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548results about How to "Reduce dirt" patented technology

Vertical skein of hollow fiber membranes and method of maintaining clean fiber surfaces while filtering a substrate to withdraw a permeate

A vertical skein of "fibers", opposed terminal portions of which are held in headers unconfined in a modular shell, is aerated with a gas-distribution means which produces a mass of bubbles serving the function of a scrub-brash for the outer surfaces of the fibers. The membrane device is surprisingly effective with relatively little cleansing gas, the specific flux through the membranes reaching an essentially constant relatively high value because the vertical deployment of fibers allows bubbles to rise upwards along the outer surfaces of the fibers. Further, bubbles flowing along the outer surfaces of the fibers make the fibers surprisingly resistant to being fouled by build-up of deposits of inanimate particles or microorganisms in the substrate provided that the length of each fiber is only slightly greater than the direct center-to-center distance between opposed faces of the headers, preferably in the range from at least 0.1% to about 5% greater. For use in a large reservoir, a bank of skeins is used with a gas distributor means and each skein has fibers preferably >0.5 meter long, which together provide a surface area >10 m2. The terminal end portions of fibers in each header are kept free from fiber-to-fiber contact with a novel method of potting fibers.
Owner:ZENON TECH PARTNERSHIP

Reduction of fouling in heat exchangers

A method for reducing the formation of deposits on the inner walls of a tubular heat exchanger through which a petroleum-based liquid is flowing comprises applying one of fluid pressure pulsations to the liquid flowing through the tubes of the exchanger and vibration to the heat exchanger to effect a reduction of the viscous boundary layer adjacent the inner walls of the tubular heat exchange surfaces. Reduction of the viscous boundary layer at the tube walls not only reduces the incidence of fouling with its consequential beneficial effect on equipment life but it also has the desirable effect of promoting heat transfer from the tube wall to the liquid in the tubes. Fouling and corrosion are further reduced by the use of a coating on the inner wall surfaces of the exchanger tubes.
Owner:EXXON RES & ENG CO

Methods for making membranes based on anodic aluminum oxide structures

InactiveUS20100219079A1Reduce to practiceDecrease foulingAnodisationMembranesChemistryPorous anodic aluminum oxide
Membranes including anodic aluminum oxide structures that are adapted for separation, purification, filtration, analysis, reaction and sensing. The membranes can include a porous anodic aluminum oxide (AAO) structure having pore channels extending through the AAO structure. The membrane may also include an active layer, such as one including an active layer material and / or active layer pore channels. The active layer is intimately integrated within the AAO structure, thus enabling great robustness, reliability, resistance to mechanical stress and thermal cycling, and high selectivity. Methods for the fabrication of anodic aluminum oxide structures and membranes are also provided.
Owner:INTEGRATED DEVICE TECH INC

Materials and processes for reducing combustion by-products in a lubrication system for an internal combustion engine

A lubrication system having an oil filter modified to replace or supplement the performance of lubricant additives that may be used within an internal combustion engine to increase the performance of a lubricant. The formulation of the lubricant is changed in accordance with the chemicals placed in the oil filter. For example, when the oil filter contains a strong base, the lubricant concentration of detergent will decrease, in some cases to zero, while the dispersant concentration in the lubricant will increase. The dispersant is the ideal weak base to neutralize combustion acid at the piston ring zone, carry the resultant weak base-combustion acid complex to the strong base in the oil filter, undergo ion exchange with the strong base, immobilize the acid in the oil filter and recycle back to the piston ring zone for reuse as an acid neutralization agent. The reduction or elimination of detergent from the lubricant will reduce the fouling of the emission filter and of deposit formation on engine parts such as the piston. The oil filter may also contain an additive which is slowly released into the lubricant. For example, a ZnDDP anti-wear additive may be slowly released from the oil filter to the lubricant. Because the ZnDDP has low molecular weight alkyl groups it has limited solubility in the lubricant. The rate of release is limited by the equilibrium concentration of the additive in the lubricant. As a result, a relatively constant concentration of the additive may be maintained in the lubricant. The resultant closed system allows the oil drain intervals to be significantly extended.
Owner:LUTEK

Fluid bed reactor

Fluidized bed reactor systems for producing high purity silicon-coated particles are disclosed. A vessel has an outer wall, an insulation layer inwardly of the outer wall, at least one heater positioned inwardly of the insulation layer, a removable concentric liner inwardly of the heater, a central inlet nozzle, a plurality of fluidization nozzles, at least one cooling gas nozzle, and at least one product outlet. The system may include a removable concentric sleeve inwardly of the liner. In particular systems the central inlet nozzle is configured to produce a primary gas vertical plume centrally in the reactor chamber to minimize silicon deposition on reactor surfaces.
Owner:REC SILICON

Surface-protecting sheet and semiconductor wafer lapping method

ActiveUS20070066184A1Reduce foulFouling of the wafer can be reducedFilm/foil adhesivesSolid-state devicesCHEEK DIMPLESEngineering
It is an object of the present invention to provide a surface protective sheet and a method for grinding a semiconductor wafer, by the use of which any dimple is not formed, nor occurs breakage and fouling of a wafer even when a wafer having high bumps which are highly densely arranged is ground to an extremely small thickness, and besides, no adhesive is left at the roots of the bumps after the surface protective sheet is peeled. The surface protective sheet of the invention is used for grinding a back surface of a semiconductor wafer, and in the surface protective sheet, one surface of a base sheet is provided with an opening portion having a diameter smaller than an outer diameter of a semiconductor wafer to be stuck, on said opening portion no adhesive layer being formed, and a portion which is provided around the opening portion and on which an adhesive layer is formed.
Owner:LINTEC CORP
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