97results about How to "Avoid thermal shock" patented technology

A nozzle for discharging first and second fluids in a spray pattern into a vessel, such as oil and steam in a catalytic cracking unit, includes various configurations for preventing erosion of the outlet portion of the nozzle that otherwise might be due, for example, to contact with a catalyst or other predetermined substance. In one such nozzle, the exterior surface of the outlet portion substantially conforms to the internal contour of the vessel. In another such nozzle, the outlet portion defines a plurality of substantially concentric, substantially elliptical-shaped outlet apertures. In another nozzle, the outlet portion is formed of ceramic and is connected to the inlet portion by a metal connector. In another nozzle, the outlet portion defines a plurality of apertures angularly spaced about a peripheral region of the outlet portion for discharging a substantially flat fan spray pattern, and a second outlet portion extending along an upstream portion of the outlet portion for discharging at least part of its spray to prevent any catalyst from contactin the downstream surfaces of the outlet ortion.

The invention relates to a method for making electric conduction patterns on a metal-foil-clad insulating substrate. The method comprises the steps that insulating envelope grooves are machined in the periphery of a conducting layer which needs to be reserved, and machining is conducted twice or more when excessively narrow isolated wires are encountered; a conducting layer which needs to be removed is subdivided into a plurality of strip-shaped heat-insulating small blocks, wherein one end of each small block is narrowed, the other end of each small block is widened, and the narrowed end of one metal foil layer small block and the widened end of another metal foil layer small block adjacent to the metal foil layer small block are arranged in a corresponding mode; next, laser beams are projected onto the heat-insulating small blocks obtained after subdivision, so that the small blocks are separated from the substrate material and removed. According to the method for making the electric conduction patterns on the metal foil-clad insulating substrate, by means of adjusting the projection parameters, a projection path and the projection environment of a laser, the conducting layer on the substrate material is removed, a predetermined electric conduction structure is formed, corresponding technological processes adopted for manufacturing the electric conduction structure through a chemical method, a physical method and a laser method in the prior art are replaced, the laser is directly used for forming and making the electric conduction patterns, as a result, multiple devices and materials are omitted, environmental friendliness is achieved, the process is short, the technology is simple and easy to implement, and the method is suitable for manufacturing multiple types of circuit board samples with higher accuracy in a small-batch mode and general circuit boards.

The invention relates to a method for selectively removing a conductive layer on a baseplate material. The method comprises the following steps: processing to manufacture an insulated enveloping channel on the periphery of a to-be-reserved conductive layer, wherein an isolated wire with over-narrow width is processed twice or more than twice; subdividing a to-be-removed conductive layer into a plurality of insulated small blocks, wherein the adjacent insulated small blocks are of complementary shapes such as inverted quadrangle, trapezoid or triangle; projecting electromagnetic waves onto the subdivided insulated small blocks so as to ensure that the subdivided insulated small blocks are separated from the baseplate material to be removed, wherein during heating, the projected laser moves from the narrower end of each small block of the conductive layer to the wider end of each small block. According to the method, the projecting parameter, projecting path and projecting environment of the laser are regulated and the conductive layer on the substrate material is removed, so that a preset conductive structure is formed, and the method can be used for replacing a corresponding technical process adopted in the process of manufacturing a conductive structure by virtue of an existing chemical method, an existing physical method and an existing laser method.