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Making method of pliable active component array base board

A technology of active components and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc. It can solve the problem that the flexible substrate is not easy to remove, so as to improve the process qualification rate and component characteristics, and avoid the accumulation of charges Effect

Active Publication Date: 2007-08-01
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The problem to be solved by the present invention is to provide a method for manufacturing a flexible active element array substrate to solve the problem that the flexible substrate is not easy to be removed from the hard substrate

Method used

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  • Making method of pliable active component array base board
  • Making method of pliable active component array base board
  • Making method of pliable active component array base board

Examples

Experimental program
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no. 1 example

[0038] 1A to 1C are the manufacturing process of the flexible active device array substrate according to the first embodiment of the present invention. First, please refer to FIG. 1A , the flexible substrate 120 is adhered to the rigid substrate 130 by using the adhesive layer 110 to form a substrate module 100 . Wherein, the adhesive layer 110 includes a colloid 112 and sacrificial particles 114 doped in the colloid 112 . In this embodiment, the sacrificial particles 114 include oxide particles, amorphous silicon particles or a combination thereof, and the size of the sacrificial particles 114 is, for example, 0.01 μm to 10 μm. In addition, the flexible substrate 120 is, for example, a plastic substrate, and the rigid substrate 130 is, for example, a glass substrate.

[0039] Next, referring to FIG. 1B , an active device array process is performed on the flexible substrate 120 adhered to the rigid substrate 130 . Wherein, the active element array process includes an amorpho...

no. 2 example

[0043]2A to 2C illustrate the manufacturing process of the flexible active device array substrate according to the second embodiment of the present invention. The manufacturing process of the flexible active device array substrate of this embodiment is similar to that described in the first embodiment. According to the process shown in FIG. 2A to FIG. 2C, the flexible substrate 220 is first adhered to the rigid substrate 230 by using the adhesive layer 210 to form the substrate module 200, and then the flexible substrate 220 adhered to the rigid substrate 230 Perform active element array process. Then, a light source is used to irradiate the adhesive layer 210 , and then the flexible substrate 220 is separated from the rigid substrate 230 .

[0044] The difference between the two is that in this embodiment, the adhesive layer 210 includes a colloid 212 and a sacrificial pattern layer 214 (as shown in FIG. 2A ). Wherein, the material of the sacrificial pattern layer 214 is, f...

no. 3 example

[0049] 3A to 3C illustrate the manufacturing process of the flexible active device array substrate according to the third embodiment of the present invention. The manufacturing process of the flexible active device array substrate of this embodiment is substantially the same as that described in the first embodiment and the second embodiment. The difference is that in this embodiment, the adhesive layer 310 includes a colloid 312 and conductive particles 314 doped in the colloid 312 (as shown in FIG. 3A ). The conductive particles 314 include oxide particles, amorphous silicon particles, or metal particles. Wherein, the material of the metal particles is, for example, gold, silver, copper, titanium oxide or a combination thereof. In addition, the particle size of the conductive particles 314 is, for example, 0.01 μm to 10 μm.

[0050] In the substrate module 300 , the conductive particles 314 are similar to the sacrificial pattern layer 214 of the second embodiment, and both...

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Abstract

The invention discloses a manufacturing method of pliability initiative elements array base plate. The method includes steps as following. Firstly, the pliability base plate is conglutinated to horniness base plate to form a base plate module with adhesion layer. In the base plate module, adhesion layer includes colloid and at least one victim. Then, the pliability base plate which is conglutinated to horniness base plate is preceded with an initiative elements array craftwork. Then the light source is emitted to the adhesion layer. The pliability base plate and the horniness base plate are separated. Said manufacturing method can make pliability base plate which is after the initiative elements array craftwork separated with the horniness base plate easily, and improve the percent of pass of production of the pliability initiative elements array base plate.

Description

technical field [0001] The invention relates to a manufacturing method of a substrate module and an active element array substrate, and in particular relates to a manufacturing method of a substrate module and a flexible (flexible) active element array substrate. Background technique [0002] Nowadays, it has become a development trend of displays to replace rigid substrates with flexible substrates. Whether a flat panel display is flexible or not depends on the substrate material used. When the substrate used in the flat-panel display is a rigid substrate, the flat-panel display will not be flexible. On the contrary, when the substrate used in the flat-panel display is a flexible substrate (such as a plastic substrate), the flat-panel display has good flexibility. At present, the technology of manufacturing thin film transistors on rigid substrates has gradually matured, but the technology of manufacturing thin film transistors on flexible substrates still needs to be dev...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/84
Inventor 黄俊杰林惠芬方国龙林汉涂蔡佳琪
Owner AU OPTRONICS CORP
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