Method for preparing highly heat-conductive copper-clad plate

Abstract

The invention relates to a method for preparing a highly heat-conductive copper-clad plate, which is realized by the following steps of: preparing gluewater; preparing a gluewater solution with the solid content of 60-90% by using a mixture of polyfunctional epoxy resin and polyurethane; taking an inorganic filler which adopts a mixture of aluminium nitride and aluminium oxide as the main contents, wherein aluminium nitride content accounts for 40-60 wt% of the total weight of the mixture, and aluminium oxide content accounts for 40-60 wt% of the total weight of the mixture; using the inorganic filler after being fully and uniformly mixed as the filler of the gluewater solution; using dicyandiamide as a curing agent, imidazole as an accelerating agent and acetone as a solvent to prepare the gluewater solution with the solid content of 60-80% and the gel time of 150-450 seconds for application; putting the gluewater solution into a glue mixer and then conveying the gluewater solution to a heating medium oil vertical gluing machine; and preparing a single-surface or double-surface copper-clad plate. The prepared copper-clad plate has high heat conductivity, capability of holding a higher installation density and excellent dimension stability, and can be used for preparing printed circuit boards with finer wiring and more layers.

Description

Technical field [0001] The invention relates to a method for preparing a copper clad laminate, in particular to a glue solution in the process. Background technique [0002] With the development of modern electronic products to "light, thin, small, and multifunctional", the high integration of electronic devices, high-speed, high-frequency, and large-capacity signal transmission in the process of information transmission, along with the increase in power consumption, the unit area It generates more heat. If the heat is not dissipated in time, it will affect the working stability of the semiconductor device. As the substrate material (CCL) carried by electronic components, it must have excellent thermal conductivity, and timely transfer the heat generated by the components to ensure the stable performance of electronic products. [0003] The traditional FR-4 copper clad laminate is a single system combining epoxy resin and E-grade glass cloth, which has unsatisfactory thermal cond...

AI Technical Summary

Problems solved by technology

[0003] The traditional FR-4 copper clad laminate is a single system combined with epoxy resin and E-grade glass cloth. The thermal conductivity is not ideal and the thermal resistance is large.

However, metal-based and ceramic-based copper clad laminates with better thermal conductivity have high manufacturing costs and difficult production, and are mostly used in high-current modules, but less in other applications.