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A kind of cyanide-free sulfite gold plating solution and its application

A cyanide-free sulfite and gold sulfite technology, applied in the field of gold plating, can solve the problems of unpredictable gold plating weight, low current density, poor plating solution dispersion ability, etc. Reaction, the effect of improving throwing power

Active Publication Date: 2017-05-03
SHENZHEN UNITED BLUEOCEAN TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to promote and stabilize the current efficiency of cyanide-free sulfite gold plating solution (also referred to as cyanide-free gold plating solution herein), under the premise of not affecting the performance of the gold-plated layer, solve the problem that the gold-plated weight cannot be caused by low efficiency. Problems such as accurate prediction, relatively poor bath dispersibility and low current density

Method used

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Experimental program
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specific Embodiment approach 1

[0025] Specific embodiment 1: the content of the gold sulfite salt is 8-15g / L in terms of gold elements, the content of the alkali metal sulfite salt is 30-150g / L, and the 3-nitrobenzenesulfonate The content of the organic polyamine is 1.5-12g / L, the content of the organic polyamine is 20-45g / L, the content of the organic phosphonate is 10-30 / L, and the content of the polyol compound is 0.03-0.2 / L L, the content of the high molecular polymer containing imine is 200-600 mg / L and the content of the thiourea derivative is 150-450 mg / L.

specific Embodiment approach 2

[0026] Specific embodiment 2: the content of the gold sulfite salt is 9-13g / L in terms of gold elements, the content of the alkali metal sulfite salt is 50-120g / L, and the 3-nitrobenzenesulfonate The content of the organic polyamine is 2-10g / L, the content of the organic polyamine is 25-40g / L, the content of the organic phosphonate is 15-25g / L, and the content of the polyol compound is 0.05-0.15g / L, the content of the high molecular polymer containing imine is 250-500 mg / L and the content of the thiourea derivative is 200-400 mg / L.

specific Embodiment approach 3

[0027] Specific embodiment 3: the content of the gold sulfite salt is 10-12g / L in terms of gold elements, the content of the alkali metal sulfite salt is 60-90g / L, and the 3-nitrobenzenesulfonate The content of the organic polyamine is 4-8g / L, the content of the organic polyamine is 30-35g / L, the content of the organic phosphonate is 18-24g / L, and the content of the polyol compound is 0.1-0.24g / L, the content of the high molecular polymer containing imine is 300-400 mg / L and the content of the thiourea compound is 250-350 mg / L.

[0028] The gold sulfite may be at least one of sodium gold sulfite, potassium gold sulfite and ammonium gold sulfite; preferably, the gold sodium sulfite is sodium gold sulfite and / or ammonium gold sulfite. The gold sulfite is used to provide gold-containing raw materials as a supplement after gold consumption in the gold plating process.

[0029] The alkali metal sulfite can be at least one of sodium sulfite, potassium sulfite and ammonium sulfite;...

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PUM

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Abstract

The invention relates to the field of gold plating, and discloses a cyanide-free sulfite gold plating solution and an application thereof. The cyanide-free sulfite gold plating solution contains gold sulfite, alkali metal sulfite, and 3-nitrobenzenesulfonic acid Salts, organic polyamines, organic phosphonates, polyol compounds, high molecular polymers containing imines, and thiourea compounds. The cyanide-free sulfite gold plating solution provided by the present invention contains a current efficiency stabilizer with excellent properties, which participates in the reduction process of the cathode during the gold plating process, and prevents the occurrence of chemical side reactions, thereby improving the current efficiency, which is obviously beneficial Improve the throwing ability of the plating solution. And it improves a series of problems such as the inaccurate prediction of the amount of gold plating caused by the low current and unstable current efficiency, the relatively poor dispersion ability of the plating solution and the low current density.

Description

technical field [0001] The invention relates to the field of gold plating, in particular to a cyanide-free sulfite gold plating solution and the application of the cyanide-free sulfite gold plating solution in preparing gold products. Background technique [0002] With the improvement of people's living standards, gold products are more and more favored by consumers. At present, more and more gold products are produced by electroplating. [0003] Although the cyanide-free sulfite gold plating technology has been available for more than 40 years, it is mainly limited by several factors such as technical difficulty, process cost and practicality, so it is rarely used in the current gold plating industry. But it is also the most researched technology in the development of gold plating technology at this stage, and it is a new technology that is most likely to replace the toxic and harmful cyanide gold plating technology. From the perspective of long-term development of the ind...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/48
CPCC25D3/48
Inventor 邓川
Owner SHENZHEN UNITED BLUEOCEAN TECH DEV
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