42results about How to "Fast developing speed" patented technology

The invention discloses a developing device and photoetching equipment. The developing device comprises developing chambers, wherein the developing chambers are used for accommodating to-be-developed substrates; the developing device further comprises a heating mechanism; the heating mechanism comprises a plurality of heating pieces, and the plurality of heating pieces are arranged in the developing chambers, are used for heating different developing positions of the substrates, located above or below the heating mechanism, in the developing chambers and can independently control heating respectively.

The invention discloses a light-curing ink and a PCB board, belonging to the technical field of printed circuit boards. The light-curable ink comprises the following components in parts by weight: 15-35 parts of carboxylated modified epoxy acrylate resin, 1-10 parts of (meth)acrylic copolymer resin, 2-10 parts of polymerized monomer, and photoinitiator 1 to 8 parts, 20 to 40 parts of inorganic non-metallic fillers, and 30 to 60 parts of solvent; carboxylated modified epoxy acrylate resin is obtained by ring-opening reaction of (meth)acrylic acid and epoxy resin to obtain epoxy acrylate. Oxyacrylate is then obtained by ring-opening reaction with acid anhydride; (meth)acrylic copolymer resin is obtained by copolymerizing ethylenically unsaturated monomer and / or propylene unsaturated monomer with (meth)acrylic acid. The light-curable ink has the advantages of good resolution, good film stickiness, good hardness, good stacking performance, good alkali etching resistance, etc. It is suitable for the production of PCB inner layer circuit boards, especially for small line widths High-precision PCB inner layer circuit board production.

The invention discloses a method for developing and exposing a circuit pattern of a PCB, comprising the following steps: (1) preparing film; (2) aligning exposure; (3) developing; (4) cleaning and drying. The beneficial effect of the present invention: in the exposure process, the exposure energy test is carried out first, the exposure time is determined, the exposure degree is guaranteed, and the exposure is carried out in a vacuum, the film and the PCB board are fully bonded, and the exposure effect is guaranteed; the developing process of the present invention , Strictly control the development parameters to ensure the development effect, and use spray development to speed up the development speed, then pressure water washing and hot air drying to ensure the cleaning and drying speed of PCB boards, which is very suitable for assembly line production.

The present invention provides a colored photosensitive resin composition, a color filter, and a display device. The colored photosensitive resin composition is characterized by containing a colorant, an alkali-soluble resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent. The alkali-soluble resin is a resin containing structural units represented by chemical formulas 1 and 2, a weight average molecular weight of 25,000 to 35,000, and an acid value of 50 to 100 mgKOH / g, and the photopolymerization initiator contains 60 to 95 mgKOH / g relative to the total weight of the photopolymerization initiator. % by weight of the compound represented by Chemical Formula 3. In Chemical Formula 1, R1 is each independently hydrogen or an alkyl group with 1 to 5 carbon atoms; in Chemical Formula 2, R1 is hydrogen or an alkyl group with 1 to 5 carbon atoms, and R2 is each independently hydrogen or an alkyl group with 1 to 5 carbon atoms. ~5 alkyl groups; in chemical formula 3, R3 is C1-C12 alkyl, aryl or aralkyl, and R4 is C1-C12 alkyl or aryl.

The invention discloses photo-cured printing ink for a gold-plating resistant potion and application of the photo-cured printing ink, belonging to the technical field of a printed circuit board. The photo-cured printing ink is prepared from the following components in parts by weight: 5 to 25 parts of (methyl) acrylic copolymer resin, 5 to 25 parts of esterified styrene-maleic anhydride copolymer resin, 5 to 25 parts of polymeric monomers, 0.5 to 8 parts of photoinitiator, 5 to 40 parts of fillers and 30 to 70 parts of solvent, wherein the (methyl) acrylic copolymer resin is obtained by means of copolymerizing ethylene-series unsaturated monomers and / or propylene-series unsaturated monomers with methyl acrylic acid. The photo-cured printing ink disclosed by the invention has the advantages that the effects of excellent resolution, excellent adhesive force, excellent hardness, excellent gold-plating potion resistance and excellent film stripping performance are achieved, and the photo-cured printing ink is suitably used for selectively covering a PCB (printed circuit board) in a PCB gold-plating technology, especially suitable for producing a high-precision PCB with a smaller welding spot pitch.

The invention discloses a light sensitization composition using a sulfonyl hydrazone compound. The composition comprises a dissolving resistant / dissolving promotion agent, an alkali soluble line type phenolic resin, an infrared absorption dye, a background dye and a solvent, wherein the dissolving resistant / dissolving promotion agent is a cyclohexanone sulfonyl hydrazone compound. The sulfonyl hydrazone compound provided by the invention is added into the light sensitization composition and can be quickly subjected to chemolysis to generate N2 for foaming only when the temperature of a scanning area is higher than 170 DEG C. In the decomposition foaming process, the membranous layer of the scanning area is loosened and is easy to develop, and most of small segments remained on the membranous layer after the decomposition are acidic materials of different types, so that an obvious dissolving promotion effect is generated during alkali development, and the composition has high thermal stability and long service life. Therefore, the cyclohexanone sulfonyl hydrazone compound is used as the dissolving resistant / dissolving promotion agent of the light sensitization composition, so that a thermosensitive computer to plate (CTP) board with high sensitivity and high development speed can be obtained.

The invention discloses a low-foaming high-adhesion photosensitive dry film resist. The photosensitive dry film resist mainly consists of 45-75wt% alkali-soluble copolymer resin with a weight-average molecular weight of 50,000-150,000, 15-45wt% % ethylenic photopolymerizable unsaturated monomer and 0.5-10wt% photopolymerization initiator, wherein, the ethylenic photopolymerizable unsaturated monomer consists of acrylate compounds and molecules containing phosphorylcholine structure It is composed of a mixture of compounds containing vinyl unsaturated bonds in the structure; the photosensitive dry film resist prepared by the present invention has low foaming and high adhesion performance, effectively avoiding the risk of developing solution overflow during the development process and the risk of seeping, plating, and plating during the electroplating process. The phenomenon of short circuit greatly improves the production efficiency and yield of circuit boards.

The present invention provides a colored photosensitive resin composition containing an alkali-soluble resin, a photopolymerizable compound, and a photopolymerization initiator, a color filter formed using the same, and an image display device including the color filter. , a colorant and a solvent, the above-mentioned alkali-soluble resin includes an alkali-soluble resin polymerized by N-benzylmaleimide, and the above-mentioned photopolymerization initiator includes an oxime ester fluorene-based photopolymerization initiator of a specific structure. The colored photosensitive resin composition of the present invention has a fast developing speed, is excellent in adhesion, sensitivity, and reliability, and can minimize outgassing.

The invention discloses a developing device and photoetching equipment. The developing device comprises developing chambers, wherein the developing chambers are used for accommodating to-be-developed substrates; the developing device further comprises a heating mechanism; the heating mechanism comprises a plurality of heating pieces, and the plurality of heating pieces are arranged in the developing chambers, are used for heating different developing positions of the substrates, located above or below the heating mechanism, in the developing chambers and can independently control heating respectively.