149results about How to "Simplify the process" patented technology

The invention discloses a method for preparing edible safflower tea oil, comprising the following steps: taking safflower tea seeds as raw materials; conducting stackretting, removal of the oil tea fruit shells, and taking-off of the tea seeds for low-temperature drying below safe moisture content on the harvested mature safflower oil tea fruits, and then cleaning stone, removing shells, separating kernels and shells, and crushing till the particle size is 20 to 60 meshes and adding water for tempering; adopting a cold pressing method for extracting the tea oil; and finally conducting simple refining processes such as filtration, wintering and the like so that the quality index can achieve national first-class edible tea oil standards. The method for preparing edible safflower tea oil hassimple and feasible process, easily-controlled production conditions, less refining processes, low refining loss rate, can keep various nutritional components in the safflower tea seeds from being destroyed, leads the finished tea oil to have light, clear and transparent color, aromatic natural flavor of the tea seeds, and is a nutritional and healthy tea oil.

The invention relates to the technical field of circuit board production, in particular to a method for manufacturing plated-through holes in an HDI plate. After blind holes and through holes are drilled in multiple inner-layer plates, inner-layer copper deposition and whole-plate hole filling electroplating are conducted so that the blind holes and the through holes can be metallized at the same time. A horizontal copper deposition electroplating wire is used during inner-layer copper deposition, a perpendicular continuous electroplating wire is used during whole-plate hole filling electroplating, the blind holes and the through holes can be metallized at the same time when the horizontal copper deposition electroplating wire and the perpendicular continuous electroplating wire are used in cooperation, and therefore the technological process can be simplified, production efficiency can be improved, and production cost can be reduced. Specific electroplate liquid is used during whole-plate hole filling electroplating, and therefore the quality of the metallized blind holes and the metallized through holes can be remarkably improved, and the metallized blind holes are prevented from cavities, fractures, poor hole filling and the like, the thickness of hole wall copper layers of the metallized through holes is 25 micrometers or higher, the thickness of electroplated copper on the surfaces of the inner-layer plates ranges from 35 micrometers to 45 micrometers, the requirements of a client are completely met, and manufacturing of circuits in the later procedure is completely achieved.