97results about How to "Sufficient adhesiveness" patented technology

A polarizing plate with an optical compensation layer is provided, which has an excellent peelability and is easy to reattach after mounted on an image display apparatus. A pressure-sensitive adhesive layer satisfying the condition (I) below is formed on both surfaces of an optical compensation layer, and one of the pressure-sensitive adhesive layers is further laminated with a polarizing plate. condition (I): in the case where a pressure-sensitive adhesive layer causing the optical compensation layer and the polarizing plate to adhere to each other is expressed by a pressure-sensitive adhesive layer (A) and the other pressure-sensitive adhesive layer is expressed by a pressure-sensitive adhesive layer (B) and attached to a glass substrate, the pressure-sensitive adhesive layer (A) causing the optical compensation layer and the polarizing plate to adhere to each other has an adhesive strength exceeding 12 N / 25 mm, and the pressure-sensitive adhesive layer (B) causing the optical compensation layer and the glass substrate to adhere to each other has an adhesive strength of 1 to 10 N / 25 mm.

A thermoresistance adhesive which does not dissolve in the sealer-composing resins at the sealer molding temperature and is capable of providing a semiconductor chip / lead frame adhesive strength under shear of 1 N / 4 mm2 or greater, and including, for example, amide, imide, ester or ether linkage is suited for use in producing thermoresistance adhesive solutions and thermoresistance resin pastes, and the semiconductor chips, lead frames, films, etc., made by using such an adhesive are suited for providing low-cost semiconductor devices.

A heat shrinkable polyester film of the present invention has a transverse tear defect percentage of about 20% or less as determined in the following vibration test: the film is rolled into a tubular shape, two of its opposite edges bonded together, and then the tubular film is placed around a vertical stack (total weight: 660 g) of three food container cans each having a diameter of 72 mm and a height of 55 mm; the can stack with the tubular film placed therearound is passed through a shrink tunnel to shrink the tubular film onto the can stack; a total of 18 packs of such can stacks are placed into a cardboard box having a length of 455 mm, a width of 230 mm and a height of 165 mm (6 packs in the length direction by 3 packs in the width direction), and the cardboard box is sealed; the cardboard box is vibrated along the width direction for 30 min by a stroke of 50 mm and at a vibration rate of 180 reciprocations / min, after which the transverse tearage of the tubular film is visually observed; and the transverse tear defect percentage (%) is determined based on the number of defective packs per 18 packs, wherein the defective pack is any pack having a tear flaw of 30 mm or longer along a can periphery. The heat shrinkable polyester film of the present invention has a good shock resistance during shipping especially under low temperatures, with a good finish after shrinkage and a sufficient solvent adhesiveness. Thus, the heat shrinkable polyester film of the present invention is suitable for use in a multi-packaging label for packaging, inter alia, a stack of cans.

A polarizing plate with an optical compensation layer is provided, which has an excellent peelability and is easy to reattach after mounted on an image display apparatus. A pressure-sensitive adhesive layer satisfying the condition (I) below is formed on both surfaces of an optical compensation layer, and one of the pressure-sensitive adhesive layers is further laminated with a polarizing plate.condition (I): in the case where a pressure-sensitive adhesive layer causing the optical compensation layer and the polarizing plate to adhere to each other is expressed by a pressure-sensitive adhesive layer (A) and the other pressure-sensitive adhesive layer is expressed by a pressure-sensitive adhesive layer (B) and attached to a glass substrate, the pressure-sensitive adhesive layer (A) causing the optical compensation layer and the polarizing plate to adhere to each other has an adhesive strength exceeding 12 N / 25 mm, and the pressure-sensitive adhesive layer (B) causing the optical compensation layer and the glass substrate to adhere to each other has an adhesive strength of 1 to 10 N / 25 mm.

Disclosed is a light-transmitting electromagnetic-shielding laminate, which is characterized in that two or more layers including an electromagnetic-shielding layer are arranged in layers using a (meth)acrylate adhesive composition which contains a (meth)acrylate monomer, a (meth)acrylate oligomer and at least one member selected from the group consisting of acrylic amide derivatives, silane compounds and organophosphorus compounds. Also disclosed is a light-transmitting radio wave absorber which is characterized in that a resistive layer, a dielectric spacer and a reflective layer are arranged in layers using a (meth)acrylate adhesive composition which contains a (meth)acrylate monomer, a (meth)acrylate oligomer and at least one member selected from the group consisting of acrylic amide derivatives, silane compounds and organophosphorus compounds.

The invention relates to a touch screen protector for a hand held electronic device having a front face that includes a touch screen portion and a non-functional band. The touch screen protector of the invention comprises a plastic film having front and back sides, an outer perimeter that corresponds to that of the device, and a transparent window; a spacer provided along the outer perimeter of the plastic film surrounding the transparent window, having a thickness sufficient to space the plastic film near but not in contact with the touch screen portion; an exposed adhesive for removably mounting the protector upon the outer perimeter of the front face to form an enclosed air space between the transparent window of the plastic film, the spacer and the touch screen portion of the device; and a joining adhesive for adhering the spacer to the back side of the plastic film.

Provided is such a pressure-sensitive adhesive tape as described below, which is capable of protecting the uneven surface of a member having unevenness on its surface. The pressure-sensitive adhesive tape brings together sufficient pressure-sensitive adhesiveness for, and sufficient releasability from, the member. In addition, even upon deformation of the member protected with the pressure-sensitive adhesive tape by, for example, lamination or continuous winding, the uneven shape does not deform and a base material layer in the pressure-sensitive adhesive tape is not damaged. Also provided is a pressure-sensitive adhesive tape useful as such a surface protective film for a prism sheet as described below, which is capable of effectively protecting, for example, a lens surface of a prism sheet having multiple triangle pole-shaped prisms fixed on its surface. The surface protective film brings together sufficient pressure-sensitive adhesiveness for, and sufficient releasability from, the prism sheet. In addition, when the prism sheet protected with the surface protective film is brought into a state such as a laminated state or a continuously wound state, the emergence of irregularity (indentation) in the external appearance of the prism sheet to which the surface protective film is attached can be suppressed. A pressure-sensitive adhesive tape of the present invention is a pressure-sensitive adhesive tape including a base material layer, a first pressure-sensitive adhesive layer, and a second pressure-sensitive adhesive layer in the stated order, in which: the base material layer contains a thermoplastic resin; the storage modulus of the first pressure-sensitive adhesive layer is higher than the storage modulus of the second pressure-sensitive adhesive layer; and a difference between the storage modulus of the first pressure-sensitive adhesive layer at a frequency of 10 Hz and 23° C., and the storage modulus of the second pressure-sensitive adhesive layer at a frequency of 10 Hz and 23° C. is 3×105 Pa or more.

An electrically continuous conformal EMI protective shield for conformingly adhering directly to surfaces of a printed circuit board is disclosed. The EMI protective shield comprises a dielectric coating and a conductive coating. The dielectric coating adheres directly to surfaces of the printed circuit board to provide an electrically nonconductive, contiguous coating that covers all such printed circuit board surfaces. The conductive coating comprises a substantially contiguous layer of an intrinsically conducting polymer adhering directly to surfaces of the dielectric coating to provide an electrically conductive layer that prevents the passage of electromagnetic emissions through the conformal EMI shield.

Disclosed is a highly adhesive polyester film having a highly adhesive primer layer disposed on at least one side of a substrate polyester film. The substrate polyester film is a stretched film having linear tearability and formed of a mixed polyester resin containing polyethylene terephthalate and a modified polybutylene terephthalate, and the highly adhesive primer layer contains a polyester resin (A) having an acid number of 20 to 60 mg KOH / g and a hydroxyl number of 30 to 150 mg KOH / g, and having an oligomer content of 2.0% by mass or less, and substantially contains no crosslinking agent component.

A tacky mat is made from a tacky elastomeric polymer composition for releasably securing a portable roll dispenser to a surface and a portable roll dispenser on which a tacky mat is arranged, preferably on the bottom of the dispenser, wherein the mat is made from a tacky elastomeric polymer composition.

An electrically continuous conformal EMI protective shield for adhering directly to and conforming with surfaces of a printed circuit board is disclosed. The conformal EMI shield includes a thermally conductive dielectric coating adhering directly to surfaces of the printed circuit board to provide an electrically nonconductive, thermally conductive, contiguous coating that covers all such printed circuit board surfaces. The conformal EMI shield also includes a conductive coating adhering directly to surfaces of the dielectric coating to provide an electrically conductive layer that prevents electromagnetic emissions from passing through the conformal EMI protective shield.

An exemplary embodiment provides a stackable container for gemstones that has an optically clear lid having an optically planar upper surface with a first optical property, such as a refractive index. The lid has an underside coating of a clear gel adhesive having a second optical property matched with the first optical property to minimize optical distortion. The gel releasably adheres gemstones to the lid. The base and lid of the stackable container clamp releasably together without hinges and without a snap fit closure. The container has a gemstone containment volume wherein gemstones appear to “float” and can be examined. For stackability, an upper region of the lid mounts releasably to an underside of a base of a like second stackable container; and the base mounts releasably to an upper region of a lid of a like third stackable container such that a plurality of stackable containers are stackable in an array.

A printed wiring board has a first wiring layer formed at least on one surface of an insulative substrate, an insulating layer formed as covering the first wiring layer, and a second wiring layer formed on the insulating layer. The insulating layer is formed of a cured insulative sheet made of a high-stiff sheet-type reinforcing material containing resin. The first and second wiring layers are electrically connected to each other through at least one hole having a bottom. The second wiring layer is united with the insulating layer at an interface thereof with a conductive material of the second wiring layer injected into concave sections provided on the interface. Another printed wiring board has an insulative substrate having a first surface and a second surface, a first insulating layer and a second insulating layer formed on the first surface and the second surface, respectively, and a first wiring layer formed on the first insulating layer and a second wiring layer formed on the second insulating layer. The first and second wiring layers are electrically connected to each other via at least one through hole. The first wiring layer is united with the first insulating layer at an interface thereof with a conductive material of the first wiring layer injected into concave sections provided on the interface. The second wiring layer is united with the second insulating layer at an interface thereof with a conductive material of the first wiring layer injected into concave sections provided on the interface.

A multi-stage gasket having a multi-stage structure constituted by multiple kinds of gasket materials and being used by holding between a cover plate and a base plate, the multi-stage gasket having contactness of a gasket as the lowermost layer to the cover plate or the base plate in contact with the gasket that is higher than contactness of a gasket as the uppermost layer to the cover plate or the base plate in contact with the gasket. A gasket can be provided that provides good reworkability of a cover plate and a base plate of a hard disk device, provides sufficient adhesiveness of the gasket to a cover plate and a base plate even when used in a high humidity and temperature environment, and is prevented from being toppled sideways or peeled off even when applied with a force in an oblique direction.

A semiconductor device capable of reducing the thermal resistance in a flip chip packaging structure while achieving both the high radiation performance and manufacturing readiness without increasing the manufacturing cost is provided. In a semiconductor device having a semiconductor circuit for power amplification and a control circuit of the semiconductor circuit laminated on a multilayer circuit board, the semiconductor circuit for power amplification and the control circuit are aligned in parallel on the same semiconductor element, and the semiconductor element is flip-chip connected on the multilayer circuit board. Further, a second semiconductor element mounted in addition to the first semiconductor element and all components and submodules are flip-chip connected. Also, a plurality of bumps are united in order to improve the radiation performance and thermal vias of the multilayer circuit board are formed in second and lower layers of the wiring layers in the multilayer circuit board.

Disclosed is a light-transmitting electromagnetic-shielding laminate, which is characterized in that two or more layers including an electromagnetic-shielding layer are arranged in layers using a (meth)acrylate adhesive composition which contains a (meth)acrylate monomer, a (meth)acrylate oligomer and at least one member selected from the group consisting of acrylic amide derivatives, silane compounds and organophosphorus compounds. Also disclosed is a light-transmitting radio wave absorber which is characterized in that a resistive layer, a dielectric spacer and a reflective layer are arranged in layers using a (meth)acrylate adhesive composition which contains a (meth)acrylate monomer, a (meth)acrylate oligomer and at least one member selected from the group consisting of acrylic amide derivatives, silane compounds and organophosphorus compounds.