Disclosed herein is a method of manufacturing a laminate for a flexible
printed circuit board, including surface treating a base film, forming a tie layer on the base film, forming a
metal conductive layer on the tie layer, and depositing a
metal on the
metal conductive layer by radiating electronic beams to form a metal plated layer thereon, all of which are conducted in a
vacuum chamber. In addition, an apparatus for manufacturing a laminate for a flexible
printed circuit board is provided, including an unwinding roller for unwinding a base film therefrom, film guide rollers for guiding and transferring the base film, a surface treating part for surface treating the transferred base film, tie layer and
copper conductive layer forming parts for sequentially forming a tie layer and a metal conductive layer on the surface treated base film, a vacuum depositing part for depositing a metal on the metal conductive layer by radiating electronic beams to form a metal plated layer thereon, and a winding roller for winding the base film having the metal plated layer formed thereon, all of which are provided in a
vacuum chamber. The vacuum depositing part includes a metal boat, an
electron gun for radiating electronic beams onto the metal boat, and a main depositing drum for depositing a metal on the metal conductive layer by radiating electronic beams to form the metal plated layer thereon when the base film is in contact with the depositing drum.