High density electrical connectors
A connector and high-level technology, applied in the direction of electrical connection formation of printed components, electrical solid devices, circuits, etc., can solve the problems of increased danger, increased difficulty, high-precision active alignment and accelerated cost, and achieve easy repair and easy replacement Effect
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[0028] The invention can be used in a variety of microelectronic systems for the alignment of resilient electrical contacts and internally mounted chips. The invention can be used in multi-chip modules, especially where it is difficult to determine the quality of the chips before mounting them. The present invention can be used where there are many problems today, for example, where there are flip-chips, or where there is a large mismatch in the coefficient of thermal expansion between the board and the chip. Repairs can often be dangerous and expensive, and, in some types of MCM devices, are essentially impossible.
[0029] figure 1 An example is shown where the invention can be used, but the invention is not limited to this field. The invention can of course be used in any kind of microsystem, even submicrosystems. figure 1 A cross-section of a three-dimensional (3D) multi-chip module 100 is shown. The three-dimensional module consists of two-dimensional (2D) multi-chip ...
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