111 results about "Beryllium-Copper Alloy" patented technology

Provided is a copper or copper alloy target/copper alloy backing plate assembly in which the anti-eddy current characteristics and other characteristics required in a magnetron sputtering target are simultaneously pursued in a well balanced manner. This copper or copper alloy target/copper alloy backing plate assembly is used for magnetron sputtering, and the copper alloy backing plate is formed from low beryllium copper alloy or Cu—Ni—Si-based alloy. Further, with this copper or copper alloy target/copper alloy backing plate assembly, the copper alloy backing plate has electrical conductivity of 35 to 60% (IACS), and 0.2% proof stress of 400 to 850 MPa.

The invention discloses a beryllium copper alloy, a copper bush for amorphous and/or nano crystal strip production equipment and a preparation method. The copper contains the following elements in percentage by mass: 0.25 to 2.1 percent of Be, and 0.1 to 2.0 percent of Co. By adding the elements such as Co and the like into the beryllium copper alloy, the advantage of interaction of the alloy elements is exerted; and the smelted alloy is cast into a cast ingot or a cast blank, and the cast blank is subjected to the processes of hot forging, heat preservation, ageing treatment and the like to prepare the beryllium copper alloy with high strength and high thermal conductivity and in accordance with the copper bush for the amorphous or nano crystal strip production equipment. When the beryllium copper bush is applied in the strip production link, the appearance quality and the actual performance of amorphous or nano crystal strips can be effectively promoted.

The invention relates to low-beryllium elastic copper alloy and a preparation and manufacture method thereof. The low-beryllium elastic copper alloy comprises by mass: 0.2-0.4% of Be, 1.3-2.6 % of Ni and the balance Cu, wherein the mass ratio of the Ni to the Be in the beryllium copper alloy is larger than or equal to 5.5 and smaller than or equal to 6.5. The alloy can further contain Cr and Zr. The preparation method of the low-beryllium elastic copper alloy comprises alloy component design, casting, hot rolling, solution treatment, rolling deformation and ageing treatment. The alloy is low in Be content (smaller than 0.5%) and can effectively save metal beryllium, the tensile strength of the alloy after deformation ageing treatment can reach 968MPa, conductivity is larger than 55% according to the international annealed copper standard (IACS), and the rate of resistance to stress relaxation is larger than 85%. Therefore, the low-beryllium elastic copper alloy can serve as a conductive elastic material which has high elasticity, high strength and excellent resistance to stress relaxation, can be applied to electrical contact components, connectors, relays and the like, and has wide application prospects.

The invention relates to a low-beryllium copper alloy metallographic corrosive agent and a display method of metallographic structure of low-beryllium copper alloy. The method comprises the following steps of: orderly burnishing a low-beryllium copper alloy sample with 180-mesh, 400-mesh, 800-mesh and 1500-mesh silicon carbide waterproof abrasive papers or aluminum oxide waterproof abrasive paper by virtue of using water as a wetting agent, then, polishing the alloy with aluminum oxide polishing solutions of different particle sizes, finally, performing corrosion treatment by using one or any combination of three types of low-beryllium copper alloy metallographic corrosive agents prepared by the invention, and further washing and observing the sample. According to the invention, with the prepared corrosive agent effective to the metallographic structure of the low-beryllium copper alloy, the metallographic structure of the low-beryllium copper alloy can be displayed clearly, so that inspection on the low-beryllium copper alloy is realized. The technology is simple, and is simple and convenient to operate.

The invention discloses a connector and a contact component thereof. The front contact member of the contact component is assembled in a front sleeve by adopting an insulator spacing and fixing mode, and the rear contact member is fixed in a rear sleeve in a spacing way by adopting a glass sintering sealing mode. Meanwhile, butt plugging of the front contact member and the contact member of another connector is realized, and conductive connection of a rear insulator and a conductive wire is realized so that a beryllium copper alloy or a tin bronze alloy can be adopted to act as the front contact member. Metal material suitable for glass sintering sealing is adopted to act as the rear contact member and the rear sleeve so that flowing and burning-resistant capacity of the plugging contact part of the contact members in the plugging process of the plug and the socket of the whole contact component can be guaranteed by the front contact member, and sealing performance between the contact members and the fixing sleeves of the contact component can be enhanced by glass sintering sealing as for the rear contact member. Therefore, sealing performance between the contact members and the fixing sleeves can be enhanced in the contact component under the premise of guaranteeing basic plugging and flowing performance.

A technology for manufacturing the beryllium-copper pipe includes such steps as providing a beryllium-copper alloy ingot prepared from Be, P and Cu and with 50-90 mm for diameter, 30-50 mm for internal hole diameter and 210-300 mm for length, extruding at 750-800 deg.C by (600-800)-ton press, annealing in H2 at 500-600 deg.C, forced cooling to 0-50 deg.C, and rolling.

The invention relates to a method for preparing a beryllium-copper alloy sheet, and particularly relates to a method for preparing the beryllium-copper alloy sheet by adopting a continuous magnetron sputtering physical-vapor deposition method. The method for preparing the beryllium-copper alloy sheet by adopting the continuous magnetron sputtering physical-vapor deposition method comprises the following steps: depositing a pure Be or Be-rich membrane with good combination on the single surface or both surfaces of a pure copper strip by taking a pure Be metal target or a beryllium-copper alloy target with high beryllium content as a cathode and the pure copper strip as an anode and adopting the magnetron sputtering physical-vapor deposition method; and then carrying out diffusion treatment at high temperature to enable Be atoms to be diffused inwards and permeated into a pure copper base body till the content of Be contained in the pure copper strip reaches 1-3 percent by weight so as to obtain a Cu-Be alloy strip, which is excellent in mechanical property and conductive property, with the Be content of 1-3 percent by weight. The method disclosed by the invention has the advantages of simplicity, easiness for operation, high work efficiency, energy-saving and environment-friendly preparation process, controllable quality and great suitability for industrialized application.

The Be-Cu alloy contains Be 0.2-0.6 wt%, Cr 0-0.5 wt%, Mn 1.8-3.0 wt%, Fe 1.8-3.0 wt% and Al 12.5-14.5 wt%, except Cu and inevitable small amount of impurity. It has hardness of HRC 42-52 deg, high heat conductivity, small friction coefficient, high wear resistance, high anticorrosion, smoothness and long service life.

The invention discloses a preparation method for a compound wear-resistant coating on the surface of a beryllium-copper alloy. The preparation method comprises the following steps: by adopting a double-layered glow plasma diffusion metallizing technology, preparing a diffusion coating layer on the surface of a beryllium-copper workpiece by taking a target material manufactured by any one wire of W, Mo and Nb or a W-Mo alloy, a Mo-Nb alloy, a W-Nb alloy and a W-Mo-Nb alloy and a beryllium-copper alloy panel as a source electrode, wherein before preparation, diamond particles subjected to Cu surface metallized treatment are uniformly sprayed to the surface of the beryllium-copper workpiece, so that the diamond particles are dispersively distributed; in the preparation process of the diffusion coating layer, uniformly spraying the diamond particles subjected to Cu surface metallized treatment to the surface of the workpiece once if the thickness of the coating is increased by 2-5[mu]m; after preparation of the diffusion coating layer is finished, introducing hydrogen for quick cooling; and then polishing the surface of the coating, and exposing the surfaces of the diamond particles. The coating prepared by the method has high electric conductivity, heat conductivity and wear resistance, the bonding strength of the coating with a matrix is high, and the preparation technology is simple in process.

The invention discloses a high-temperature-resistant, high-strength and beryllium-copper-free wire and a preparation method thereof. The preparation method comprises steps: S1, high-purity copper, pure iron and a block-shaped covering agent are mixed, molten, kept at the constant temperature and stirred, a copper-nickel alloy, a copper-strontium alloy, a copper-indium alloy, magnesium rods and rare earth element lanthanum are added, the mixture is heated to 1,230-1,260 DEG C, stirred and molten, and copper alloy melt is obtained; S2, component detection is performed on the copper alloy melt; S3, the copper alloy melt obtained in S2 is introduced into a high-vacuum single-roll rotary quenching and spray casting system and heated to 950-970 DEG C for spray casting, air is introduced after cooling, and a thin strip is obtained after balance of atmospheric pressure; S4, the thin strip is subjected to continuous annealing and homogenization in a magnetic field under the condition of 590-630 DEG C, and the high-temperature-resistant, high-strength and beryllium-copper-free wire is obtained through cold rolling and ageing treatment. With the iron-copper alloy as a basis, multiple alloy elements are added in a matched manner to replace conventional beryllium copper alloy materials, the cost is reduced, a reasonable preparation process is matched, and the comprehensive performance of the material is improved.

The invention provides a process for carrying out laser welding on a beryllium copper alloy mould. The process comprises the following operation steps: firstly, carbon tetrachloride is used to clean the mould and the surface of a beryllium copper welding wire with phi of between 0.30 and 0.50 mm; a Nd:YAG pulse laser welder with power of between 75 and 300 W, laser wavelength of 1.06um and an X, Y and Z-axis processing machine is used to carry out wire filling and welding to the needed dimension under protection of argon gas; the welder is used to carry out local heat treatment on a welding part of the mould; and finally, the surface of the mould is subjected to final finishing to the needed precision. The laser facula is very small; the diameter of the local part of the weldable mould can reach about 1mm; the mould has small deformation; one welder simultaneously carries out wire filling and welding and heat treatment; the process is simple and saves investment; a weld bead of the mould has no disadvantages of cracks, pores and the like; and a weldless part of the mould is not influenced and has high rigidity, thereby ensuring the service life of the mould. The process is mainly used for rehabilitating the abrasion and local damage of the beryllium copper alloy mould.

The invention relates to a high-strength and high softening temperature low beryllium-copper alloy and a preparation method thereof. The low beryllium-copper alloy is prepared from the components of,by mass, 0.2-0.5% of Be, 1.0-1.8% of Ni, 0.15-0.4% of Co, 0.5-0.8% of Ag, 0.05-0.1% of Zr, 0.02-0.05% of Mg, less than or equal to 0.1% of unavoidable impurities and the balance of Cu. The tensile strength of the prepared beryllium-copper alloy can reach 850-1000 MPa, the specific conductivity is 50-60% IACS (international annealed copper standard), the softening temperature can reach 600 DEG C orabove, and meanwhile, the alloy has the comprehensive performance of excellent high elastic stability, the low elastic aftereffect, non magnetism, abrasive resistance, corrosion resistance, plasticity and the like, and can be applied to the industries such as rail traffic, aviation, automobile, electric power, electronic engineering, and precise instrument and apparatus.

The invention discloses a preparation method for a TiN/Ti composite permeable layer on the surface of beryllium-copper alloy and belongs to the technical field of metallic material surface modification. The preparation method comprises the steps that (1) a beryllium-copper alloy workpiece is pretreated; (2) a plasma titanizing process is conducted in a plasma metal cementation furnace; and (3) the titanized beryllium-copper alloy workpiece is placed in a conventional ion nitriding furnace to be subjected to nitridation, and finally the TiN/Ti composite permeable layer of the beryllium-copper alloy is obtained. According to the preparation method, the plasma surface alloying technique and the ion nitriding technique are combined, the TiN/Ti composite permeable layer is formed on the surface of the soft beryllium-copper alloy, and the obtained composite permeable layer is good in abrasion resistance.