in-place, maintenance difficulties, and construction fractures.

The invention relates to a device (15) for foaming milk by means of external suction equipment (35), used as an accessory for espresso machines or similar domestic appliances. Said device comprises a fixed part that can be connected to the steam supply conduit (1) of said machines and an easily interchangeable disposable part (26) containing all parts that come into contact with the milk. The invention is characterised in that components of the disposable parts and in some embodiments of the invention even the entire disposable part consist(s) of thin-walled plastic tubes of the drinking straw type, which can be produced in a cost-effective and environmentally friendly manner by extrusion and subsequent thermoplastic forming. The use of the inventive device obviates the need for the inconvenient cleaning of conventional foaming nozzles and eliminates hygiene problems.

The invention provides heat exchanger, method of manufacturing heat exchanger, liquid cooling system, light source device, projector, and electronic equipment.A method of manufacturing a heat exchanger having a plurality of fine flow channels includes forming a plurality of thin plate members into a predetermined shape, and laminating the plurality of thin plate members and bonding by diffusion bonding.

A modular apparatus for the realisation of horizontal or vertical tiling comprises three cooperating modules: a first rectilinear profile (1) with a U-shaped cross-section bordered by a bottom wall (10) and two borders (11) in symmetrically opposite position and capable of of elastic divarication, each border (11) being provided with an internal small longitudinal groove (lla) and with an external tooth (lib) connected with an inclied section (lie) directed towards the opening of the profile (1), which is additionally provided with suitable means for stable fixing on the wall or floor to be coated; a second rectilinear profile (2) with a T-shaped cross-section, proveded with two perpendicular wings (20, 21) the first wing (20) being adapted to be engaged between the two borders (11) of the first U-shaped profile (1) and provided with fixing means that cooperate with the internal grooves (Ha) provided on the borders (11); and a tile (3) with an irregular shape on the perimeter borders, being provided, from the external face (FE) to the internal face (FI), with a step (30) designed to receive approximately half of the second wing (21) of the second profile (2), a basically L-shaped tapering niche (31) designed to receive the external tooth (lib) provided on each border (11) of the first profile (1), and a deep cavity (32).

A method of manufacturing a semiconductor device capable of obtaining high joining force between a heat spreader and resin is provided. The method of manufacturing a semiconductor device according to the present invention includes: setting a heat spreader 60 on a face formed a plurality of apertures 22 in a cavity 21 of a first molding die 14; filling resin 20 into the cavity; setting a substrate 54 mounted with a semiconductor chip 50 a second molding die 12; and pressure-welding the first molding die 14 and the second molding die 12 so that the semiconductor chip is embedded in the resin 20, wherein a plurality of concave portion is formed on one face of the heat spreader 60, a plurality of convex portions is formed on the other face of the heat spreader 60, and the plurality of concave portions and the plurality of convex portions are overlapped in plan view.

Endovascular prostheses are disclosed that are configured to repair a native venous valve having improper or non-existent valve leaflet coaptation caused by vessel weakness and/or distention. The prostheses are configured to be implanted in the venous system immediately downstream of the malfunctioning valve and act as repair devices to restore proper function to the venous valve by reconfiguring and supporting the valve leaflets and thereby improving their coaptation.

Incompetency or regurgitation of a cardiac valve is treated by injecting a space occupying material or implanting a space occupying device within a papillary muscle or in heart tissue near a papillary muscle to cause lengthening or repositioning of the papillary muscle in a manner that improves coaptation of the valve leaflets and lessens valvular incompetency or regurgitation. The procedure may be performed by open thoracotomy, thoracoscopically, by a tran-endocardial catheter based approach or by a trans-coronary catheter based approach.