146results about How to "Secure bonding" patented technology

An acoustic structure that includes a honeycomb having cells in which septum caps are located. The septum caps are formed from sheets of acoustic material and include a resonator portion and a flange portion. The flange portion has an anchoring surface that provides frictional engagement of the septum caps to the honeycomb cells when the caps are inserted into the honeycomb during fabrication of the acoustic structure. An adhesive is applied to the anchoring surface of the septum caps after the caps have been inserted into the honeycomb cells to provide a permanent bond.

An acoustic structure that includes a honeycomb having cells in which septum caps are located. The septum caps are formed from sheets of acoustic material and include a resonator portion and a flange portion. The flange portion has an anchoring surface that provides frictional engagement of the septum caps to the honeycomb cells when the caps are inserted into the honeycomb during fabrication of the acoustic structure. An adhesive is applied to the anchoring surface of the septum caps after the caps have been inserted into the honeycomb cells to provide a permanent bond.

An acoustic structure that includes a honeycomb having cells in which septum caps are located. The septum caps are formed from sheets of flexible material that may be perforated before or after the material is inserted into the honeycomb. The flexible material is sufficiently flexible to allow folding into the shape of a septum cap. The flexible material is also sufficiently stiff to provide frictional engagement and locking of the septum cap to the honeycomb cell when the cap is inserted into the honeycomb during fabrication of the acoustic structure. An adhesive is applied to the septum caps after the caps have been inserted into the honeycomb cells to provide a permanent bond.

Thermoplastic products such as vehicle cargo area liners, floor mats, recreational and playground equipment, cargo pallets, and wet area walking surfaces are provided with an antislip surface treatment. The antislip surface is made up of individual non-interconnected asperities of an antislip polymer material, which do not form a continuous film over the surface of the thermoplastic product. The thermoplastic product is especially made of high density polyethylene. The antislip polymer is preferably a thermoset polymer, and most particularly is a polyurea / isocyanate polymer. The antislip polymer is preferably applied by spraying, and then the product is heat treated at a temperature in the range from 100 to 200° F., or is thermoformed at a temperature in the range from 250 to 550° F. The antislip asperities are durably bonded onto the thermoplastic base material, and provide a significantly increased coefficient of friction. The asperity size, height, and hardness can be controlled by adjusting the processing conditions. The asperities may have an increased surface relief due to a so-called "moth effect" and an increased surface roughness due to cratering as a result of a so-called "volcano effect" in the process using thermoforming.

Surface-modified discontinuous glass fibers are provided for incorporation in a thermoplastic matrix to form a fiber-reinforced composite article by injection or compression molding which displays enhanced mechanical properties, including improved tensile strength. Good binding between the discontinuous glass fibers and the thermoplastic matrix is achieved through the presence of finely roughened surfaces on the fibers of nanoparticles of an inorganic material. Such nanoparticles are provided from an alkaline aqueous size composition containing the nanoparticles dispersed therein (as described). The glass fibers are initially provided in continuous form followed by cutting into discontinuous lengths and drying with the retention of the nanoparticles on the surfaces of the fibers. Improved color in the resulting injection or compression molded thermoplastic discontinuous glass fiber-reinforced composite articles is made possible in combination with enhanced mechanical properties.

A composition for producing an optically clear, well bonded superhydrophobic coating includes a plurality of hydrophobic particles comprising an average particle size of about 200 nm or less, a binder at a binder concentration of from about 0.1 wt. % to about 0.5 wt. %, and a solvent. The hydrophobic particles may be present in the composition at a particle concentration of from about 0.1 wt. % to about 1 wt. %. An optically transparent, superhydrophobic surface includes a substrate, a plurality of hydrophobic particles having an average particle size of about 200 nm or less dispersed over the substrate, and a discontinuous binder layer bonding the hydrophobic particles to the substrate, where the hydrophobic particles and the binder layer form an optically transparent, superhydrophobic coating.

A nano-particle comprising: an interior region comprising a mixed-metal oxide; and an exterior surface comprising a pure metal. In some embodiments, the mixed-metal oxide comprises aluminum oxide and a metallic pinning agent, such as palladium, copper, molybdenum, or cobalt. In some embodiments, the pure metal at the exterior surface is the same as the metallic pinning agent in the mixed-metal oxide in the interior region. In some embodiments, a catalytic nano-particle is bonded to the pure metal at the exterior surface. In some embodiments, the interior region and the exterior surface are formed using a plasma gun. In some embodiments, the interior region and the exterior surface are formed using a wet chemistry process. In some embodiments, the catalytic nano-particle is bonded to the pure metal using a plasma gun. In some embodiments, the catalytic nano-particle is bonded to the pure metal using a wet chemistry process.

A film applying apparatus 10 is provided with preparatory bonding rolls 20A, 20B and laminating rolls 21A, 21B, and a laminated film 12 wound out from a film roll 18 and a substrate 16 conveyed by a substrate conveying device 14 pass between these rolls and pressure bonding is performed. Diameter of the preparatory bonding rolls 20A, 20B is made smaller than diameter of the laminating rolls 21A, 21B and range of elastic deformable area S1 at the roll surface at grasping starting of the substrate and the laminated film 12 by the preparatory bonding rolls 20A, 20B is made small thereby range of generating, air holding or the like is limited to small.

A highly reliable bonding process is provided. The wire bonding method includes: (a) bonding a tip portion of a wire to a first electrode by pressing an open end section of a first hole of a first tool against the tip portion of the wire that is passed through the first hole and protrudes outside the first hole, and (b) bonding a part of a section of the wire that is lead out from the first electrode to a second electrode. The first tool is passed through a second hole of a second tool. The width of an open end section of the second hole is formed greater than the width of the open end section of the first hole. The step (b) is conducted by pressing the open end section of the second hole against the part of the wire.

A composite material is produced from carpet waste and a binding agent, in intimate association, and may also include wood fiber or chips and / or other additives. A method of manufacturing a composite material includes shredding carpet waste, coating the carpet waste with a binding agent, and subjecting the shredded, coated carpet waste to elevated heat and pressure. As an additional step, the composite material may be actively cooled to prevent deformation of the material.

A thermoresistance adhesive which does not dissolve in the sealer-composing resins at the sealer molding temperature and is capable of providing a semiconductor chip / lead frame adhesive strength under shear of 1 N / 4 mm2 or greater, and including, for example, amide, imide, ester or ether linkage is suited for use in producing thermoresistance adhesive solutions and thermoresistance resin pastes, and the semiconductor chips, lead frames, films, etc., made by using such an adhesive are suited for providing low-cost semiconductor devices.

An acoustic structure that includes a honeycomb having cells in which septum caps are located. The septum caps are formed from sheets of flexible material that may be perforated before or after the material is inserted into the honeycomb. The flexible material is sufficiently flexible to allow folding into the shape of a septum cap. The flexible material is also sufficiently stiff to provide frictional engagement and locking of the septum cap to the honeycomb cell when the cap is inserted into the honeycomb during fabrication of the acoustic structure. An adhesive is applied to the septum caps after the caps have been inserted into the honeycomb cells to provide a permanent bond.

The present invention relates to a repair method using a pre-cured repairing patch, and a repaired product obtained from repairing using the repairing patch, and the present invention securely bonds a repairing patch, where an out-of-plane stiffness is required, to a repair target. In order to cover a repair target portion 23 formed in an outer panel 2 with a repairing patch 30, and bond the repairing patch 30 to a repair target, repairing plates 31, 32 that are formed of fibers and thermosetting resin, and pre-cured before repairing are used as the repairing patch 30, and a laminating step S4 of laminating the repairing plates 31, 32, and a bonding step S7 of bonding the repairing plates 31, 32 to each other are performed.