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1737 results about "Polyimide membrane" patented technology

Laminate, method for producing same, and method for producing device structure using same

The invention provides a laminate of a substrate, a polyimide film, and a coupling treatment layer interposed therebetween, which provides different delamination strengths between the substrate and the polyimide film to form a prescribed pattern. The invention also provides a method for producing such a laminate formed from at least a substrate and a polyimide film, whereby, using a film obtained by plasma treatment of at least the surface facing the substrate as the polyimide film, coupling agent treatment is performed on at least one of the surfaces facing the substrate and the polyimide film to form a coupling treatment layer, deactivation treatment is performed on a portion of the coupling treatment layer to form a pre-determined pattern, and then pressing and heating are performed with the substrate and polyimide film overlapping.
Owner:TOYO TOYOBO CO LTD

High thermal conductivity resin composition and high thermal conductivity coated metal foil board manufactured by using same

The invention relates to a high thermal conductivity resin composition and a high thermal conductivity coated metal foil board manufactured by using the same. The high thermal conductivity resin composition comprises the following components of: epoxy resin, at least one phenoxy resin or carboxy terminal butadiene acrylonitrile, biphenyl phenolic resin and a high thermal conductivity packing material, wherein the biphenyl phenolic resin has the structure shown in the specification. The high thermal conductivity coated metal foil board manufactured by using the high thermal conductivity resin composition comprises a high thermal conductivity adhesive film and metal foils coated on both sides of the high thermal conductivity adhesive film, wherein the high thermal conductivity adhesive film comprises a carrier film and the high thermal conductivity resin composition coated on the carrier film, and the carrier film is a polyester film or a polyimide film. The high thermal conductivity coated metal foil board comprises a resin composite metal foil and a metal foil or another resin composite metal foil coated on the previous resin composite metal foil, and the resin composite metal foil comprises a metal foil and the high thermal conductivity resin composition coated on the metal foil.
Owner:GUANGDONG SHENGYI SCI TECH

Cleaning method and film depositing method

A cleaning method for a film deposition apparatus that deposits a polyimide film conveyed into a film deposition chamber by feeding a first source gas formed of dianhydride and a second source gas formed of diamine into the film deposition chamber, the method including the steps of: generating an oxygen atmosphere in the film deposition chamber, and removing polyimide remaining in the film deposition chamber by heating the film deposition chamber at a temperature of 360° C. to 540° C. in the oxygen atmosphere and oxidizing the polyimide.
Owner:TOKYO ELECTRON LTD

Liquid crystal phase shift unit for reflected adjustable phase shifter

ActiveCN107394318ATurn fullySteer evenlyWaveguide type devicesPatch electrodeAuxiliary electrode
The invention discloses a liquid crystal phase shift unit for a reflected adjustable phase shifter. The liquid crystal phase shift unit comprises two upper and lower layers of medium substrates, a liquid crystal layer is injected in the gap between the two upper and lower layers of medium substrates, a metal microstrip patch electrode is arranged on the lower side of the upper layer medium substrate, a metal total reflection ground electrode is arranged on the upper side of the lower layer medium substrate, and polyimide film coating is respectively arranged on upper and lower surfaces of the liquid crystal layer; the metal microstrip patch electrode comprises two identical dipole patches, an offset voltage loading line and an auxiliary electrode, the two dipole patches are arranged in parallel, the offset voltage loading line is connected with the two dipole patches orthogonally to form a patch unit, the auxiliary electrode is a quadrilateral metal frame, and the quadrilateral metal frame surrounds the whole patch unit and is connected with the offset voltage loading line. The auxiliary electrode has a simple main body structure, educes the saturation bias voltage, and can be used in the field of liquid crystal reflected phase shifters and phase control antennas within microwave, millimeter wave and terahertz frequency bands.
Owner:HEFEI UNIV OF TECH

Apparatus for spin coating, a method for spin coating and a method for manufacturing semiconductor device

The invention relates to an apparatus for spin coating for forming a resist film, an SOG film, a polyimide film, and the like in manufacturing semiconductor devices and has the object of forming a coated film with a specified and uniform thickness even in case that an amount of discharged coating solution is a little. An apparatus for spin coating of the invention comprises a rotatable table for placing a wafer, a coating solution discharging means which is set above the rotatable table and discharges a coating solution on the surface of the wafer, and a solvent discharging means which is above the rotatable table and discharges a solvent capable of dissolving the coating solution.
Owner:FUJITSU SEMICON LTD

Process of separating gases using polyimide membranes

The present invention discloses a new type of polyimide membrane with high permeances and high selectivities for gas separations and particularly for CO2 / CH4 and H2 / CH4 separations. The polyimide membranes have CO2 permeability of 50 Barrers or higher and single-gas selectivity for CO2 / CH4 of 15 or higher at 50° C. under 791 kPa for CO2 / CH4 separation. The polyimide membranes have UV cross-linkable functional groups and can be used for the preparation of UV cross-linked polyimide membranes having CO2 permeability of 20 Barrers or higher and single-gas selectivity for CO2 / CH4 of 35 or higher at 50° C. under 791 kPa for CO2 / CH4 separation.
Owner:UOP LLC

Polymer Membranes Derived from Aromatic Polyimide Membranes

The present invention discloses a new type of high performance polymer membranes derived from aromatic polyimide membranes and methods for making and using these membranes. The polymer membranes described in the present invention were derived from aromatic polyimide membranes by crosslinking followed by thermal treating. The aromatic polyimide membranes were made from aromatic polyimide polymers comprising both pendent hydroxy functional groups ortho to the heterocyclic imide nitrogen and cross-linkable functional groups in the polymer backbone. The high performance polymer membranes showed significantly improved permeability for gas separations compared to the aromatic polyimide membranes without any treatment. The high performance polymer membranes also showed significantly improved selectivity for gas separations compared to the thermal-treated but non-UV-crosslinked aromatic polyimide membranes. The high performance polymer membranes of the present invention are suitable for liquid, gas, and vapor separations, as well as for catalysis and fuel cell applications.
Owner:UOP LLC

Flexible CIGS thin-film solar cell and absorption layer preparation thereof

The invention belongs to a flexible CIGS thin-film solar cell and a process for preparing an absorption layer thereof, the flexible CIGS thin-film solar cell is a multi-layer film structure, which comprises an substrate, a bottom electrode, an absorption layer, a buffer layer, a window layer, an anti-reflecting film and an upper electrode, and the flexible CIGS thin-film solar cell is characterized in that the substrate is made of flexible metals or polyimide. The process for preparing the adsorption layer of the flexible CIGS thin-film solar cell is characterized in that the substrate is made of flexible metals or polyimide, the bottom electrode Mo of the thickness of 0.5-1.5 mu m is deposited by magnetron sputtering, a metal prefabricating layer is prepared on a Mo thin-film, and is in vacuum seal to be placed in a furnace to heat, the temperature of the area of a solid selenium source is controlled between 180-300 DEG C to perform selenizing treatment, thereby enabling the metal prefabricating layer to be transformed into a semiconductor thin-film. Through performing selenizing or vulcanizing under saturation vapor pressure of selenium or sulfur in a vacuum seal silica tube, controllable repeatability of the technique process is fine, use quantity of selenium or sulfur is reduced, besides, the process is controllable and the equipment is simple.
Owner:CHINA ELECTRONIC TECH GRP CORP NO 18 RES INST

Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto

Perfluorinated polyimides (and co-polyimide) compositions, particularly films are disclosed, comprising at least 50 mole percent of a polymeric repeat unit derived from contacting 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BDPA) and 2,2′-bis(trifluoromethyl) benzidine (TFMB) monomers. The perfluorinated polyimide (and co-polyimide) films of the invention have an in-plane coefficient of thermal expansion (CTE) between −5 and +20 ppm / ° C. and a average light transmittance percent of from about 65.0 to about 99.0 (on a 75-micron thick film basis). The films of the present invention were converted to a polyimide using a chemical conversion method instead of typically employed thermal conversion step thus yielding these desirable properties. The films of the present invention can be an excellent substrate in an optical display device and can be used to replace rigid glass substrates. Finally, the polyimide films of the invention can also be used to manufacture flexible display devices (e.g., cellular phones, personal digital assistants, portable video games, laptops, and the like).
Owner:DUPONT ELECTRONICS INC

Electrostatic chucking device and manufacturing method thereof

The present invention discloses an electrostatic chucking device having a laminated structure which is formed by sequentially laminating a first insulation layer, an electrode layer and a second insulation layer on metal substrate, wherein the first insulation layer and the second insulation layer are constituted of polyimide films, and at least the adhesion between the metal substrate and the first insulation layer, and, preferably, further, the adhesions including the adhesion between the first insulation layer and the electrode layer and the adhesion between the electrode layer and the second insulation layer are performed by using thermoplastic polyimide-based adhesive films having a film thickness of 5 to 50 mum. Further, to manufacture the electrostatic chucking devices having such a constitution, the present invention also discloses an electrostatic chucking device manufacturing method which performs the low-temperature compression bonding processing under pressure at a temperature of 100 to 250° C. between the metal substrate and the first insulation layer, between the first insulation layer and the electrode layer, and between the electrode layer and the second insulation layer using thermoplasticpolyimide-based adhesion films. According to the present invention, the electrostatic chucking device can exhibit the excellent attraction performance over a long period while ensuring the excellent durability and the excellent heat resistance. Further, the method can manufacture the electrostatic chucking devices which do not contaminate a periphery of the device and a wafer.
Owner:CREATIVE TECH CORP

Polyimide film, and method for production thereof

Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component consisting essentially of 3,3′,4,4′-biphenyltetracarboxylic dianhydride and an aromatic diamine component consisting essentially of not less than 65 mol phenylenediamine % but less than 97 mol % of p-phenylenediamine and not less than 3 mol % but less than 35 mol % of 2,4-toluenediamine.
Owner:UBE IND LTD
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