Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method of forming conductive totem by using gravure printing mode

A kind of gravure printing and totem technology, which is applied in the direction of removing conductive materials by chemical/electrolytic methods, directly printing exposure masks, patterns and photolithography, and can solve the problems of high process cost and high complexity

Inactive Publication Date: 2017-06-09
CHEESHIN TECHNOLOGY CO LTD
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The main purpose of the present invention is to provide a method for forming a conductive totem by means of gravure printing, which solves the problems of high cost and high complexity in the prior art that require the use of equipment such as yellow light development for the process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method of forming conductive totem by using gravure printing mode
  • Method of forming conductive totem by using gravure printing mode
  • Method of forming conductive totem by using gravure printing mode

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] Relating to the detailed description and technical contents of the present invention, it is now described as follows with regard to the accompanying drawings:

[0039] see figure 1 and Figure 2A to Figure 2F As shown, the present invention is a method for forming a conductive totem by means of gravure printing, which includes the following steps:

[0040] S1: if Figure 2A As shown, a conductive layer 20 is formed on a substrate 10. In this embodiment, the conductive layer 20 is formed on the substrate 10 by sputtering, and the material of the substrate 10 can be polyethylene terephthalic acid Ethylene glycol ester, polyethylene glycol dicarboxylate, cellulose triacetate, polylactic acid or combinations thereof, etc., the material of the conductive layer 20 can be conductive materials such as metals such as gold, silver, copper, or non-metallic conductive materials , and in this embodiment, the thickness of the conductive layer 20 is less than 5 microns, the reason ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Widthaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a method of forming a conductive totem by using a gravure printing mode. A conductive layer is firstly formed on a substrate; the gravure printing mode is then used to form a shielding protection totem on the conductive layer; and finally, the conductive layer is etched, and the conductive layer forms a conductive totem corresponding to the shielding protection totem. With the help of the gravure printing mode, the shielding protection totem can be formed directly without processes such as yellow light exposure and development, and thus, the process complexity can be reduced to improve the process speed, and the stock use is reduced to reduce the cost.

Description

technical field [0001] The invention relates to a method for forming a conductive totem, in particular to a method for forming a conductive totem by gravure printing. Background technique [0002] With the advancement of science and technology, technology products are developing in the direction of thinner, thinner and smaller. Therefore, integrated circuits are widely used in various electronic products. In the manufacturing process, it is necessary to make extremely fine-sized circuits on the substrate. When patterning, it is mainly achieved by etching lithography technology. [0003] For example, "A method for preparing a circuit board with a patterned conductive layer" in Taiwan Patent Announcement No. I459875, the manufacturing method is to first set a conductive layer on a substrate, and then set a photolithographic layer on the conductive layer. Then, a photomask layer with a predetermined pattern is set on the photoresist layer, and a radiation light is applied to t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/06
CPCH05K3/06H05K2203/0551
Inventor 许国诚
Owner CHEESHIN TECHNOLOGY CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products