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Cyanide-free sulfite gold plating solution and application thereof

A cyanide-free, cyanosulfite-free technology, applied in the field of gold plating, can solve the problems of unpredictable gold plating weight, poor plating solution dispersibility, low current density, etc. Side reactions, the effect of improving current efficiency

Active Publication Date: 2016-08-17
SHENZHEN UNITED BLUEOCEAN TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to promote and stabilize the current efficiency of cyanide-free sulfite gold plating solution (also referred to as cyanide-free gold plating solution herein), under the premise of not affecting the performance of the gold-plated layer, solve the problem that the gold-plated weight cannot be caused by low efficiency. Problems such as accurate prediction, relatively poor bath dispersibility and low current density

Method used

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specific Embodiment approach 1

[0025] Specific embodiment 1: the content of the gold sulfite salt is 8-15g / L in terms of gold elements, the content of the alkali metal sulfite salt is 30-150g / L, and the 3-nitrobenzenesulfonate The content of the organic polyamine is 1.5-12g / L, the content of the organic polyamine is 20-45g / L, the content of the organic phosphonate is 10-30 / L, and the content of the polyol compound is 0.03-0.2 / L L, the content of the high molecular polymer containing imine is 200-600 mg / L and the content of the thiourea derivative is 150-450 mg / L.

specific Embodiment approach 2

[0026] Specific embodiment 2: the content of the gold sulfite salt is 9-13g / L in terms of gold elements, the content of the alkali metal sulfite salt is 50-120g / L, and the 3-nitrobenzenesulfonate The content of the organic polyamine is 2-10g / L, the content of the organic polyamine is 25-40g / L, the content of the organic phosphonate is 15-25g / L, and the content of the polyol compound is 0.05-0.15g / L, the content of the high molecular polymer containing imine is 250-500 mg / L and the content of the thiourea derivative is 200-400 mg / L.

specific Embodiment approach 3

[0027] Specific embodiment 3: the content of the gold sulfite salt is 10-12g / L in terms of gold elements, the content of the alkali metal sulfite salt is 60-90g / L, and the 3-nitrobenzenesulfonate The content of the organic polyamine is 4-8g / L, the content of the organic polyamine is 30-35g / L, the content of the organic phosphonate is 18-24g / L, and the content of the polyol compound is 0.1-0.24g / L, the content of the high molecular polymer containing imine is 300-400 mg / L and the content of the thiourea compound is 250-350 mg / L.

[0028] The gold sulfite may be at least one of sodium gold sulfite, potassium gold sulfite and ammonium gold sulfite; preferably, the gold sodium sulfite is sodium gold sulfite and / or ammonium gold sulfite. The gold sulfite is used to provide gold-containing raw materials as a supplement after gold consumption in the gold plating process.

[0029] The alkali metal sulfite can be at least one of sodium sulfite, potassium sulfite and ammonium sulfite;...

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PUM

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Abstract

The invention relates to the field of gold plating, and discloses a cyanide-free sulfite gold plating solution and application thereof. The cyanide-free sulfite gold plating solution is prepared from gold sulfite, alkali metal sulfite, 3-nitrobenzenesulfonate, organic polyamine, organic phosphonate, polyhydric alcohol compounds, a macromolecular polymer containing imine and thiourea compounds. The cyanide-free sulfite gold plating solution contains a current efficiency stabilizer with the excellent property, the current efficiency stabilizer participates in the cathode reduction process in the gold plating process to inhibit side reactions from occurring, therefore, the current efficiency is improved, and the cyanide-free sulfite gold plating solution is obviously beneficial for improving the uniform plating capacity of the plating solution; in addition, a series of the problems that the gold plating amount cannot be accurately estimated, the plating solution dispersing capacity is relatively poor, and the current density is low due to the unstable current efficiency caused by the low current are solved.

Description

technical field [0001] The invention relates to the field of gold plating, in particular to a cyanide-free sulfite gold plating solution and the application of the cyanide-free sulfite gold plating solution in preparing gold products. Background technique [0002] With the improvement of people's living standards, gold products are more and more favored by consumers. At present, more and more gold products are produced by electroplating. [0003] Although the cyanide-free sulfite gold plating technology has been available for more than 40 years, it is mainly limited by several factors such as technical difficulty, process cost and practicality, so it is rarely used in the current gold plating industry. But it is also the most researched technology in the development of gold plating technology at this stage, and it is a new technology that is most likely to replace the toxic and harmful cyanide gold plating technology. From the perspective of long-term development of the ind...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/48
CPCC25D3/48
Inventor 邓川
Owner SHENZHEN UNITED BLUEOCEAN TECH DEV
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