A film applying apparatus 10 is provided with preparatory bonding rolls 20A, 20B and laminating rolls 21A, 21B, and a laminated film 12 wound out from a film roll 18 and a substrate 16 conveyed by a substrate conveying device 14 pass between these rolls and pressure bonding is performed. Diameter of the preparatory bonding rolls 20A, 20B is made smaller than diameter of the laminating rolls 21A, 21B and range of elastic deformable area S1 at the roll surface at grasping starting of the substrate and the laminated film 12 by the preparatory bonding rolls 20A, 20B is made small thereby range of generating, air holding or the like is limited to small.