Developer for positive thermosensitive CTP (Computer to Plate)
A developer and heat-sensitive technology, which is applied in the field of computer-to-plate developer preparation, can solve problems such as reduction, developer instability, and reduced development efficiency, and achieve fast development speed, good dot reduction, and excellent fatigue resistance Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0022] Prepare positive thermal CTP plate developer according to the following weight ratio:
[0023] 1.75 parts tap water;
[0024] 2.14 parts of potassium metasilicate, modulus 2.0, pH value 13;
[0025] 3.1 part of sodium butylnaphthalene sulfonate, 1 part of polyoxyethylene amine, and 1 part of nonionic fluorocarbon surfactant;
[0026] 4.1 part of Swire oil, 1 part of OP-10, 1 part of AEP, 1 part of OEP-70, 1 part of JFC;
[0027] 5.1 parts sodium gluconate.
Embodiment 2
[0029] Prepare positive thermal CTP plate developer according to the following weight ratio:
[0030] 1.78 parts of tap water;
[0031] 2.12 parts of potassium metasilicate, modulus 1.8, pH value 14;
[0032] 3.1 part of sodium isopropyl naphthalene sulfonate, 1 part of sodium dodecylbenzene sulfonate, and 1 part of ethylene oxide adduct of polypropylene glycol;
[0033] 4.1 parts Taikoo oil;
[0034] 5.2 parts of disodium edetate, 2 parts of propylene glycol.
Embodiment 3
[0036] Prepare positive thermal CTP plate developer according to the following weight ratio:
[0037] 1.80 parts deionized water;
[0038] 2.14 parts of sodium metasilicate, modulus 1.0, pH value 13.5;
[0039] 3.2 parts of pulling powder;
[0040] 4.2 copies of OP-10;
PUM
Property | Measurement | Unit |
---|---|---|
modulus | aaaaa | aaaaa |
modulus | aaaaa | aaaaa |
modulus | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com