Holder for Use in Semiconductor or Liquid-Crystal Manufacturing Device and Semiconductor or Liquid-Crystal Manufacturing Device in Which the Holder Is Installed

Abstract

Affords a holder for use in semiconductor or liquid-crystal manufacturing devices—as well as semiconductor or liquid-crystal manufacturing devices in which the holder is installed—in which temperature uniformity in the processed-object retaining face is heightened. Configuring the holder with, furnished atop a ceramic susceptor, a composite of a ceramic and a metal improves the temperature uniformity in the holder's processed-object retaining face and makes for curtailing the generation of particulates and other contaminants. In addition, putting a coating on at least the retaining face improves the durability of the holder. Installing a holder of this sort in a semiconductor manufacturing device or a liquid-crystal manufacturing device contributes to making available semiconductor or liquid-crystal manufacturing devices whose productivity and throughput are excellent.

Description

BACKGROUND OF INVENTION FIELD OF THE INVENTION [0001] The present invention relates to holders employed in semiconductor manufacturing devices or in liquid-crystal manufacturing devices—such as equipment for plasma CVD, low-pressure CVD, metal CVD, dielectric CVD, ion-implantation, etching, low-k deposition, and degassing—and furthermore to semiconductor or liquid-crystal manufacturing devices in which the holders are installed. BACKGROUND ART [0002] Conventionally, in semiconductor or liquid-crystal manufacturing procedures various processes, such as film deposition processes and etching processes, are carried out on semiconductor substrates or liquid-crystal containing glass plates (LCD glass) that are the processed objects. Ceramic susceptors, which are both for retaining semi-conductor substrates or LCD glass, and for heating semi-conductor substrates or LCD glass, are used in the processing devices in which such processes on semiconductor substrates or LCD glass are carried out...

AI Technical Summary

Benefits of technology

[0011] The present invention has been brought about to resolve the foregoing issues. That is, an object of the present invention is to make available a holder for use in semiconductor or liquid-crystal manufacturing devices, as well as semiconductor or liquid-crystal manufacturing devices in which the holder is installed, with which temperature uniformity in the surface of semiconductor wafers or LCD glass is enhanced and generation of contaminants and particulates is minimal, and in which resistance to thermal shock is superior, costs are lowered and production efficiency is excellent.

[0014] A holder as described above advantageously is installed in semiconductor or liquid-crystal manufacturing devices. In such semiconductor or liquid-crystal manufacturing devices, inasmuch as the surface temperature of the wafers and LCD glass that are the processed objects proves to be more uniform than with conventional holders made of ceramic, and at the same time resistance to thermal shock is superior and generation of contaminants and particulates is almost nil, high-quality semiconductor or liquid crystal display devices can be manufactured with good throughput.

Problems solved by technology

With ceramics that are insulative those that have high thermal conductivity are limited, however.

Another problem has been that to improve the temperature uniformity of ceramics generally used in susceptors, such as Al2O3, AlN, Si3N4, and SiC, the susceptors should be made thick, but making them thick retards the heat-up and cool-down speeds, meaning that since throughput cannot be raised productivity suffers.

A further problem is that because ceramics are materials that either have an extremely high melting point, or that do not have a melting point, melting and casting ceramics or heating and roll-milling cast ceramic blocks in the way metals are presents difficulties.

Consequently, to make ceramic susceptors thicker, and to enlarge them diametrically to over 200 mm has entailed a quantum leap in cost.

And a further difficulty has been that because these ceramics are fragile materials they break when subject to localized heat stress.

Apart from temperature uniformity as just discussed, another issue has been that in carrying out the different processes mentioned earlier, the generation of contaminants and particulate debris from metallic impurities has to be restrained to the utmost because of the seriously negative impact that the contaminants and particulates would have on the quality of the semiconductors and liquid crystals that are fabricated.

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