282results about How to "High precision forming" patented technology

A laser beam emitted by an encoder main body enters a wafer table via a PBS from the outside, and reaches a grating at a point that is located right under exposure area, and is diffracted by the grating. Then, by receiving interference light of a first polarized component that has returned from the grating and a second polarized component reflected by the PBS, positional information of the wafer table is measured. Accordingly, because the first polarized component, which has passed through PBS passes through the wafer table until it is synthesized with the second polarized component again, does not proceed through the atmosphere outside, position measurement of the wafer table can be performed with high precision without the measurement beam being affected by the fluctuation of the atmosphere around the wafer table.

A thin film formation method is provided which can carry out various kinds of patterning deposition correctly and with high precision, and a thin film formation equipment. The thin film formation method arranges a mask between a substrate and a material source and forms the material of the material source as a thin film on the substrate. The method further includes: a substrate contacting process to contact the mask and the substrate; a gap measurement process to measure a gap between the mask and the substrate; and a thin film formation process to form the thin film according to the measurement result in the gap measurement process.

The invention relates to a system for laying and mechanically joining building panels, especially thin, hard, floating floors. Adjacent joint edges of two panels engage each other to provide a first mechanical connection locking the joint edges in a first direction perpendicular to the principal plane of the panels. In each joint, there is further provided a strip which is integrated with one joint edge and which projects behind the other joint edge. The strip has an upwardly protruding locking element engaging in a locking groove in the rear side of the other joint edge to form a second mechanical connection locking the panels in a second direction parallel to the principal plane of the panels and at right angles to the joint. Both the first and the second mechanical connection allow mutual displacement of joined panels in the direction of the joint.

A stage device is equipped with a first scale which is placed with a Y-axis direction serving as its longitudinal direction and in which a first grating whose periodic direction is in an X-axis direction is formed and a second scale which is placed with the X-axis direction serving as its longitudinal direction and in which a second grating whose periodic direction is orthogonal to the periodic direction of the first grating is formed, the first scale and the second scale being placed on a plane which a wafer stage faces. Further, on the upper surface of the wafer stage, a plurality of X heads placed at different positions in the X-axis direction and a plurality of Y heads placed at different positions in the Y-axis direction are arranged. An encoder system that has these heads measures positional information of the stage within an XY plane, based on an output of the X head facing the first scale and an output of the Y head facing the second scale.

Disclosed is an actinic ray curable ink-jet ink composition containing a photopolymerizable compound, a sulfonium salt (compound A) as a photoinitiator, which does not release benzene on actinic ray exposure, and a compound (compound B) as a sensitizing agent selected from the group consisting of (i) a polycyclic aromatic compound having a hydroxyl group, a substituted or unsubstituted aralkyloxy group or a substituted or unsubstituted alkoxy group, (ii) a carbazole derivative, and (iii) a thioxanthone derivative.

Provided is an optical image measuring apparatus forming a three-dimensional image based on tomographic images of an object, acquired at various depths even when the object moves during measurement. Including a half mirror (6) for dividing a light beam signal light (S) and reference light (R), a frequency shifter (8), a reference mirror (9) and a piezoelectric element (9A) used to change an optical path length of the reference light (R), CCDs (21, 22) for receiving interference light beams (L) resulting from interference light produced by superimposing the signal light (S) and the reference light (R) on each other by the half mirror (6) and outputting detection signals, an image forming portion for forming tomographic images based on the detection signals, a measurement depth calculating means (53), and an image processing portion (57). Forming a three-dimensional image or the like based on the arranged tomographic images.

An object is to provide a display device that can be manufactured by improvement of use efficiency of a material and simplification of a manufacturing process. A light absorbing layer is formed, an insulating layer is formed over the light absorbing layer, the light absorbing layer and the insulating layer are selectively irradiated with laser light, an irradiated region in the insulating layer is removed to form an opening in the insulating layer, and a conductive film is formed in the opening so as to be in contact with the light absorbing layer. The conductive film is formed in the opening so as to be in contact with the light absorbing layer, which is exposed, so that the light absorbing layer and the conductive layer can be electrically connected with the insulating layer interposed therebetween.

In a projection optical system which forms an image of a first plane on a second plane, using extreme ultraviolet illumination light, an object of the invention is to form an image on the first plane on the second plane under suitable conditions. This projection optical system comprises a first diffractive optical element arranged in an optical path between the first plane and the second plane; a second diffractive optical element arranged in the optical path on the side of the second plane from the first diffractive optical element; and an optical system having a negative power, arranged in the optical path between the first diffractive optical element and the second diffractive optical element.

A near-field light generating device includes: a waveguide having a groove that opens in the top surface; a clad layer disposed on the top surface of the waveguide and having an opening that is contiguous to the groove; a near-field light generating element accommodated in the opening; and a buffer layer interposed between the near-field light generating element and each of the waveguide and the clad layer in the groove and the opening. The near-field light generating element includes: first and second side surfaces that decrease in distance from each other toward the groove; an edge part that connects the first and second side surfaces to each other and is opposed to the groove with the buffer layer therebetween; and a near-field light generating part that lies at one end of the edge part and generates near-field light.

The present invention relates to a CMOS-type solid-state imaging device and a method for manufacturing thereof, and provides a solid-state imaging device capable of optimally condensing light by a single intra-layer lens and a manufacturing method capable of forming an intra-layer lens with high precision. The solid-state imaging device according to the present invention includes a plurality of wirings and a plurality of lenses above a light-receiving portion, in which at least one of the plurality of lenses is formed of a single intra-layer lens. The method for manufacturing the solid-state imaging device according to the present invention includes the processes of forming a concave surface or convex surface onto a first insulation layer with a first refractive index using a selective etching method and forming a second insulation layer with a second refractive index onto the concave surface or convex surface to form the intra-layer lens corresponding to the light-receiving portion.

It is a main object of the present invention to provide a method for manufacturing a conductive pattern capable of forming a highly precise pattern, also capable of forming by using a simple process, and being free from problems such as treatment of waste fluids. In order to attain the above object, the present invention provides a method for manufacturing a conductive pattern forming body comprising: a pattern forming body substrate preparing process of preparing pattern forming body substrate comprising a base material, and a photocatalyst containing layer formed on the base material comprising a photocatalyst and a binder whose wettability of an energy irradiated part is changed so as a contact angle to a liquid is reduced; a wettability pattern forming process of forming wettability pattern comprising a liquid repellent area and a lyophilic area on the photocatalyst containing layer by irradiating the photocatalyst containing layer in a pattern with energy; a metal colloid coating process of adhering a metal colloid only to the lyophilic area of the surface of the photocatalyst containing layer on which the wettability pattern is formed, by coating the metal colloid; and a conductive pattern forming process of forming conductive pattern by solidifying the metal colloid adhered to the lyophilic area of the wettability pattern.

A method for manufacturing an IC-embedded substrate comprises a first step for encapsulating at least an IC chip having a pad electrode in an insulating layer, a second step for forming a metal layer having at least a first aperture in a location directly above the pad electrode of the IC chip and a second aperture in a location above an area other than the area in which the IC chip is mounted, and a third step for selectively removing the insulating layer by a blasting treatment in which the metal layer is used as a mask, whereby forming a first via hole that corresponds to the first aperture and a second via hole that corresponds to the second aperture.

A method for forming a throughhole in an ink-jet print head of a bubble-jet system includes the steps of: forming a bubble-generator which is adjacent to a throughhole-forming region on one side of a substrate, and which includes a heater; forming a first mask layer for covering portions excluding the throughhole-forming region on a first side of the substrate; forming a second mask layer for covering portions excluding the throughhole-forming region on a second side of the substrate; forming a first well with a predetermined depth on the throughhole-forming region of the substrate not covered by the first mask layer by spraying sand under high pressure and at a high speed onto the first side of the substrate; forming a second well corresponding to the first well on the throughhole-forming region of the substrate not covered by the second mask layer by spraying sand under high pressure and at a high speed onto the second side of the substrate; forming a throughhole by overlap of the first well and the second well on the throughhole-forming region; and removing the first and second mask layers. Accordingly, a plurality of throughholes can be formed on a plurality of substrates at one time, and the time required for processing throughholes on one wafer can be reduced considerably compared to prior techniques, thereby promoting mass production. Furthermore, the size of the nozzle for spraying the sand, and consequently the size of the throughhole, is uniform and does not change. The size of the throughhole is determined by the mask layers, thereby forming a throughhole having a very uniform size with high precision.

When forming a magnified image of a mask pattern on an object with a plurality of projection optical systems, projected images of the projection optical systems are formed to be accurately continuous to enable satisfactory pattern transfer. A first projection optical system directs light beam from point a on a mask to point A on a plate and forms a magnified image of the mask on the plate. A second projection optical system directs light beam from point b on the mask to point on the plate and forms a magnified image of the mask on the plate. A first line segment linking point A and point a′, which orthogonally projects point a on the plate, and a second line segment linking point B and point b′, which orthogonally projects point b on the plate PT, overlap each other as viewed in a non-scanning direction.