392results about How to "Reduce flaking" patented technology

Disclosed is a polarizing plate having high mechanical strength, while being excellent in flexibility and abrasion resistance. This polarizing plate is not deteriorated in visibility even under high temperature, high humidity conditions, and hardly suffers from visibility obstacles such as color shading due to dimensional change. Also disclosed is a liquid crystal display using such a polarizing plate. A film mainly containing a thermoplastic resin and composed of a plurality of layers is employed as a first protective film used on the viewer side of the polarizing plate, and at least one surface layer of the first protective film is mainly composed of an acrylic resin. A second protective layer having specific characteristics is arranged on the liquid crystal cell side.

An object of the invention is to provide an yttria-alumina composite oxide film wherein peeling-off of the film from a substrate may be prevented. An intermediary layer is provided on a substrate containing at least one of alumina and yttria-alumina composite oxide as a main component. In the intermediary layer, a ratio (Y / A) of a molar ratio Y of yttria to a molar ratio A of alumina is not smaller than 0.1 and not larger than 0.9. An yttria-alumina composite oxide film is formed on the intermediary layer. A ratio (YAG (420) / M) of a peak intensity YAG (420) of a (420) plane of a garnet phase to a maximum peak intensity M of crystal phases other than the garnet phase is 2.5 or more in the yttria-alumina composite oxide film based on an X-ray diffraction measurement.

The present invention aims at providing a high-performance semiconductor device such as display, IC tag, sensor or the like at a low cost by using an organic thin film transistor most members of which can be formed by printing, as a switching element. The present invention relates to a thin film transistor composed of members on a dielectric substrate, which are a gate electrode, a dielectric film, source / drain electrodes, and a semiconductor layer, wherein on said semiconductor layer there are formed at least two passivation films of a first passivation film capping said semiconductor layer to protect it and a second passivation film covering larger area than that of said first passivation film to protect all of said members.

A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed.

The invention relates to a corrosion process of aluminum foil used in an electrolytic capacitor, which includes six steps: pre-treatment, exchange of pre-corrosion, intermediate processing, post-level AC corrosion, DC corrosion, and after treatment, is characterized in that ultrasound-assisted corrosion is used in the post-level AC corrosion; at the same time, the invention divides the post-level AC corrosion into a plurality of levels, the temperatures are gradually reduced from the first level to the end, but the current densities are increased gradually. The craft of the invention keeps that the etching solution is transferred smoothly in a tank, effectively prevents concentration polarization at the interface of aluminum foil-etching solution, promotes the removing of the corrosion sediments, and greatly enhances the corrosion efficiency.

The present invention provides a wafer structure having a plurality of bonding pad, an adhesion layer, a barrier layer, a wetting layer, a plurality of bump, a first passivation layer and a second passivation layer. The bonding pads are disposed on the active surface of the wafer and exposed by the first passivation layer. The second passivation layer is disposed on the first passivation layer and exposing the bonding pads. An adhesion layer is disposed on the bonding pad and covers a portion of the first passivation layer. The second passivation layer covers the first passivation layer and a portion of the adhesion layer. The barrier layer and the wetting layer are sequentially disposed on the adhesion layer and the bumps are disposed on the wetting layer.

This invention relates to compositions comprising an ethanolamine derivative and an organic salt of zinc and / or magnesium. It further relates to the use of such compositions in topical formulations, in particular in anti-aging formulations. The invention further relates to the use of such compositions to promote human dermal fibroblasts growth and to combat the effects of skin aging.

In a semiconductor device in which a copper plating layer is used for a conductor of an antenna and in which an integrated circuit and the antenna are formed over the same substrate, an object is to prevent an adverse effect on electrical characteristics of a circuit element due to diffusion of copper, as well as to provide a copper plating layer with favorable adhesiveness. Another object is to prevent a defect in the semiconductor device that stems from poor connection between the antenna and the integrated circuit, in the semiconductor device in which the integrated circuit and the antenna are formed over the same substrate. In the semiconductor device, a copper plating layer is used for the antenna, an alloy of Ag, Pd, and Cu is used for a seed layer thereof, and TiN or Ti is used for a barrier layer.

This invention relates to stable compositions comprising an ethanolamine derivative and one or more glucosides (in particular melibiose and lactose). It further relates to the use of such compositions in cosmetic preparations, in particular in anti-aging formulations. The invention further relates to the use of such compositions to promote normal human dermal fibroblasts growth and to stimulate collagen synthesis. It further concerns a process for preparing such compositions.

A method for reducing peeling of a cross-linked polymer passivation layer in a solder bump formation process including providing a multi-level semiconductor device formed on a semiconductor process wafer having an uppermost surface comprising a metal bonding pad in electrical communication with underlying device levels; forming a layer of resinous pre-cursor polymeric material over the process surface said resinous polymeric material having a glass transition temperature (Tg) upon curing; subjecting the semiconductor process wafer to a pre-curing thermal treatment temperature below Tg for a period of time; and, subjecting the semiconductor process wafer to at least one subsequent thermal treatment temperature above Tg for a period of time to form an uppermost passivation layer.

A protective case for a mobile device having a multi-layered construction is disclosed. The multi-layered construction includes two layers co-molded to one another and produces a lightweight and low-profile case providing a high level of impact protection. The first layer generally forms the internal rigid shell of the case, and the second layer forms the external soft shell of the case which may include a perforated pattern of holes. The first layer is comprised of material that has a hardness greater than the second layer. The layers are configured to interact with one another so that they are capable of distributing and absorbing impact forces to mitigate damage to the mobile device. The first layer includes apertures in which the second layer forms buttons corresponding to mobile device user controls. The second layer also bonds through attachment openings at the corners of the first layer.

The invention relates to a modified asphalt mixture and preparation and construction methods thereof, particularly relates to rubber modified asphalt and preparation and construction methods thereof and belongs to the technical field of engineering. The rubber modified asphalt and the methods solve the construction problem that the mixture is thick and sticky by adding trans-polyoctenamer rubber (TOR) into the asphalt mixture, further reduce the stirring temperature of the rubber asphalt mixture, reduce processing equipment, improve production process, and are favorable for preventing water damage by a design method of continuous dense gradation. The preparation process of the mixture improves the using performance of the rubber asphalt mixture. The rubber modified asphalt and the methodshave the advantages of promoting the comprehensive utilization of waste tires by paving asphalt pavements with waste rubber powder modified asphalt, reducing great environment stress brought by blackpollution, saving resources, improving the pavement performance of the asphalt mixture, improving the service quality of the pavement, prolonging the service life of the pavement, reducing cost, and improving performance of products. Compared with the conventional modified asphalt production process, the preparation and construction methods have the advantages of energy saving and environmental protection and are convenient for construction.

The invention relates to a method of simultaneously cleansing the skin and providing an anti-aging skin benefit selected from the group consisting of skin firming, skin contouring, reducing the appearance of sagging skin, and skin tightening. The method comprises topically applying a skin cleanser composition comprising: (a) an effective amount of an anti-aging active compound of the formula: wherein X, Y and Z are selected from the group consisting of hydrogen, C1-C3 alkyl group, C2-C4 alkanol group, wherein at least one of X, Y or Z is a C2-C4 alkanol group bearing at least one hydroxyl group and optionally at least one carboxyl group; (b) a cleansing surfactant; and (c) water. The skin cleanser compositions of the invention can be used as a 2-in-1 composition that simultaneously cleanses the skin and improves skin firmness and / or provides the skin with lifting benefits giving the user a fresh / alert appearance readily perceived by others.

A fabrication method for a semiconductor hole is described. The method provides a circular or a elliptical hole pattern. A first exposure is performed with a first photomask that comprises a plurality of diagonally allocated square patterns wherein the square patterns on the first photomask are tilted at an angle of 45 degrees. Thereafter, a second exposure is performed using a second photomask, wherein patterns on the second photomask are mirror images to those on the second photomask to prevent the peeling of the photoresist at between the diagonally allocated hole patterns.

A dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic pressure-sensitive adhesive comprising an acrylic polymer which comprises an acrylic ester, a hydroxyl group-containing monomer where a ratio is in a range of 10-40 mol % to 100 mol % of the acrylic ester, an isocyanate compound having a radical reactive carbon-carbon double bond where a ratio is in a range of 70-90 mol % to 100 mol % of the hydroxyl group-containing monomer, and a compound having two or more radical reactive carbon-carbon double bonds where a ratio is in a range of 10-60 parts by weight to 100 parts by weight of the acrylic polymer, and the die-bonding film is formed from an epoxy resin and is laminated on the pressure-sensitive adhesive layer.

The invention provides seed and plants of carrot hybrid 07100375 and the parent lines thereof. The invention thus relates to the plants, seeds and tissue cultures of carrot hybrid 07100375 and the parent lines thereof, and to methods for producing a carrot plant produced by crossing such plants with themselves or with another carrot plant, such as a plant of another genotype. The invention further relates to seeds and plants produced by such crossing. The invention further relates to parts of such plants, including the roots and gametes of such plants.

According to one embodiment of the invention, a method of packaging flip chips includes providing a plurality of flip chips and a panel, forming a plurality of partitions outwardly from the panel, coupling the flip chips to the panel such that each partition surrounds a respective flip chip, and forming an underfill region between each of the flip chips and the panel. Each partition prevents a respective underfill region from engaging an adjacent underfill region.

A board interconnection structure having a first printed wiring board in which a first conductive circuit is arranged on a first insulating layer, the first conductive circuit having, on an end portion thereof, a first connection terminal in which an upper surface width is narrower than a bottom surface width; a second printed wiring board in which a second conductive layer having a second connection terminal is arranged on a second insulating layer; and a connection layer that forms fillets along longitudinal side surfaces of the first connection terminal, and interconnects the first connection terminal and the second connection terminal. The first connection terminal may have a projection portion.

A multielement zinc-aluminum alloy capable of improving frictional wear performance belongs to the technical field of zinc-aluminum alloy preparation. The multielement zinc-aluminum alloy is characterized in that the multielement zinc-aluminum alloy is prepared from the following raw materials: industrial aluminum ingot NO.A00, zinc ingot NO.0, electrolytic copper, composite modifier and pure magnesium, wherein the composite modifier contains 20-30% of Ni, 15-25% of Ti, 5-15% of Mn, 5-15% of Cr, 5-10% of Si, 5-10% of Ce, 5-10% of La, 1-6% of Y, 1-6% of Nb, 1-6% of V and the balance of aluminum; the multielement zinc-aluminum alloy is smelted in an induction melting furnace after weighing 27-29% of Al, 2-2.5% of Cu (added in the form of aluminum-copper intermediate alloy containing 50% of copper), 0-1.2% of composite modifier, 0.01-0.02% of Mg and the balance of Zn; and smelting is carried out according to the addition amount of the composite modifier to be 0-1.2%, and then seven groups of zinc-aluminum alloy blanks containing different composite modifiers are casted and subjected to mechanical property and frictional wear performance testing.

An arc chamber for an ion implantation system includes an exit aperture positioned at a wall of the arc chamber, filaments respectively positioned at two opposing sides within the arc chamber, and repeller structures respectively positioned at two opposing walls within the arc chamber between the filaments and the arc chamber. The repeller structure includes a repeller substrate with a screw axis for fitting the repeller structure to the arc chamber, an insulator positioned underneath the repeller substrate providing an electrical isolation between the repeller substrate and the arc chamber, and a conductive spacer covering a portion of the insulator positioned in between the insulator and the arc chamber.

A method of modifying a surface of a casting involves providing a casting mould; placing a perforated mask with the mould to define a masked area of the mould; spray-coating the masked area of the mould with a coating material selected for forming a surface layer on the casting; introducing a liquid casting material to the mould; and, solidifying the liquid casting material to form a surface modified casting. The present method reduces the tendency for the coating material to spall from the mould and permits the formation of thicker coating layers on the mould. Thicker and better quality surface layers may be formed on castings.

A flexible liquid crystal display device includes a first flexible substrate, a second flexible substrate, a liquid crystal layer, a cover layer and a waterproof glue. The second flexible substrate is disposed opposite to the first flexible substrate, and the liquid crystal layer is disposed between the first flexible substrate and the second flexible substrate. The cover layer covers the second flexible substrate and has a surface facing the second flexible substrate. The waterproof glue is adhered to the surface of the cover layer and a side of the second flexible substrate.

A semiconductor device includes a hard mask including a first layer and a second layer in contact with each other and having opposite stress types, wherein a difference between initial stresses of the first layer and the second layer is increased so that after a thermal process, the difference between the final stresses of the first and second layer becomes smaller, to reduce the likelihood of peeling of the first or second layer. The initial stress of the first layer includes a compressive stress and the initial stress of the second layer includes a tensile stress.

Composite structures having an integral intelligent skin are made of one or more plies of a structural base material and an intelligent or smart film by molding one or more plies and the film into an integral unitary body with the intelligent film outermost. The intelligent or smart film contains or bears a functionally active or interactive component such as antennae, electronic sensors, electric and / or electronic circuitry, and / or spectrally tailored coatings. A method of making the composite structure in a very economical manner is disclosed.

The invention relates to a 1500-1700 DEG C carbon / carbon composite material surface oxidation-resistant coating and a preparation method. A gradient hafnium boride modified silicon carbide outer coating is prepared by an in-situ reaction method, and the content of hafnium boride is sequentially increased from inside to outside. On one hand, the method solves the problems of mismatching of a thermal expansion coefficient between coatings and peeling of the coatings caused by excessive thermal expansion coefficient in the oxidation process, and binding and infiltration between the coatings are improved. On the other hand, the content of HfB2 in the coating is greatly increased by the gradient hafnium boride modified silicon carbide outer coating prepared by the in-situ reaction method, and the oxidation resistance of a silicon ceramic coating is effectively improved. Compared with other methods for preparing the oxidation-resistant coating such as a slurry method and a plasma spraying method, the preparation method is simple to operate, cost is saved, and the prepared coating and a substrate have a good binding force.

A powder coating composition comprising an intimate mixture of at least one film forming resin binder and from 0.1 to 50 wt. %, based on the total weight of the powder coating composition, of at least one modified encapsulated titanium dioxide.

Provided is a hollow cathode sputtering target comprising an inner bottom face having a surface roughness of Ra≦1.0 μm, and preferably Ra≦0.5 μm. This hollow cathode sputtering target has superior sputter film evenness (uniformity), generates few arcing and particles, is capable of suppressing the peeling of the redeposited film on the bottom face, and has superior deposition characteristics.

The present invention relates to a kind of M / MO x Composite hydrogen barrier coating, including stainless steel substrate and M / MO applied thereon x Composite coating. The transition layer M in the composite coating is Al, zr, Er, Y, Cr, Mn, Fe metal, the hydrogen barrier coating MO x It is the oxide of the transition layer metal. Composite hydrogen-resistant coatings are all prepared by reactive sputtering combined with negative bias technology, and can be a one-layer or multi-layer composite structure. The invention not only can effectively improve the binding force between the coating and the substrate, but also facilitates the improvement of the hydrogen resistance performance of the coating itself.