Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Printed circuit board manufacturing method

A technology of printed circuit boards and manufacturing methods, which is applied in the fields of printed circuit manufacturing, method of using/removing circuit masks, printed circuits, etc., can solve the problems of reducing enterprise profits, high production material costs, high scrap rate, etc., and achieve reduction Effects of production cost, shortened production time, and shortened production cycle

Active Publication Date: 2015-05-13
HUIZHOU XINGZHIGUANG TECH
View PDF4 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the above-mentioned printed circuit board manufacturing method, the graphic printing step uses a dry film, and the etching of the graphic needs to be coordinated across departments. The production cycle is long and the cost of production materials is high.
[0004] In addition, the existing production method adopts the method of screen printing characters, which requires screen printing characters, and a baking board is required after the screen printing characters, resulting in long production cycle, complicated process, high cost, and the complicated process is easy to damage the printed circuit board. Lead to high scrap rate in the production process, which reduces the profit of the enterprise

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board manufacturing method
  • Printed circuit board manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0054] like figure 1 Shown, a kind of manufacturing method of printed circuit board comprises the following steps:

[0055] S1 cutting to form a jigsaw panel, which includes an inner substrate and copper foil attached to the upper and lower surfaces of the inner substrate;

[0056] S2 graphic printing;

[0057] S3 alkaline etching;

[0058] S4 solder mask and developing characters;

[0059] S5 electric test.

[0060] In the step S2, a wet film is used for graphic printing. like figure 2 As shown, the graphic printing steps described in the step S2 are specifically as follows:

[0061] S201, put the board.

[0062] S202 Nylon brushing is used to grind printed circuit boards. The nylon brush wheel rotates clockwise to form friction with the board surface to roughen and clean the surface of the printed circuit board. In this embodiment, the density of the nylon brush wheel is 800 mesh, the friction range formed by the nylon brush wheel and the printed circuit board is 8mm-...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a printed circuit board manufacturing method which includes the steps: S1 cutting to form a jointed board comprising an inner base board and copper foils attached to the upper surface and the lower surface of the inner base board; S2 printing graphics by the aid of a wet film; S3 performing alkaline etching; S4 performing resistance welding and developing characters; S5 performing electric test. A green oil exposure developing character mode replaces a screen printing character mode in the prior art, the process is simpler, production time is greatly shortened, and production cost is reduced. Besides, compared with a dry film mode in the prior art, the graphics are printed by the aid of the wet film without trans-department coordinative operation, production cost is reduced, and production cycle is shortened.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for manufacturing a printed circuit board. Background technique [0002] Printed circuit board: also known as printed circuit board, printed circuit board, referred to as printed board, often use the English abbreviation PCB or write PWB, with an insulating board as the base material, cut to a certain size, with at least one conductive pattern attached to it, And there are holes (such as component holes, fastening holes, metallization holes, etc.), which are used to replace the chassis of the previous installation of electronic components and realize the interconnection between electronic components. Since such boards are made using electronic printing, they are called "printed" circuit boards. [0003] At present, the main production process of printed circuit boards is: planning feeding—cutting—mechanical drilling—graphic printing—etching—remo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0079H05K3/06H05K3/28H05K2203/075
Inventor 闫红生杨科庞晓军封献玲
Owner HUIZHOU XINGZHIGUANG TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com