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Metal surface treatment method

A surface treatment, metal technology, applied in metal material coating process, pressure inorganic powder coating, coating and other directions

Inactive Publication Date: 2009-11-25
LTT BIO PHARMA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, surface treatment by thermal spraying is difficult to firmly bond metals such as molybdenum to the surface of the base metal

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0110] (1) Shot peening process

[0111] On the surface of pure copper or a copper alloy as a base metal 1, shot blasting is performed with dissimilar metal particles 2 composed of molybdenum disulfide. The average particle diameter of the dissimilar metal particles 2 was 10 μm, and the injection pressure of the shot blasting was 1 MPa. By this shot blasting, the dissimilar metal film 3 of molybdenum disulfide is formed on the surface of the base metal 1 .

[0112] (2) Electron beam irradiation process

[0113] The base metal 1 having the dissimilar metal film 3 of molybdenum disulfide on its surface is placed in the sealed chamber 11, the sealed chamber 11 is evacuated to form a vacuum, and the surface of the base metal 1 is irradiated with an electron beam 4. Conditions for electron beam irradiation were set as follows. The vacuum degree of the airtight chamber 11 is 7 Pa or less.

[0114] Electron beam spot diameter 0.3mm

[0115] Acceleration voltage 30kV

[0116] Be...

Embodiment 2

[0122] (1) Shot peening process

[0123] Shot peening is performed on the Ti surface of the base metal 1 with tungsten dissimilar metal particles 2 . The average particle diameter of tungsten as the dissimilar metal particles 2 was 20 μm, and the injection pressure of the shot blasting was 1 MPa. By this shot blasting, the dissimilar metal film 3 of tungsten is formed on the surface of the base metal 1 .

[0124] (2) Electron beam irradiation process

[0125] A base metal 1 having a tungsten dissimilar metal film 3 on its surface is placed in a sealed chamber 11, the sealed chamber 11 is evacuated to form a vacuum, and the surface of the base metal 1 is irradiated with an electron beam 4. Conditions for electron beam irradiation were set as follows. The vacuum degree of the airtight chamber 11 is 7 Pa or less.

[0126] Electron beam spot diameter 0.3mm

[0127] Acceleration voltage 30kV

[0128] Beam current 110mA

[0129] The scanning area of ​​the electron beam is 30m...

Embodiment 3

[0134] (1) Shot peening process

[0135] SKD-11 was used as the base metal 1, and shot blasting was performed with dissimilar metal particles 2 made of SiC. The average particle diameter of the dissimilar metal particles 2 was 3 μm, and the injection pressure of the shot peening was 1 MPa. By this shot blasting, the SiC dissimilar metal film 3 is formed on the surface of the base metal 1 .

[0136] (2) Electron beam irradiation process

[0137] A base metal 1 having a SiC dissimilar metal film 3 on its surface is placed in a sealed chamber 11 , the sealed chamber 11 is evacuated to form a vacuum, and the surface of the base metal 1 is irradiated with an electron beam 4 . Conditions for electron beam irradiation were set as follows. The vacuum degree of the airtight chamber 11 is 7 Pa or less.

[0138] Electron beam spot diameter 0.3mm

[0139] Acceleration voltage 30kV

[0140] Beam current 100mA

[0141] The scanning area of ​​the electron beam is 30mm×30mm

[0142] S...

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Abstract

To reliably bond various metals onto a surface of various parent metals in an alloyed state in a simple, easy and efficient manner. [MEANS FOR SOLVING PROBLEMS] A metal surface treatment method comprising a shot peening step of shot peening dissimilar metal particles (2), which are different from a parent metal (1), on the surface of the parent metal (1) to provide a dissimilar metal film (3) on the surface of the parent metal (1), and an electron beam irradiation step of applying electron beams (4) to the surface of the parent metal (1) with the dissimilar metal film (3) provided thereon by the shot peening step to bond the dissimilar metal film (3) and the parent metal (1).

Description

technical field [0001] The present invention relates to a method for treating the metal surface by bonding dissimilar metals to the surface of a parent metal. Background technique [0002] Metals are surface treated to bring their surface condition to the optimum condition for the purpose. For example, curing the surface or reducing the coefficient of friction to improve wear resistance, and then placing an insulating layer on the surface to insulate the metal surface. As surface treatment methods for metals, methods such as plating, thermal spraying, and carburizing have been developed. Since plating uses various chemicals, it has a disadvantage of troublesome disposal of waste liquid. In addition, in thermal spraying, since the metal powder is heated to a molten state and then blown onto the surface of the base metal, the apparatus is large and it is difficult to perform surface treatment easily. In addition, carburizing has the disadvantages that only specific elements...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C24/04C23C26/00
CPCC23C24/04C23C26/00
Inventor 泽口一男
Owner LTT BIO PHARMA
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