205results about How to "Improve installation density" patented technology

In an electronic parts packaging structure of the present invention constructed by stacking a plurality of sheet-like units in a thickness direction, each of the units includes a first insulating layer, wirings formed on one surface of the first insulating layer, a semiconductor chip (electronic parts) connected to the wirings, a second insulating layer formed on an one surface side of the first insulating layer to cover the semiconductor chip, and connecting portions (terminals and contact vias) for connecting electrically the wirings and wirings of other unit, wherein arrangement of the first insulating layer, the semiconductor chip, the wirings, and the second insulating layer is symmetrical between units adjacent in a thickness direction.

An interconnection element and method for making same is disclosed. The interconnection element may include a plurality of metal conductors, a plurality of solid metal bumps and a low melting point (LMP) metal layer. The solid metal bumps overly and project in a first direction away from respective ones of the conductors. Each bump has at least one edge bounding the bump in at least a second direction transverse to the first direction. The low melting point (LMP) metal layer has a first face joined to the respective ones of the conductors and bounded in the second direction by at least one edge and a second face joined to the bumps. The edges of the bumps and the LMP layer are aligned in the first direction, and the LMP metal layer has a melting temperature substantially lower than the conductors.

In an optical transmission node, a plurality of shelves, respectively connected to a plurality of optical cables having limitations on bending radius, are stored in one rack of the node. In a shelf body thereof, the first and second opening portions are made in a front surface, and an extra-cable looping device loops an extra portion of the optical cable, further a moving mechanism is provided for moving the extra-cable looping device to avoid a space occupied by the units in a state removed from the second opening portion, this enables extra-cable handling within a limited spatial range and the insertion / removal of the units having various functions from the shelf in a state where the cable is active and further the improvement of a shelf mounting density per rack.

A connection structure for connecting a differential signal transmission cable to a circuit board. A differential signal transmission cable includes an outer conductor provided around a pair of signal line conductors via an insulator. Parts of the signal line conductors are exposed from a tip of the differential signal transmission cable. A circuit board is provided with a pair of signal pads and a ground pad. A shield-connecting terminal includes a main body which is crimp-connected to the outer conductor and a solder-connecting pin which is solder-connected to the ground pad. The exposed parts of the signal line conductors are solder-connected to the signal pads, respectively, and the outer conductor is solder-connected to the ground pad via the solder-connecting pin of the shield-connecting terminal.

A semiconductor chip mounting wiring board 2 includes an insulating resin substrate 5, a first conductive bump 12 formed on one side of the insulative resin substrate 5 to mount a semiconductor chip 3, a wiring pattern 15 extending from the first conductive bump 12 toward the periphery of the insulating resin substrate 5, a filled viahole 9 leading from the other side of the insulating resin substrate 5 to the wiring pattern 15, and a second conductive bump 13, or a conductive pad 19, positioned just above the filled viahole 9 and electrically connected to the viahole 9. A semiconductor module is produced by mounting the semiconductor chip 3 in advance on the first conductive bump 12 on the semiconductor chip mounting wiring board 2 and stacking a plurality of the wiring boards 2 and interlayer members 20 each having an opening 27 to receive the semiconductor chip 3 and a conductive post 26 or conductive pad connected to the second conductive bump 13 of the wiring board 2 alternately on each other with an adhesive applied between them, placing another interconnecting circuit board such as an I / O wiring board 30 or the like on an outermost layer, and by applying hot-pressing to the stack. The semiconductor module thus produced has a high connection reliability and can be designed for a high mounting density and a lower profile.

A resin layer in which adhesion to a conductive film is higher than that of a sealing resin to the conductive film is disposed on the sealing resin in which it is difficult to form the conductive film, and wiring patterns electrically connected to electronic components are disposed on the resin layer.

The present invention provides a semiconductor device including: a semiconductor chip; a lead frame provided with a recessed portion on at least one of an upper surface or a lower surface thereof, and electrically coupled to the semiconductor chip; and a resin section that molds the semiconductor chip and the lead frame, and is provided with an opening above the recessed portion. By inserting a conductive pin (not shown) into the recessed portion through the opening, a plurality of semiconductor devices can be mechanically and electrically coupled to each other.

In a connector housing block 260 comprising an interface member 200 for electrically connecting a test head body 100 with sockets 320 in an electronic device testing apparatus, a connector housing 240 provided with a plurality of connector pins 242 in a non-floating state is attached to a block base 230 in a floating state via a coil spring 250. Due to the configuration, the number of parts of the connector housing 240 can be reduced, mounting density of the connector pins 242 can be improved, and a positional error of the connector housing 240 can be absorbed.

A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.

In an electronic parts packaging structure of the present invention constructed by stacking a plurality of sheet-like units in a thickness direction, each of the units includes a first insulating layer, wirings formed on one surface of the first insulating layer, a semiconductor chip (electronic parts) connected to the wirings, a second insulating layer formed on an one surface side of the first insulating layer to cover the semiconductor chip, and connecting portions (terminals and contact vias) for connecting electrically the wirings and wirings of other unit, wherein arrangement of the first insulating layer, the semiconductor chip, the wirings, and the second insulating layer is symmetrical between units adjacent in a thickness direction.

Information processing equipment includes a photoelectric conversion module disposed on a circuit substrate, a first optical connector connected to the photoelectric conversion module through a plurality of first optical fibers and disposed to an edge portion of the circuit substrate, and a second optical connector disposed on an optical backplane and optically connected to the first optical connector. The disposing direction of the optical fibers in the photoelectric conversion module is in nonparallel with the main surface of the circuit substrate and the disposing direction of the optical fibers in the first optical connector and the disposing direction of the optical fibers in the second optical connector are in nonparallel with the main surface of the circuit substrate.

A dielectric-film-type electron emitter includes an emitter section, a first electrode, and a second electrode. The emitter section is formed of a thin layer of a polycrystalline dielectric material. The dielectric material constituting the emitter section is formed of a material having high mechanical quality factor (Qm). Specifically, the dielectric material has a Qm higher than that of a so-called low-Qm material (a material having a Qm of 100 or less). The Qm of the dielectric material is preferably 300 or more, more preferably 500 or more.