41results about How to "Meet conductivity" patented technology

The present invention provides a metal material with a non-chromate surface treatment, which can satisfy the corrosion resistance, heat resistance, fingerprint resistance, electrical conductivity, paintability and processing requirements that were difficult to achieve with the conventional non-chromate technology. Anti-blackening and other properties. The non-chromate surface-treated metal material of the present invention forms a composite film containing various components by applying and drying a water-based metal surface treatment agent on the surface of the metal material. The water-based metal surface treatment agent contains one The organic silane coupling agent (A) of amino group and the silane coupling agent (B) containing 1 glycidyl group in the molecule are mixed according to the ratio of solid content mass ratio [(A) / (B)] of 0.5 to 1.7. A silicon compound (W), at least one fluorine compound (X) selected from titanium hydrofluoride or zirconium hydrofluoride, phosphoric acid (Y) and a vanadium compound (Z).

The invention discloses an ultra-thin metal grid-based transparent electrode and a preparation method thereof, and relates to the technical field of a transparent electrode. The ultra-thin metal grid-based transparent electrode comprises a surface modified flexible transparent substrate; and a conductive metal grid layer with thickness of 1-10nm is deposited on the modified surface of the flexibletransparent substrate. The preparation method of the transparent electrode comprises the steps of grafting a layer of amino group on the surface of the substrate, forming a mask plate by photoresistor adhesive printing, depositing a metal layer with thickness of 1-10nm in the gap of the mask plate, and removing the mask plate to obtain the ultra-thin metal grid-based transparent electrode. By lowering the thickness of the metal grids, the light transmittance of the metal grids is improved; and meanwhile, the metal grids still have relatively high conductivity at the thickness of 1-10nm, so that the problem of "waxing and waning" between the conductivity and the light transmittance of the transparent electrode can be solved, and balance of the conductivity and the light transmittance is realized.

Embodiments of the present invention provide a method for manufacturing a package structure and a package structure, which relate to the technical field of packaging. The manufacturing method of the package structure includes providing a chip and a heat dissipation cover; wherein, the chip is provided with a circuit pad, and the heat dissipation cover is provided with a ground terminal and a mounting groove. Set the chip in the mounting groove; plastic-encapsulate the chip and the heat dissipation cover, and expose the circuit pad and the ground terminal; lead the RDL circuit from the circuit pad and the ground terminal; fill the RDL circuit with a dielectric layer, and form on the dielectric layer A ground pad and a ball-mounting pad; wherein, the ground pad is connected to the ground terminal, and the ball-mounting pad is connected to the circuit pad. Since the RDL line is directly drawn from the ground terminal and the line pad, that is, the heat dissipation cover is directly connected to the RDL line, it is beneficial to reduce the grounding resistance and prolong the service life of the package structure.

The invention relates to low-diameter high-strength polyacrylonitrile-based carbon fibers and a preparation method thereof. According to the method, acrylonitrile containing itaconic acid and methyl methacrylate is used as a ternary polymerization system, and an organic diol crosslinking agent is added in a polymerization process for polymerizing, so that a spinning stock solution which has a polymer content of 12.5-17.5% and a viscosity of 120-800 CP is obtained; due to the addition of the crosslinking agent, the spinnability and high drafting of the spinning solution with low polymer contentand low viscosity are improved; then, a wet spinning process is adopted and matched with reasonable solidification conditions and a spinning drafting process, so that low-diameter polyacrylonitrile precursor with surface grooves is prepared; the precursor is pre-oxidized, and is carbonized at a low temperature and a high temperature, so as to obtain the monofilament which has the equivalent diameter of 2-3 mum, the tensile strength of more than or equal to 3.5 GPa, and the tensile modulus of more than or equal to 230 Gpa; therefore, the low-diameter and high-strength polyacrylonitrile-based carbon fibers with a regular surface groove structure are obtained. The carbon fiber obtained by method can improve the flexibility of carbon fiber paper for fuel cells.