68results about How to "Test may pass" patented technology

The present invention provides a multilayer film for forming medical solution pouches that help prevent or reduce the presence of bubbles or foam in the solution after heat sterilization. In particular, the present invention provides a multilayer film for forming medical solution pouches that are capable of passing the bubble test as set forth in the Chinese State Drug Package Container Material Standard No. YBB00112005. In particular, the present invention provides a multilayer film in which polyamide 612 or calcium stearate component has been incorporated as an anti-foaming agent. The presence of polyamide 612 or calcium stearate in one or more layers of the film helps prevent the formation of foam in the solution after heat sterilization.

A window shutter has corrosion resistant stiles with a non-metallic core and louvers, and non-metallic top and bottom rails. The shutter is resistant to the adverse effects of sunlight, humidity, rain and wind, and will retard flying objects, and will pass commonly used missile tests for building materials. The resulting shutter will also withstand substantial stresses from wind loads, so as to perform satisfactorily in wind load tests. The window covering of the invention is substantially maintenance free.

An improved fire-blocking gasket profile for a fire-rated joint, such as a head-of-wall assembly. Fire-rated joints are aimed at inhibiting or preventing fire, heat, or smoke from leaving one portion of a building and entering another portion of a building. Fire-rated joints can also accommodate movement between adjacent building structures, such as between a ceiling and the top of a wall. The improved fire-blocking gasket profile includes a first layer formed of an intumescent material, a second layer formed of a foil lining and a third layer formed of the vinyl profile. The vinyl profile includes an air gap with the intumescent material positioned therein. A vertical portion of the vinyl profile is positioned between a header track and a wallboard in the fire-rated joint. A horizontal portion of the vinyl profile is positioned at least partially within a deflection gap and sealingly engages with the ceiling.

A device with a solder joint made of a copper contact pad (210) of certain area (202) and an alloy layer (301) metallurgically attached to the copper pad across the pad area. The alloy layer contains copper / tin alloys, which include Cu6Sn5 intermetallic compound, and nickel / copper / tin alloys, which include (Ni,Cu)6Sn5 intermetallic compound. A solder element (308) including tin is metallurgically attached to the alloy layer across the pad area. No fraction of the original thin nickel layer is left after the reflow process. Copper / tin alloys help to improve the drop test performance, nickel / copper / tin alloys help to improve the life test performance.

Embodiments of the invention provide roofing boards and roofing systems having improved fire resistance properties and methods related to the same. According to one aspect, a roofing system is provided. The roofing system includes roofing panels positioned atop structural support members to form a roof deck. Roofing boards are positioned atop the roof deck and coupled thereto and a roofing membrane is positioned atop the roofing boards and coupled therewith. The roofing boards include a coating of a mineral based material applied to one or more surfaces in an amount between the range of about 0.10 lbs / ft2 and about 0.70 lbs / ft2. The mineral based material coating enables the roofing boards to pass the UL 790 class A tests, such as the burning brand test.

A vehicle for carrying active ingredients, wherein the vehicle is water-free, emulsifier-free, and preservative free. Preferably, the vehicle is used to carry a skin care formulation for treating skin conditions that provides noticeable results within two weeks or less.

A device with a solder joint made of a copper contact pad (210) of certain area (202) and an alloy layer (301) metallurgically attached to the copper pad across the pad area. The alloy layer contains copper / tin alloys, which include Cu6Sn5 intermetallic compound, and nickel / copper / tin alloys, which include (Ni,Cu)6Sn5 intermetallic compound. A solder element (308) including tin is metallurgically attached to the alloy layer across the pad area. No fraction of the original thin nickel layer is left after the reflow process. Copper / tin alloys help to improve the drop test performance, nickel / copper / tin alloys help to improve the life test performance.