9710 results about "Bis epoxide" patented technology

Polyesters comprising the reaction product of a polyol and a bis-epoxy reacted with a mono- and / or di-phenolic carboxylic acid and / or ester are disclosed. Food cans coated at least in part on the interior with a composition comprising these polyesters are also disclosed. The composition used on the food cans is substantially free of BPA and BPF and substantially free of BADGE and BFDGE. Food cans coated at least in part on the interior with a composition comprising a polyester having a loss of molecular weight of less than 50% in an acidic medium are also disclosed.

The invention relates to a water epoxy ground floor coating and its making method and constructing process, where one component is low-molecular weight liquid-state epoxy resin assorted with active diluter in a proper proportion, and the other component is a dispersoid with hydrophilic curing agent as the principal thing, containing water-borne curing agent, water, acid-resistant wearable color filler, various auxiliaries, etc. and its producing method is simple and mainly includes mechanical dispersing and mixing; it does need to clean paint-covered surface as used on humid basal surface; the paint film has excellent properties of oily products and unilateral permeability. It uses water as dispersing medium, has no VOC, safe and environmental-protection.

The present invention relates to a new industrial process for the synthesis of solvate- free 17a-acetoxy-11ss-[4-(N,N-dimethyl-amino)-phenyl]-19-norpregna-4,9-diene-3,20-dione [CDB -2914] of formula (I) which is a strong antiprogestogene and antiglucocorticoid agent. The invention also relates to compounds of formula (VII) and (VIII) used as intermediates in the process. The process according to the invention is the following: i) 3-(ethylene-dioxy)-estra-5(10),9(11)-diene-17-one of formula (X) is reacted with potassium acetilyde formed in situ in dry tetrahydrofuran by known method, ii) the obtained 3-(ethylene-dioxy)-17a-ethynyl-17ss-hydroxy-estra-5(10),9(11)-diene of formula (IX) is reacted with phenylsulfenyl chloride in dichloromethane in the presence of triethylamine and acetic acid, iii) the obtained isomeric mixture of 3-(ethylene-dioxy)-21-(phenyl-sulfinyl)-19-norpregna-5(10),9(11),17(20),20-tetraene of formula (VIII) is reacted first with sodium methoxide in methanol, then with trimethyl phosphite, iv) the obtained 3-(ethylene-dioxy)-17a-hydroxy-20-methoxy-19-norpregna-5(10),9(11),20-triene of formula (VII) is reacted with hydrogen chloride in methanol, then v) the obtained 3-(ethylene-dioxy)-17a-hydroxy-19-norpregna-5(10),9(11l); -diene-20- one of formula (VI) is reacted with ethylene glycol hi dichloromethane in the presence of trimethyl orthoformate and p-toluenesulfonic acid by known method, vi) the obtained 3,3,20,20-bis(ethylene-dioxy)-17a-hydroxy-19-norpregna- 5(10),9(11)-diene of formula (V) is reacted with hydrogen peroxide in a mixture of pyridine and dichloromethane in the presence of hexachloroacetone by known method, vii) the obtained 3,3,20,20-bis(ethylene-dioxy)-17a-hydroxy-5,10-epoxy-19-norpregn-9(11)-ene of formula (IV), containing approximately a 1:1 mixture of 5a,10a- and 5ss,10ss-epoxides, is isolated from the solution and reacted with a Grignard reagent obtained from 4-bromo-N,N-dimethyl-aniline in tetrahydrofuran.

Polyether polyols with an OH number of from 15 to 120 mg of KOH / g are produced by (i) introducing a mixture of DMC catalyst and a poly(oxyalkylene)polyol or a mixture of DMC catalyst and a polyether polyol (“heel”) obtainable by the process according to the invention is initially into a reactor and (ii) continuously introducing one (or more) low molecular weight starter compound(s) with a (mixed) hydroxyl functionality of from 2.2 to 6.0 and a mixture composed of a) 73 to 80 parts by weight (per 100 parts by weight of a) plus b)) of ethylene oxide and b) 27 to 20 parts by weight (per 100 parts by weight of a) plus b)) of at least one substituted alkylene oxide corresponding to a specified formula into the mixture from step (i). These polyether polyols are particularly useful for the production of flexible polyurethane foams.

Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a liquid state at a temperature of 20° C.; (B) an aromatic epoxy resin having 3 or more epoxy groups in one molecule and an epoxy equivalent of 200 or less; (C) a phenol type curing agent; (D) one or more resins selected from the group consisting of a phenoxy resin, a polyvinyl acetal resin, a polyamide resin, a polyamideimide resin, and mixtures thereof, and having a glass transition temperature of 100° C. or more; and (E) an inorganic filler, wherein: the inorganic filler (E) is present in an amount of 35% by weight or more based on the total weight of the non-volatile components of the resin composition; the epoxy resin (A) and the aromatic epoxy resin (B) are present in a weight ration of from 1:0.3 to 1:2 by weight of epoxy resin (A) to aromatic epoxy resin (B); the epoxy resin (A), the aromatic epoxy resin (B), and the phenol type curing agent (C) are present in relative amounts such that the weight ratio of epoxy groups in the resin composition and phenolic hydroxyl groups in the phenol type curing agent (C) is from 1:0.5 to 1:1.5; and the resin (D) is present in an amount of from 2 to 20% by weight based on the total weight of the non-volatile components of the resin composition. Such resin compositions are useful for interlayer insulation of a multilayer printed wiring board and are capable of forming an insulating layer which has a low thermal expansion coefficient and exhibits excellent peel strength for a conductor layer. Such resin compositions are also useful for preparing adhesive films and prepregs for a multilayer printed wiring boards, as well as multilayer printed wiring boards having an insulating layer formed of a cured product of the resin composition or the prepreg.

A curable organopolysiloxane composition comprising: (A) an organopolysiloxane that contains in one molecule at least two alkenyl groups and at least 30 mole % of all silicon-bonded monovalent hydrocarbon groups in the form of aryl groups: (B) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms and at least 15 mole % of all silicon-bonded organic groups in the form of aryl groups; (C) a branched-chain organopolysiloxane that contains alkenyl, aryl, and epoxy-containing organic groups; and (D) a hydrosilylation catalyst. The composition is capable of forming a cured body that has a high index of refraction and strong adhesion to substrates.

The nano composite water-base epoxy resin coating material comprises: epoxy constituent composed of epoxy resin, active diluent, nano SiO2 particle, and silane coupling agent; and water-base amic curing agent constituent composed of water-base amic curing agent, wet dispersant, defamer, paint, filler, film-forming adjuvant, thickener, and water. This invention also discloses opposite preparation method, improves greatly product properties, and has no pollution.