1737 results about "Polyimide membrane" patented technology

A flexible touch-sense switch includes a force sensitive composite and an at least one proximity sensor. The force sensitive composite includes a plurality of force sensors disposed between a first layer and a second layer of polymide film defining a displacement region. The at least one proximity sensor generates an electromagnetic field that defines a detection region. The force sensitive composite and the at least one proximity sensor are mounted to the first layer of the polymide film for forming a flexible printed circuit board. A control circuit is electrically connected to the force sensitive composite and the at least one proximity sensor for selectively controlling the touch-sense switch activation in response to coincident actuation thereof.

In the present invention high performance cross-linked polybenzoxazole and polybenzothiazole polymer membranes and methods for making and using these membranes have been developed. The cross-linked polybenzoxazole and polybenzothiazole polymer membranes are prepared by: 1) first synthesizing polyimide polymers comprising pendent functional groups (e.g., —OH or —SH) ortho to the heterocyclic imide nitrogen and cross-linkable functional groups in the polymer backbone; 2) fabricating polyimide membranes from these polymers; 3) converting the polyimide membranes to polybenzoxazole or polybenzothiazole membranes by heating under inert atmosphere such as nitrogen or vacuum; and 4) finally converting the membranes to high performance cross-linked polybenzoxazole or polybenzothiazole membranes by a crosslinking treatment, preferably UV radiation. The membranes can be fabricated into any convenient geometry. The high performance cross-linked polybenzoxazole and polybenzothiazole polymer membranes of the present invention are suitable for a variety of liquid, gas, and vapor separations.

In the present invention high performance cross-linked polybenzoxazole and polybenzothiazole polymer membranes and methods for making and using these membranes have been developed. The cross-linked polybenzoxazole and polybenzothiazole polymer membranes are prepared by: 1) first synthesizing polyimide polymers comprising pendent functional groups (e.g., —OH or —SH) ortho to the heterocyclic imide nitrogen and cross-linkable functional groups in the polymer backbone; 2) fabricating polyimide membranes from these polymers; 3) converting the polyimide membranes to polybenzoxazole or polybenzothiazole membranes by heating under inert atmosphere such as nitrogen or vacuum; and 4) finally converting the membranes to high performance cross-linked polybenzoxazole or polybenzothiazole membranes by a crosslinking treatment, preferably UV radiation. The membranes can be fabricated into any convenient geometry. The high performance cross-linked polybenzoxazole and polybenzothiazole polymer membranes of the present invention are suitable for a variety of liquid, gas, and vapor separations.

Microcavities and micropores that are microscopic (<1 mm) in width and depth and contain any number of individually-addressable electrodes, separated by insulators, along the walls of each cavity. The conducting materials, and the insulator materials can be deposited alternately onto a starting substrate, which is typically an oxidized silicon wafer or polyimide film, but may be any substrate that shows good adhesion to the materials layered on it. The cavities are etched through these layers, perpendicular to the plane of the substrate, exposing the layers at their edges. Pores may be carved entirely through the device.

To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.

The present invention discloses an electrostatic chucking device having a laminated structure which is formed by sequentially laminating a first insulation layer, an electrode layer and a second insulation layer on metal substrate, wherein the first insulation layer and the second insulation layer are constituted of polyimide films, and at least the adhesion between the metal substrate and the first insulation layer, and, preferably, further, the adhesions including the adhesion between the first insulation layer and the electrode layer and the adhesion between the electrode layer and the second insulation layer are performed by using thermoplastic polyimide-based adhesive films having a film thickness of 5 to 50 mum. Further, to manufacture the electrostatic chucking devices having such a constitution, the present invention also discloses an electrostatic chucking device manufacturing method which performs the low-temperature compression bonding processing under pressure at a temperature of 100 to 250° C. between the metal substrate and the first insulation layer, between the first insulation layer and the electrode layer, and between the electrode layer and the second insulation layer using thermoplasticpolyimide-based adhesion films. According to the present invention, the electrostatic chucking device can exhibit the excellent attraction performance over a long period while ensuring the excellent durability and the excellent heat resistance. Further, the method can manufacture the electrostatic chucking devices which do not contaminate a periphery of the device and a wafer.

The present invention provides a method for improving the performance of polyimide membranes as used in solvent-resistant nanofiltration. More specifically the method of the present invention allows to imrove the solvent stability of the polyimide membranes to solvents or solvent mixtures that would dissolve polyimide under the conditions applied during the filtration, such as dimethylforrnamide (DMF), N-methylpyrrolidinone (NMP), dimethylacetamide (DMAC), tetrahydrofuran (THF), y-butyrolacton (GBL), dimethylsulphoxide (DMSO) and chlorinated solvents.

The present invention provides a flexible printed circuit which is free from curl, torsion and warpage due to temperature change and excellent flexural endurance. By using polyimide film having an average coefficient of thermal expansion of 1.0×10−5 to 2.5×10−5 cm / cm / ° C. in a temperature range of 100° C. to 200° C. and a stiffness value of 0.4 to 1.2 g / cm as the base film for the flexible printed circuit, a flexible printed circuit having excellent thermal dimensional stability and flexural endurance can be prepared.

Perfluorinated polyimides (and co-polyimide) compositions, particularly films are disclosed, comprising at least 50 mole percent of a polymeric repeat unit derived from contacting 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BDPA) and 2,2′-bis(trifluoromethyl) benzidine (TFMB) monomers. The perfluorinated polyimide (and co-polyimide) films of the invention have an in-plane coefficient of thermal expansion (CTE) between −5 and +20 ppm / ° C. and a average light transmittance percent of from about 65.0 to about 99.0 (on a 75-micron thick film basis). The films of the present invention were converted to a polyimide using a chemical conversion method instead of typically employed thermal conversion step thus yielding these desirable properties. The films of the present invention can be an excellent substrate in an optical display device and can be used to replace rigid glass substrates. Finally, the polyimide films of the invention can also be used to manufacture flexible display devices (e.g., cellular phones, personal digital assistants, portable video games, laptops, and the like).