46results about How to "Improve throwing power" patented technology

A composition and method for electroplating a metal on a substrate. The composition has a chloride to brightener concentration ratio of from 20:1 to 125:1. The method of electroplating, which employs the composition, employs pulse patterns that improve physical properties of metal surfaces.

Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.

A surface treatment with a zirconium ion that enables sufficient throwing power and superior anti-corrosion properties to be exhibited when thus surface treated metal base material is subjected to cation electrodeposition coating is provided. A metal surface treatment liquid thereof for cation electrodeposition coating includes zirconium ions, copper ions, and other metal ions, and having a pH of 1.5 to 6.5, in which: the other metal ions are at least one selected from the group consisting of tin ions, indium ions, aluminum ions, niobium ions, tantalum ions, yttrium ions and cerium ions; the concentration of zirconium ions is 10 to 10,000 ppm; the concentration ratio of the copper ions to the zirconium ions is 0.005 to 1 on a mass basis; and the concentration ratio of the other metal ions to the copper ions is 0.1 to 1,000 on a mass basis.

The invention discloses an acid non-cyanide cadmium-plating additive, preparation of a plating solution and an electro-plating process. The plating solution comprises the following components: 35-40 g / L of cadmium chloride, 140-180 g / L of potassium chloride, 120-160 g / L of a complexing agent, 1.5-2.5 mL / L of a brightener, and 25-35 mL / L of an auxiliary agent. Electro-plating operation conditions comprise that the plating bath temperature is 15-35 DEG C, the negative electrode current density is 0.5-1.5 A / dm<2>, the area ratio of a negative electrode to a positive electrode is 2 to 1, and the positive electrode comprises two materials of a cadmium plate and an electro-plating high-density graphite plate. The advantages mainly comprise that a brightener and an auxiliary agent are prepared by adopting a high-performance electro-plating additive intermediate, the combined complexing agent and cadmium ions are used for generating polybasic complex ions, and the performance of the plating solution and the performance of a plating layer are improved; the plating solution of the process is stable and is easy to maintain, the current efficiency is relatively high, the deep plating ability is strong, the brittleness of the plating layer is small, the corrosion resistance is good, various properties meet requirements of the Ministry of Astronautics Industry standards QJ 453-1988 ''cadmium plating layer technology conditions'', and electroplating wastewater treatment results meet requirements of GB 21900-2008 ''electroplating pollutant discharge standards'' table 3.

The present invention relates to a plating composition for electrolytic copper deposition, comprising copper ions, halide ions and at least one acid, at least one benzothiazole compound, at least onephenanzine dye and at least one ethanediamine derivative. The present invention further concerns the use of above plating composition and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate.

The invention discloses a composite chrome plating additive comprising an organic matter and an inorganic matter. The organic matter is alkyl-chain sulfonic acid and / or alkyl-chain disulfonic acid with a dose of 1-20g / L of standard chrome plating liquid. Or the organic matter is 0.01-0.1g / L of a nitrogen-containing organic compound. The inorganic matter is light rare earth fluoride with a dose of 0.001-0.01g / L of standard chrome plating liquid, and / or one of VA element oxides, hydroxides, and sulfates, wherein the dose of the VA element oxide or hydroxide or sulfate is 0.01-0.1g / L of standard chrome plating liquid. According to the invention, the organic matter and the inorganic matter are added into the standard chrome plating solution, such that advantages such as high current efficiency, good plating brightness, wide process brightness range, and good deep plating performance are provided. The plating has the advantages of high hardness, high current efficiency, no anode corrosion, wide process brightness range, good deep plating performance, simple operation process, and low cost.

The invention relates to a through-hole electroplating method of a printed circuit board, comprising the following steps: grafting graphene oxide with γ-aminoethylaminopropyltrimethoxysilane to obtain a product A; making the product A adsorb active metal ions, The product B is obtained; the product B is physically adsorbed to the surface of the insulating substrate of the through-hole wall of the printed circuit board to form an adsorption layer; the adsorption layer is converted into a conductive layer through a chemical reduction process; the through-hole wall with a conductive layer is electroplated A metal layer is formed. In the present invention, graphene oxide is selected and grafted with γ-aminoethylaminopropyltrimethoxysilane. Due to the formation of high-density oxygen bond functional sites at the grafting interface, the adsorption capacity for active metal ions is effectively improved, and the conductive layer The ethylenediamine groups on the surface can effectively improve the ability to capture copper ions in the solution during the electroplating process, accelerate the mass transfer of copper ions, and facilitate the accelerated deposition of copper plating in the holes, thereby greatly enhancing the uniformity of the plating solution. Plating ability.

A low energy snow making gun having at least one but preferably three operational stages each having at least one pair of small aperture water outlets which are oriented at a divergent angle to generate a respective pair of narrow angled water droplet streams which do not interfere with each other until they have reached a distance from the gun. A second pair of water outlets may be provided on each stage with each pair on each stage oriented at a divergent angle to maintain singularity of the streams over a distance thereby increasing the throwing power of the gun.

The methods inhibit or reduce dimpling and voids during copper electroplating of through-holes with flash copper layers in substrates such as printed circuit boards. An acid solution containing reaction products of aromatic heterocyclic nitrogen compounds and epoxy-containing compounds is applied to the through-holes of the substrate followed by filling the through-holes with copper using a copper electroplating bath which includes additives such as brighteners and levelers.

The invention relates to the field of gold plating, and discloses a cyanide-free sulfite gold plating solution and an application thereof. The cyanide-free sulfite gold plating solution contains gold sulfite, alkali metal sulfite, and 3-nitrobenzenesulfonic acid Salts, organic polyamines, organic phosphonates, polyol compounds, high molecular polymers containing imines, and thiourea compounds. The cyanide-free sulfite gold plating solution provided by the present invention contains a current efficiency stabilizer with excellent properties, which participates in the reduction process of the cathode during the gold plating process, and prevents the occurrence of chemical side reactions, thereby improving the current efficiency, which is obviously beneficial Improve the throwing ability of the plating solution. And it improves a series of problems such as the inaccurate prediction of the amount of gold plating caused by the low current and unstable current efficiency, the relatively poor dispersion ability of the plating solution and the low current density.

The invention relates to a leveling agent and an electroplating solution containing the same, wherein the leveling agent includes functional components, and the functional components are reaction products formed by reacting imidazole compounds, tertiary amine compounds and epoxy compounds. The leveling agent can be better applied to the co-plating process of through-blind holes, and can effectively avoid the problem that the plating layer inside the through-hole and the corner of the through-hole opening is too thin.

The invention discloses a cyanide-free tin-bronze electroplating solution for steel parts, and a preparation method and an electroplating method thereof, and relates to the technical field of tin-bronze electroplating. The tin-bronze electroplating solution comprises 30-45 g / L of copper sulfate, 3-5 g / L of tin sulfate, 120-150 g / L of sodium thiosulfate; 10-20 g / L of R-binaphthol, 10-20 g / L of potassium sodium tartrate, 30-50 g / L of buffering agents and 10-15 g / L of antioxidants according to the mass concentration; and the cyanide-free tin-bronze electroplating solution for the steel parts adopts water as solvents. The invention further discloses the preparation method and the electroplating method of the cyanide-free tin-bronze electroplating solution for the steel parts. The cyanide-freetin-bronze electroplating solution for the steel parts, prepared with the above preparation method, is used for electroplating according to the electroplating method provided by the invention; coatings obtained by electroplating are distributed evenly and smoothly, and are large in thickness and high in glossiness; and the adhesive force between the coatings and the substrate of the steel parts isimproved obviously, and the electroplating solution, and the preparation method and an electroplating method thereof have wide application prospects.