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An apparatus and method for disinfestation of temperature sensitive and other commodities using short duration, high peak power radio frequency pulses and intense electric fields to preferentially induce drift of conduction charges, spot heating and other mortal damage to infesting insects and mites without raising the temperature of the host commodity. A low frequency mode is provided with a frequency range of approximately 10 Hz to 1 MHz and is particularly suited for large batch processing of pallets or field containers. A high frequency mode is also provided that is suited for continuous or small batch processing and uses a preferred frequency range of approximately 1 MHz to 150 MHz. Both modes preferably have an electric field strength of greater than approximately 5 kV/cm and pulse repetition rates of between one pulse and approximately 10 million pulses per second. The method is non-contact, residue free and effective with all biological stages of an infesting insect, mite or other biological pest including egg, pupa, larvae, juvenile and adult forms. The apparatus and methods of the invention are an effective alternative to methyl bromide fumigation that does not leave any toxic residues or damage the cosmetic appearance or flavor of the commodity.

An electrophotographic photoconductor that is excellent in the stability of image quality and can realize high durability is provided. In an electrophotographic photoconductor in which an underlying layer, a photoconductive layer, and a crosslinked-type charge transportation layer are stacked on an electrically conductive support in order, the underlying layer is composed of at least two layers being a layer containing an inorganic pigment and a layer including no inorganic pigment, and the crosslinked-type charge transportation layer is formed by curing, at least, a three-or-more-functional radical-polymerizable monomer having no charge transporting structure and a radical-polymerizable compound having one-functional charge transporting structure.

Disclosed is a system including a good comprising a sensor in contact with human tissues of a patient and configured to obtain a power dissipation reading of the human tissues. The good also includes a storage medium for tangibly storing thereon a program for execution by a processor. The system also includes a control unit in communication with the good to form an electrical muscular stimulation (EMS) system that uses feedback in a closed loop manner to self tune electrical properties of the output. The control unit is configured to instruct the sensor to (a) apply a sense pulse to the human tissues, (b) measure power dissipation of the sense pulse, (c) adjust a stimulation pulse based on the measured power dissipation, (d) apply the stimulation pulse to the human tissues based on the power dissipation and based on the program in order to maintain constant power output across each pulse, and (e) repeat steps (a)-(d).

An edible dry-powder formulation of a film coating for pharmaceuticals and confectioneries using gum acacia as a low-cost film former is provided. A cellulosic polymer such as hydroxypropyl methylcellulose is used in addition to the gum acacia. A plasticizer such as propylene glycol is also added. The resulting formulation is a dry, free flowing powder that can be put into solution and applied to a tablet or other substrate without an extended waiting period. The resulting film coating is clear, shiny, durable and extremely economical. Because the formulation is a dry powder, it has along shelf life and low shipping costs.

The present invention relates to a carbon fiber sizing agent comprised of water-soluble thermoplastic resin and amphoteric surfactant within a weight ratio range of 6/1 to 1/3, a carbon fiber sizing method comprising treating carbon fibers using a sizing liquid containing the aforementioned sizing agent, sized carbon fibers comprising adhering the aforementioned sizing agent to their surfaces, and a fabric that uses said carbon fibers. The carbon fiber sizing agent of the present invention has satisfactory solubility in water over a wide pH range, and is able to impart to carbon fibers adequate convergence for forming stable chopped carbon fibers, superior workability and satisfactory uniform tow dispersibility in water over a wide pH range. Since a fabric of the present invention demonstrates affinity to water over a wide pH range, it is suitable for applications such as immersing said fabric in an aqueous matrix in order to impregnate the fabric with that matrix.

There is provided a polyester fiber which has few defects such as voids due to catalyst particles, and low variation in physical properties and minimal fluff generation. The polyester fiber of the invention comprises laminar nanoparticles composed of a divalent metal and a phosphorus compound and having side lengths of 5-100 nm and an interlayer spacing of 1-5 nm. There are also provided a tire cord, tire, belt-reinforcing fiber material and belt, comprising the polyester fiber.

Affords a holder for use in semiconductor or liquid-crystal manufacturing devices—as well as semiconductor or liquid-crystal manufacturing devices in which the holder is installed—in which temperature uniformity in the processed-object retaining face is heightened. Configuring the holder with, furnished atop a ceramic susceptor, a composite of a ceramic and a metal improves the temperature uniformity in the holder's processed-object retaining face and makes for curtailing the generation of particulates and other contaminants. In addition, putting a coating on at least the retaining face improves the durability of the holder. Installing a holder of this sort in a semiconductor manufacturing device or a liquid-crystal manufacturing device contributes to making available semiconductor or liquid-crystal manufacturing devices whose productivity and throughput are excellent.

A sputtering target having a composition of LiCoO₂, wherein a resistivity of the target is 100 Ωcm or less, and a relative density is 80% or higher. The sputtering target of the present invention is effective for use in forming a positive electrode thin film in all-solid-state thin-film lithium ion secondary batteries equipped in vehicles, information and communication electronics, household appliances, and the like.

A low-corrosivity composition suitable for dissolving scale on metals. The scale includes iron sulfide scale. The composition includes an aqueous hydrogen peroxide solution comprising hydrogen peroxide; and an acidic solution comprising at least one acid, where the hydrogen peroxide and acid are present at concentrations such that the hydrogen peroxide does not break down to form visible bubbles at about room temperature, where the hydrogen peroxide and acid are present at concentrations such that iron sulfide scale is removed from a metal with iron sulfide scale, after the composition contacts the metal and iron sulfide scale at an elevated temperature greater than room temperature, and where the hydrogen peroxide and acid are present at concentrations such that pitting is not caused on the metal, the metal comprising carbon steel.

A manufacturing method of a monocrystalline silicon includes: a growth step in which a seed crystal having contacted a silicon melt is pulled up and a crucible is rotated and raised to form a straight body of the monocrystalline silicon; a separating step in which the monocrystalline silicon is separated from the silicon melt; a state holding step in which the crucible and the monocrystalline silicon are lowered and the monocrystalline silicon is kept at a level at which an upper end of the straight body is located at the same level as an upper end of a heat shield or is located below the upper end of the heat shield for a predetermined time; and a draw-out step in which the monocrystalline silicon is drawn out of a chamber.

A method of removing contaminants from a silicon wafer after chemical-mechanical polishing (CMP). After a copper chemical-mechanical polishing and a subsequent barrier chemical-mechanical polishing operation, an aqueous solution of ozone in de-ionized water is applied to clean the silicon wafer so that contaminants on the wafer are removed. Alternatively, an ozone/de-ionized water buffer-polishing process is conducted after copper and barrier CMP and then the wafer is cleaned using a chemical solution or de-ionized water. Alternatively, an ozone/de-ionized water buffer-polishing process is conducted after both copper-CMP and barrier-CMP and then the wafer is cleaned using a chemical solution or de-ionized water.