32results about How to "Improve connection density" patented technology

A technique for manufacturing a circuit board involves obtaining a plane-shaped structure having layers of circuit board material integrated together, and carving a hole within the plane-shaped structure (e.g., using a single countersinking drill bit). The carved hole includes an inner portion having a substantially uniform inner portion diameter and a connecting portion disposed between the inner portion and an outer surface of the plane-shaped structure. At least part of the connecting portion has a diameter which is larger than the substantially uniform inner portion diameter of the inner portion to improve access to the inner portion. The technique further involvesperforming a plating process on the plane-shaped structure to provide plating over the hole carved within the plane-shaped structure. The provided plating forms a countersunk via which provides an electrical pathway from the outer surface of the plane-shaped structure to an internal circuit board trace.

A modular fiber frame is disclosed that comprises a generally rectangular frame body, a high density connection module attached to a front side of the frame body, a splitter bracket to hold a plurality of optical splitter modules on the front side of the frame body. All of the splitter connections can be made on the front side of the modular fiber frame, and a preterminated cable harness optically connected to connection ports on a back of the connection module, wherein the connection module includes a protective cover over said connection ports. In some embodiments, the exemplary modular fiber frame can utilize a second preterminated cable harness optically connected to a back of the connection module.

A semiconductor device 1 includes a semiconductor chip 10 (first semiconductor chip), a semiconductor chip 20 (second semiconductor chip) and a seal ring 30. The semiconductor chip 20 is provided on a surface S1 of the semiconductor chip 10 so as to be spaced apart from the semiconductor chip 10 with a predetermined spacing therebetween. A seal ring 30 is interposed between the semiconductor chip 10 and the semiconductor chip 20. An internal region, which is an inner region of the seal ring 30, and an external region, which is an outer region of the seal ring 30, are provided between the semiconductor chip 10 and the semiconductor chip 20.

A method for bonding a hermetic module to an electrode array including the steps of: providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate; attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads wherein each bond-pad is adjacent to the bottom surface of the electrode array and aligns with a respective pad; drill holes through each pad to the corresponding bond-pad; filling each hole with biocompatible conductive ink; forming a rivet on the biocompatible conductive ink over each pad; and overmolding the electrode array with a moisture barrier material.

Implanting ions to form a cleave layer in a semiconductor device causes damage to sensitive materials such as high-K dielectrics. In a process for forming a cleave layer and repairing damage caused byion implantation, ions are implanted through a circuit layer of a substrate to form a cleave plane. The substrate is exposed to a hydrogen gas mixture for a first time at a first temperature to repair damage caused by the implanted ions. A cleaving process may then be performed, and the cleaved substrate may be stacked in a 3DIC structure. A stacked device is formed by bonding a die to a first substrate, the die having a smaller width than a width of the first substrate, depositing a planarization material over the die, planarizing the planarization material to form a planarized upper surface, and stacking a third substrate on the planarized upper surface.

The invention discloses a preparation device and preparation method of aggregate composite cemented concrete for road repairing. The preparation device comprises a first fixing frame, a second fixing frame is fixedly mounted at the top of the first fixing frame, a mixing and stirring mechanism is fixedly mounted at the top of the second fixing frame, and a crushing mechanism is fixedly mounted at the top of the first fixing frame. The preparation method comprises the following steps: selecting the following raw materials: 150-250 parts of cement, 50-100 parts of asphalt, 100-150 parts of 100-mesh fine sand, 20-30 parts of an improved additive, 5-10 parts of a bentonite grafted water repellent agent, 1-10 parts of active kaolin and 2-6 parts of basalt fiber. A second driving motor rotates to drive crushing blocks on the outer side of a shaft column to rotate in a crossed mode, so that the crushing blocks crush stones, aggregate raw materials for road repairing are conveniently crushed through the second driving motor, aggregate composite cemented concrete raw materials are conveniently and rapidly stirred and crushed, and meanwhile, the raw materials can be conveniently and quickly processed.

The invention relates to a preparation method of a high-toughness impact-resistant PET protective film, and belongs to the technical field of protective film preparation of electronic products. According to the preparation method, calcium hydroxide is used as a raw material, sucrose is adopted as a crystal form guiding agent, and carbon dioxide is introduced so as to produce a nano calcium carbonate material; and the nano calcium carbonate is modified by using distearyloxy isopropyl aluminate and octadecylamine, toughening treatment is conducted on the polymer by selecting methyl methacrylate,butadiene and styrene ternary polymer and utilizing the rigidity of the nano calcium carbonate and large quantities of chemical bonds which are formed among molecules of the PET protective film underthe action of the aluminate coupling agent; the obtained copolymer has a core-shell structure, and the shell phase is composed of methyl methacrylate which has large hardness and can be miscible withmethyl methacrylate in the polymer; and therefore, the hardness and impact resistance of the PET protective film can be further enhanced, and the toughness and mechanical strength of the PET protective film can be enhanced remarkably, and the preparation method has a broad application prospect.

The invention belongs to the technical field of myopia treatment and particularly relates to application of transglutaminase in a medicine for inhibiting or delaying myopia. According to the application, the transglutaminase acts on surfaces of sclerae, and by promoting the generation of isopeptide bonds among collagen fiber amino acids, the density of connection among collagen molecules can be increased and the biomechanical properties of the sclerae can be improved. The sclerae are main components of eyeball walls, and after mechanical properties of the sclerae are improved, the firmness of the eyeball walls can be greatly improved, so that the growth of axis oculi is limited, and thus, the aim of controlling and treating the myopia is achieved. The transglutaminase can be used for improving the mechanical properties of the sclerae by 50%-200%, and no toxic or side effect on other parts of eyes is observed.

The application relates to a sound head connector, a removable sound head and a hand-held type ultrasonic testing device, and belongs to the technical field of medical instruments. The sound head connector comprises a male connection module and a female connection module; the male connection module is internally provided with probes, the number of the probes is larger than or equal to a preset value; and the female connection module is internally provided with a contact, wherein the connection density of the sound head connector is larger than the connection density of a traditional sound headconnector when the contact is electrically connected with the probes. The problem can be solved that the current sound head connector is small in connection density and can increase the connection density of the sound head connector so as to improve the image quality of the ultrasound image.

The invention relates to microelectronic semiconductor device assemblies having vertically stacked semiconductor device layers. In a disclosed example of a preferred embodiment, a semiconductor device includes a base substrate, an interposing layer, and a second semiconductor device. The interposing layer features a thin insulating film with numerous electrical contacts on its surfaces for electrically coupling with electrical contacts on the adjacent layers. The interposing layer further includes electrical contacts for coupling with one or more non-adjacent layers. Particular examples of preferred embodiments of the invention disclose the use of polyimide film for the interposing layer material and metal studs for non-adjacent layer contacts.

A module connection assembly connects modules in a torus configuration that can be changed remotely. In particular, a single module can be added to or deleted from the configuration by remotely switching from conducting paths that provide end-around electrical paths to conducting paths that provide pass-through electrical paths. The assembly includes two backplanes, a first set of module connectors for electrically connecting modules to one of the backplanes, and a second set of module connectors for electrically connecting modules to the other backplane. The assembly further includes configuration controllers. Each configuration controller selects between end-around electrical paths that electrically connect multiple module connectors of the first set to each other, and pass-through electrical paths that electrically connect module connectors of the first set to module connectors of the second set. Each configuration controller operates as a remotely configurable switch that configures a topology formed by the backplanes and the module connectors. In particular, by adding a single module, the topology can be expanded incrementally.

The invention discloses a crushing and screening machine which comprises a baseplate, wherein a perpendicular plate is fixedly connected with the upper surface of the baseplate; an engine is arranged on one side of the perpendicular plate; the output end of the engine is fixedly connected with one end of a first connecting rod; the other end of the first connecting rod penetrates through a crushing box and is fixedly connected with the axis of a driving triangular gear; the driving triangular gear is meshed with a driven triangular gear; a second connecting rod is sleeved by the axis of the driven triangular gear; and one end of the second connecting rod is fixedly connected with one side of the perpendicular plate. The crushing and screening machine disclosed by the invention has the advantages that through improvement of the driving triangular gear and the driven triangular gear, a thorough crushing effect is achieved when the engine is started, thereby solving the problem that the crushing effect of a conventional crushing shaft is not thorough; and through improvement of a screening barrel, the screen barrel can be driven to perform large-amplitude rocking motion through springs, thereby achieving a smooth screening effect.

The invention discloses low-density high-strength tempered glass for a bathroom and a preparation method of the low-density high-strength tempered glass. Boron oxide added into the tempered glass can be combined with free oxygen provided by alkali metal oxide in the glass, a boron-oxygen triangle is converted into a boron-oxygen tetrahedron, the boron-oxygen tetrahedron is connected with a silicon-oxygen tetrahedron through a bridge oxygen bond, and the content of silicon dioxide is replaced by the boron oxide. The volume of the boron-oxygen tetrahedron is smaller than that of the silicon-oxygen tetrahedron, so that a formed connection network is tighter, the strength and the heat resistance of the tempered glass are improved, and meanwhile, the melting point of the boron oxide is lower than that of silicon dioxide, so that the melting point of the tempered glass can be reduced by adding the boron oxide, and a fluxing effect is achieved. The low-density high-strength tempered glass for the bathroom has good breaking strength, Vickers hardness and heat resistance, meanwhile, lithium oxide is added, the glass density is reduced, the light high-strength tempered glass is generated, and the low-density high-strength tempered glass for the bathroom has good practicability and production value.

The invention relates to a method (400) for establishing a communication connection of a communication terminal (301) via a communication network (303) having a network with a first subnetwork (307) and a second subnetwork (307) A plurality of subnetworks (307, 311) of a network (311), wherein a first identity entity (309) is placed in the first subnetwork (307) and a second identity entity (313) is placed in the second subnetwork network (311) to identify the communication device (301), wherein a subnet code is assigned to each subnet (307, 311) of the communication network (303), wherein a management entity (319) is set in the communication network ( 303), the management entity manages the assignment (321) of the communication terminal (301) to one of the two subnetworks (307, 311), and wherein the method (400) comprises the steps of: via the first subnetwork (307) a first identification entity (309) to receive (401) the identification (302) of the communication terminal (301), wherein the identification (302) identifies the communication terminal (301); by means of the first identification entity ( 309) identify (402) the communication terminal (301) based on the identification (302) of the communication terminal (301); Assigning (321) to assign (403) the subnet to the communication terminal (301); and if the subnet code (306) of the identification (302) assigned to the communication terminal (301) corresponds to the first subnet (307 ), then establish (404) the communication connection (308) of the communication terminal (301) via the first subnet (307); or if assigned to the subnet of the transmitted identification (302) If the code (306) is different from the subnet code (312) of the first subnet (307), the communication connection (310) of the communication terminal (301) is established via the second subnet (311).

The invention discloses an environment-friendly garbage treatment device with a smoke dust purification function. The environment-friendly garbage treatment device comprises a main body and a purification mechanism, wherein a feeding door is movably arranged on one side of the outer wall of the main body, a movable mechanism is movably arranged inside the main body, a smoke pipe is movably arranged above the movable mechanism, a dust removal chamber is movably arranged at one end of the smoke pipe, and the purification mechanism is arranged inside the dust removal chamber, and an air pipe is arranged at the top of the dust removal chamber. According to the environment-friendly garbage treatment device with the smoke dust purification function, the main body is arranged, and a rail is movably connected to the main body, so that after the rail is used for a long time, if the interior is abraded and the movement of the device is influenced, a user can detach the rail from the inner part of the device to maintain the abraded part, the movement smoothness of the device during use is improved, meanwhile, the rail and a combustion furnace form a sliding structure through steel wheels, sothat when the user dumps or cleans garbage, the combustion furnace can be pulled out of the device through the cooperation of the steel wheels and the rail.

The invention relates to the technical field of debugging devices for water level sensors, and in particular to an automatic debugging machine of a water level sensor. The machine comprises a main frame and a power switch, wherein a touch screen is arranged on an outer wall of the main frame; an indicator light is arranged below the touch screen; the power switch is arranged at one side of the indicator light; a fixing mechanism is arranged on the top of the main frame; a heat dissipating mechanism is arranged at the right side of an outer wall of the main frame; bottom wheels are arranged atthe bottom of the main frame; a reserved groove is arranged in the other side of the outer wall of the main frame; and a filtering mechanism is arranged inside the reserved groove. The automatic debugging machine of the water level sensor has the beneficial effects that the outer wall of the touch screen and the outer wall of the main frame are on a same horizontal line to ensure that the body ofa user does not touch the touch screen when the machine is in use and the problems that the user accidentally touches the screen and the machine cannot operate normally are prevented, so that the operation stability of the machine is improved and the service life of the touch screen is indirectly prolonged.

The invention provides a fire hose connector, and belongs to the technical field of fire protection. The fire hose connector comprises a connector shaft body, a connecting shell and a partition plate,wherein the connecting shell is located on one side of the connector shaft body, the partition plate is located on one side of the connecting shell, one side of the connecting shell is provided witha connecting groove, and the connecting shell is connected with the connector shaft body through the connecting groove; one side of the connecting shell is fixedly connected with a connecting plate, one side of the connecting plate is fixedly connected with an interface, and one side of the connector shaft body is fixedly connected with a reinforcing plate. With a stable structure, the fire hose connector can increase the pressure on the interface when the interface is connected with an external connecting part through a movable screw, so that the fire hose connector can further increase the tightness when the interface is connected to the external connecting part outside a rubber sheet, the waste and leakage of water source caused by different degrees of looseness can be avoided, and theconnection density of the external connecting part can be increased when the interface is connected with the external connecting part through the rubber sheet, so as to avoid the looseness under the huge water pressure.

The invention discloses an optical fiber coupling system. The optical fiber coupling system comprises an optical fiber connector and an adapter, wherein the optical fiber connector comprises an optical fiber end pipe, an optical fiber connecting pipe and an outer movable sleeve; the right end of the optical fiber connecting pipe is fixedly connected with the optical fiber end pipe; an optical fiber outlet is formed in the left end of the optical fiber connecting pipe; the outer movable sleeve is in sliding fit with the optical fiber connecting pipe; a step surface is arranged on the outer wallof the optical fiber connecting pipe; the diameter of the optical fiber connecting pipe on the left side of the step surface is greater than that of the right side of the step surface; a limiting face is arranged at the end of the right side of the outer movable sleeve; the limiting face is opposite to the step surface; a compression spring is arranged between the limiting face and the step surface; an assembling portion is arranged on the outer wall of the optical fiber connector; the adapter comprises a left pipe portion and a right connecting portion; and the connecting portion is fixedlyconnected with the assembling portion on the optical fiber connector. The optical fiber coupling system is simple in structure and easy and convenient to assemble and disassemble, the diameter of theoptical fiber coupling system is greatly reduced, and the connection density can be improved.

The invention relates to and provides a watertight circuit board fabrication method. The watertight circuit board fabrication method comprises the steps of arranging an electronic part with a part pinon a sealing base layer; covering the sealing base layer with a first insulation layer, wherein the first insulation layer and the sealing base layer are used for encapsulating the electronic part; forming a first communication hole in the first insulation layer, wherein the first communication hole is corresponding to a position of the part pin of the electronic part; arranging a wiring layer onthe first insulation layer, wherein the wiring layer is electrically connected with the part pin by the first communication hole; and arranging a second insulation layer on the wiring layer, whereinthe second insulation layer and the first insulation layer are used for encapsulating the wiring layer, and first insulation layer and / or the second insulation layer are / is watertight materials. Withthe adoption of simple process steps, watertight package is achieved, and meanwhile, the thickness, the volume and the power consumption of a package body can be reduced.

The invention relates to the field of concrete, and particularly discloses high-strength lightweight concrete and a preparation method thereof. The high-strength lightweight concrete is prepared from the following raw materials in parts by weight: 40-65 parts of cement, 2-4.5 parts of lime, 40-75 parts of hydrophobic modified ceramsite, 5-12 parts of fly ash, 5-15 parts of silica fume, 2-4.5 parts of a water reducing agent, 1-5 parts of a tea saponin solution, 25-38 parts of water and 1-8 parts of filling fibers. The preparation method comprises the following steps: weighing the water reducing agent, the water and the tea saponin solution, mixing, stirring and foaming to prepare foam liquid; weighing cement, lime, hydrophobic modified ceramsite, fly ash, silica fume and filling fiber, mixing and stirring to obtain a mixture; weighing the foam liquid, mixing and stirring the mixture to obtain a mixed material, and pouring and curing the mixed material to obtain concrete; the lightweight concrete has relatively high mechanical strength.