Thermoelectric generation module

Abstract

Disclosed is a thermoelectric generation module which can withstand prolonged use in high-temperature environments such as those where the temperature (Th) of the high temperature section exceeds 250 DEG C. The disclosed thermoelectric generation module includes: a thermoelectric generation element (20); first diffusion barrier layers (71) which are disposed on the surface of the thermoelectric generation element (20) and which comprise molybdenum (Mo); second diffusion barrier layers (73) which are disposed on the surface on the opposite side of the first diffusion barrier layers (71) to the thermoelectric generation element (20) and which comprise a nickel-tin (Ni-Sn) intermetallic compound; electrodes (40); ; third diffusion barrier layers (42) which are disposed on the surface of the electrodes (40) and which comprise a nickel-tin (Ni-Sn) intermetallic compound, and solder layers (80) which connect the second diffusion barrier layers (73) and the third diffusion barrier layers (42) and which contain at least 85% lead (Pb).

Description

technical field [0001] The present invention relates to a thermoelectric power generation module that uses a temperature difference to generate power by using a thermoelectric power generation element. Background technique [0002] Conventionally, thermoelectric power generation is known in which a thermoelectric power generation element is arranged between a high-temperature side heat exchanger and a low-temperature side heat exchanger to generate power. A thermoelectric power generation element is a member that applies a thermoelectric effect called "Seebeck effect". When a semiconductor material is used as the thermoelectric material, a thermoelectric power generation module is constituted by combining a thermoelectric power generation element formed of a P-type thermoelectric material and a thermoelectric power generation element formed of an N-type thermoelectric material. Such a thermoelectric power generation module is not only simple in structure and easy to operate...

AI Technical Summary

Problems solved by technology

[0011] However, in a high-temperature environment where the temperature of the high-temperature portion exceeds 250° C., when nickel is used as a diffusion prevention layer that prevents solder from diffusing into the thermoelectric element, nickel diffuses and segregates into the solder layer conversely, causing the joint The resistance value of the interface increases, or the copper of the electrode diffuses into the thermoelectric element through the solder layer, which increases the resistance value of the thermoelectric element, thereby causing a problem that the output power of the thermoelectric module decreases under long-term use of 1000 to 2000 hours.

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