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PCB circuitous pattern development exposure method

A PCB board and circuit graphics technology, applied in the field of development and exposure of PCB circuit graphics, can solve the problems of jagged edges of PCB board lines, unclean development, excessive development of PCB boards, etc., to ensure the development effect, speed up the development speed, and ensure Effect of washing and drying speed

Active Publication Date: 2013-12-18
SICHUAN HAIYING ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the shortcomings and deficiencies of the above-mentioned prior art, and provide a method for developing and exposing PCB circuit patterns, which solves the problem of insufficient exposure control in the existing technology, resulting in jagged defects at the edge of the PCB circuit; and The various parameters in the development process are not well grasped, resulting in defects such as excessive development of the PCB board and unclean development

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The method for developing and exposing PCB circuit patterns comprises the following steps:

[0034] (1) Prepare the film that matches the PCB board;

[0035] (2) Align and stick the PCB board to the film, and then perform the exposure process;

[0036] (3) After the exposed PCB board is placed for 10 minutes, it enters the next process;

[0037] (4) Use the spray head to spray the developing solution onto the PCB board for development, that is, wash away the parts on the PCB board that are covered by the film during exposure, and the ink will fall off to show the same circuit pattern as the film. The developer is 0.8% concentration of Na 2 co 3 , the temperature of the developer is 25°C, and the spray pressure is 1.2Kg / Cm 2 , developing time is 1min;

[0038] (5) Wash the developed PCB board with water and then dry it.

[0039] Further, the above step (2) is mainly the alignment of the PCB board and the film and the exposure of the PCB board, which specifically in...

Embodiment 2

[0054] The method for developing and exposing PCB circuit patterns comprises the following steps:

[0055] (1) Prepare the film that matches the PCB board;

[0056] (2) Align and stick the PCB board to the film, and then perform the exposure process;

[0057] (3) After the exposed PCB board is placed for 15 minutes, it enters the next process;

[0058] (4) Use the spray head to spray the developing solution onto the PCB board for development, that is, wash away the parts on the PCB board that are covered by the film during exposure, and the ink will fall off to show the same circuit pattern as the film. The developer is 1.2% concentration of Na 2 co 3 , the temperature of the developer is 32°C, and the spray pressure is 2.5Kg / Cm 2 , developing time is 2min;

[0059] (5) Wash the developed PCB board with water and then dry it.

[0060] Further, the above step (2) is mainly the alignment of the PCB board and the film and the exposure of the PCB board, which specifically in...

Embodiment 3

[0075] The method for developing and exposing PCB circuit patterns comprises the following steps:

[0076] (1) Prepare the film that matches the PCB board;

[0077] (2) Align and stick the PCB board to the film, and then perform the exposure process;

[0078] (3) After the exposed PCB board is placed for 12 minutes, it enters the next process;

[0079] (4) Use the spray head to spray the developing solution onto the PCB board for development, that is, wash away the parts on the PCB board that are covered by the film during exposure, and the ink will fall off to show the same circuit pattern as the film. The developer is 1.0% concentration of Na 2 co 3 , the temperature of the developer is 30°C, and the spray pressure is 2.0Kg / Cm 2 , developing time is 1.5min;

[0080] (5) Wash the developed PCB board with water and then dry it.

[0081] Further, the above step (2) is mainly the alignment of the PCB board and the film and the exposure of the PCB board, which specifically ...

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PUM

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Abstract

The invention discloses a PCB circuitous pattern development exposure method which comprises the following steps: (1) preparing a film, (2) conducting counterpoint exposure, (3) conducting development and (4) conducting cleaning and drying. The PCB circuitous pattern development exposure method has the advantages that in the exposure process, an exposure energy test is firstly carried out, the exposure time is determined, the exposure level is ensured, the exposure is carried out in vacuum, the film is completely attached to a PCB, and the exposure effect is ensured; in the development process, development parameters are strictly controlled, the development effect is ensured, meanwhile, the spraying development is adopted, the development speed is accelerated, then, the pressure washing and hot-blast air drying are carried out, the PCB cleaning speed and drying speed are ensured, and the PCB circuitous pattern development exposure method is quite suitable for flow line production.

Description

technical field [0001] The invention relates to a method for developing and exposing circuit patterns on a PCB board. Background technique [0002] PCB board, also known as printed circuit board, printed circuit board, or printed board for short, uses an insulating board as the base material, cuts to a certain size, has at least one conductive pattern attached to it, and has holes (such as component holes, fastening holes, metallized holes, etc.), and realize the interconnection between electronic components. Since such boards are made using electronic printing, they are called "printed" circuit boards. [0003] The exposure and development of PCB boards are important steps in the production process of PCB boards. Exposure means that the PCB board is exposed to the circuit diagram part under the cover of the film base plate. After exposure, this part undergoes polymerization reaction, and then in the development process, The unexposed part can be washed off with a develope...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06G03F7/00G03F7/20G03F7/30
Inventor 石学权
Owner SICHUAN HAIYING ELECTRONICS TECH
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