Preparation method of reverse copper foil

Abstract

The invention discloses a preparation method of reverse copper foil. The preparation method of the reverse copper foil comprises the following steps of electrolytic bath arrangement, addition agent addition, stirring operation, primary electroplating operation, primary roughening operation, primary curing operation, secondary electroplating operation, secondary roughening operation, secondary curing operation, cleaning operation, anti-oxidation treatment and drying operation. A titanium iridium anode plate and a titanium roller are adopted, an electrolytic solution is used in an electrolytic bath, specifically, the copper content of the electrolytic solution ranges from 130g / L to 220g / L, and the sulfuric acid content of the electrolytic solution ranges from 70g / L to 100g / L. When addition agents are added, the electrolytic solution is heated to enable the temperature to range from 45 DEG C to 50 DEG C, and 5-10 parts of WH-001 addition agents, 3-5 parts of WH-002 addition agents and 2-3parts of WH-003 addition agents by mass are added to 1000 parts of electrolytic solutions by volume every hour. When the secondary electroplating operation is conducted, 5-10 parts of WH-004 additionagents by mass are added. When the secondary roughening operation is conducted, 5-15 parts of WH-005 addition agents by mass are added, and the secondary roughening operation is accomplished. By theadoption of the technology, the potential barrier of metal nucleation is reduced, the nucleation speed is increased, high-density copper particle crystals can be formed on the surface of the copper foil, the non-uniformity degree of the surface is reduced, the mechanical property of the copper foil is improved, and therefore the tensile strength and the peeling resistance strength of the copper foil are improved.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil, in particular to a preparation method of reverse electrolytic copper foil. Background technique [0002] Copper foil is a negative electrolytic material, a thin, continuous layer of metal foil deposited on the base layer of the circuit board, which acts as a conductor for the PCB. Copper foil is electrodeposited copper foil in English, which is an important material for the manufacture of copper clad laminates (CCL) and printed circuit boards (PCB). In the rapid development of today's electronic information industry, electrolytic copper foil is called: the "neural network" of electronic product signal and power transmission and communication. It easily adheres to the insulating layer, accepts the printed protective layer, and forms a circuit pattern after etching. Copper foil has low surface oxygen characteristics, can be attached to various substrates, such as metals, insulati...

AI Technical Summary

Problems solved by technology

However, in the prior art, due to the uneven distribution of crystalline particles on the surface of copper foil, the following problems are caused:

[0004] First, the tensile strength and elongation of the traditional copper foil for circuit boards are low, and it is easy to cause wrinkles during the lamination process;

[0005] Second, the traditional copper foil used for circuit boards has a thick outline, which is easy to cause residual copper after etching of circuit boards;

[0006] Third, the copper foil used for traditional circuit boards has coarse surface crystals, which makes the anti-peeling strength low;

[0007] Fourth, the copper foil used for traditional circuit boards is too thick, and high-frequency circuit boards or multi-layer circuit boards will produce self-excitation and capacitive effects

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