Copper alloy and method for producing copper alloy

Abstract

Provided is a copper alloy with an FCC structure, said copper alloy containing 3.0 to 29.5 mass% of Ni, 0.5 to 7.0 mass% of Al, and 0.1 to 1.5 mass% of Si, with the remainder comprising Cu and unavoidable impurities. By precipitating, at an average particle size of not more than 100 nm, an Si-containing L12-structured Gamma' phase in the parent phase of the copper alloy, the copper alloy is provided with excellent processability even at high temperatures, and is highly conductive. Furthermore, these characteristics can be controlled.

Description

technical field [0001] The present invention relates to a high-strength, high-conductivity copper alloy suitable for lead frames, connectors, terminal parts, etc. for electric / electronic equipment, and a copper alloy production method for producing the copper alloy. Background technique [0002] Conventionally, low-cost brass has been used as a material requiring electrical conductivity and elasticity for various terminals such as lead frames of electronic equipment, connectors, relays, and switches, and for applications where manufacturing costs are important. On the other hand, phosphor bronze is used for applications where mechanical properties such as elasticity are important. Furthermore, for applications where corrosion resistance is important in addition to elasticity, nickel nickel is used. [0003] However, the current situation is that the use of these materials cannot sufficiently satisfy the required strength due to the weight reduction, thinning and miniaturiza...

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Problems solved by technology

However, as a copper alloy that improves the strength of Ni-Si-based intermetallic compounds, there are limitations in terms of high strength and high conductivity.

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