Passivation encapsulation method for organic electro luminescence elements and structure

Abstract

Passivation structure is coated on surface of lamellar structured organic EL elements to isolate contact between organic material / pole material and outside surroundings in order to prolong lifetime of organic EL elements. When coating by vaporization on organic layer and pole layer is completed, inorganic material with gas barrier property is coated on surface of element selectively at same time in order to protect cathode in primary. Then, following steps are carried out: high molecular passivation material coated on element through spray coating or printing method directly; heat cure or ultraviolet cure; filling up surface of element by using macromolecule layer to even the surface and eliminating cascade effect of gap between element and rib so as to reach compactness of passivation structure. Finally, encapsulation material seals passivation surface in order to provide final protection.

Description

technical field [0001] The present invention relates to a polymer layer coated by spraying or screen printing developed to ensure that the interior of the element is not affected by the external environment in an organic light-emitting diode (OLED) element, so as to protect the substrate formed on the substrate. The encapsulation method and structure of the organic electroluminescent (EL) element. Background technique [0002] Organic EL elements are elements with a layered structure, and the materials of each layer are extremely sensitive to the external environment. In order to facilitate the injection of electrons, the cathode uses a material with a low work function, but the material with a low work function is easily oxidized, and the oxidation of the cathode material will greatly reduce the efficiency of the element. In addition, the light-emitting layer formed by fluorescent organic solids of the device and the injection layer and transport layer of electrons and hol...

AI Technical Summary

Problems solved by technology

Among them, the evaporation method takes a long time, and the cost and equipment cost are high

However, when the spin coating and dipping methods are used for plating, the organic EL elements need to be coated one by one, which cannot be processed in a continuous production manner, and it takes a long time

[0007] 3. In the commonly used multi-layer barrier structure, its EL element and rib structure will lead to a step effect (step effect), resulting in poor coverage of the barrier layer when the barrier layer is plated; and chemical vapor deposition (CVD) method Although it can overcome the shortcomings of the step coverage effect, it takes a long time and the production cost is high

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