42results about How to "Fast developing speed" patented technology

The invention discloses a developing device and photoetching equipment. The developing device comprises developing chambers, wherein the developing chambers are used for accommodating to-be-developed substrates; the developing device further comprises a heating mechanism; the heating mechanism comprises a plurality of heating pieces, and the plurality of heating pieces are arranged in the developing chambers, are used for heating different developing positions of the substrates, located above or below the heating mechanism, in the developing chambers and can independently control heating respectively.

The invention discloses a method for developing and exposing a circuit pattern of a PCB, comprising the following steps: (1) preparing film; (2) aligning exposure; (3) developing; (4) cleaning and drying. The beneficial effect of the present invention: in the exposure process, the exposure energy test is carried out first, the exposure time is determined, the exposure degree is guaranteed, and the exposure is carried out in a vacuum, the film and the PCB board are fully bonded, and the exposure effect is guaranteed; the developing process of the present invention , Strictly control the development parameters to ensure the development effect, and use spray development to speed up the development speed, then pressure water washing and hot air drying to ensure the cleaning and drying speed of PCB boards, which is very suitable for assembly line production.

The invention discloses photo-cured printing ink for a gold-plating resistant potion and application of the photo-cured printing ink, belonging to the technical field of a printed circuit board. The photo-cured printing ink is prepared from the following components in parts by weight: 5 to 25 parts of (methyl) acrylic copolymer resin, 5 to 25 parts of esterified styrene-maleic anhydride copolymer resin, 5 to 25 parts of polymeric monomers, 0.5 to 8 parts of photoinitiator, 5 to 40 parts of fillers and 30 to 70 parts of solvent, wherein the (methyl) acrylic copolymer resin is obtained by means of copolymerizing ethylene-series unsaturated monomers and / or propylene-series unsaturated monomers with methyl acrylic acid. The photo-cured printing ink disclosed by the invention has the advantages that the effects of excellent resolution, excellent adhesive force, excellent hardness, excellent gold-plating potion resistance and excellent film stripping performance are achieved, and the photo-cured printing ink is suitably used for selectively covering a PCB (printed circuit board) in a PCB gold-plating technology, especially suitable for producing a high-precision PCB with a smaller welding spot pitch.

The invention discloses a low-foaming high-adhesion photosensitive dry film resist. The photosensitive dry film resist mainly consists of 45-75wt% alkali-soluble copolymer resin with a weight-average molecular weight of 50,000-150,000, 15-45wt% % ethylenic photopolymerizable unsaturated monomer and 0.5-10wt% photopolymerization initiator, wherein, the ethylenic photopolymerizable unsaturated monomer consists of acrylate compounds and molecules containing phosphorylcholine structure It is composed of a mixture of compounds containing vinyl unsaturated bonds in the structure; the photosensitive dry film resist prepared by the present invention has low foaming and high adhesion performance, effectively avoiding the risk of developing solution overflow during the development process and the risk of seeping, plating, and plating during the electroplating process. The phenomenon of short circuit greatly improves the production efficiency and yield of circuit boards.

The invention discloses a developing device and photoetching equipment. The developing device comprises developing chambers, wherein the developing chambers are used for accommodating to-be-developed substrates; the developing device further comprises a heating mechanism; the heating mechanism comprises a plurality of heating pieces, and the plurality of heating pieces are arranged in the developing chambers, are used for heating different developing positions of the substrates, located above or below the heating mechanism, in the developing chambers and can independently control heating respectively.