The invention provides a method for forming a COF circuit and relates to the technical field of integrated circuits. The method for forming the COF circuit comprises steps that S1, a base material ispunched, and guide holes on two sides of the base material are punched; S2,
photoresist printing of a punched product is performed, and a required
photoresist pattern is printed on a surface of a
copper foil and cured; S3, the product printed with the
photoresist pattern is etched, and the
copper which is not covered by the photoresist under the action of an
etching solution is removed; and S4, afilm of the etched product is stripped, the photoresist pattern protected on the
copper surface is removed, and the circuit pattern is exposed. The method is advantaged in that circuit forming is carried out in a printing manner, operations of
exposure and development processes are omitted, so occurrence of bad
short circuit conditions is reduced, cost of the
exposure and development processes isgreatly saved, a
product processing period can be shortened, and equipment cost is greatly reduced.