368results about "Stacked PCBs" patented technology

A touch sensor device is provided that uses a flexible circuit substrate to provide an improved input device. Specifically, the present invention uses a touch sensor controller affixed to the flexible circuit substrate, which is coupled to a sensor component to provide a flexible, reliable and cost effective touch sensor suitable for a wide variety of applications. In one embodiment the touch sensor uses a flexible circuit substrate that provides relatively high temperature resistance. This allows the touch sensor controller to be affixed using reliable techniques, such as various types of soldering. The sensor component can comprise a relatively low-temperature-resistant substrate that can provide a cost effective solution. Taken together, this embodiment of the touch sensor provides reliability and flexibility at relatively low cost.

Disclosed is a display device and a multi-screen display device using the same, which include a minimized bezel area. The display device includes a display substrate including a plurality of subpixels, respectively provided in a plurality of pixel areas defined by a plurality of data lines and a plurality of gate lines, and a data pad part connected to each of the plurality of data lines in a one-to-one relationship and a data routing film adhered to the data pad part, the data routing film including a plurality of data routing lines respectively connected to the plurality of data lines. The data routing film is closely adhered to the display substrate to surround the data pad part, one side of the display substrate, and a rear surface of the display substrate overlapping the data pad part.

A track lighting system wherein a module having a plurality of LEDs mounted thereto is placed within a channel shaped rail system, the module being positionable within the rail system. A first surface of a first printed circuit board (PCB) is positioned on the bottom surface of the rail system and a pair of parallel conductive members are positioned on the second surface of the PCB. The bottom surface of the module has a plurality of spaced openings through which are inserted input power detents which contact corresponding conductive members. The power detents are connected to a circuit which converts the 24 VDC power input to a constant current; the output of the circuit being coupled to a second PCB upon which is mounted the LEDs. Openings are formed in the sides of the rail system and detents, positioned on the sides of the module, engage corresponding openings formed in the rail system sides to lock the module in position within the rail system.

A multilayer ceramic capacitor includes flat-shaped inner electrodes that are laminated. An interposer includes an insulating substrate that is larger than contours of the multilayer ceramic capacitor. A first mounting electrode that mounts the multilayer ceramic capacitor is located on a first principal surface of the insulating substrate, and a first external connection electrode for connection to an external circuit board located on a second principal surface. The multilayer ceramic capacitor is mounted onto the interposer in such a way that the principal surfaces of the inner electrodes are parallel or substantially parallel to the principal surface of the interposer, that is, the first and second principal surfaces of the insulating substrate.

In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.

A semiconductor device with a first (101) and a second (111) semiconductor chip assembled on an insulating flexible interposer (120). The interposer, preferably about 25 to 50μm thick, has conductive traces (121), a central planar rectangular area and on each side of the rectangle a wing bent at an angle from the central plane. The central area has metal studs (122, 123) on the top and the bottom surface, which match the terminals of the chips, further conductive vias of a pitch center-to-center about 50 μm or less. The side wings have contact pads (130) with metallic connectors (131) on the bottom surface; the connectors may be solder balls, metal studs, or anisotropic conductive films. The second chip is adhesively attached to a substrate, whereby the interposer faces away from the substrate. The interposer side wings have a convex bending (150) downwardly along the second chip and a concave bending (151) over the substrate; the side wing connectors are attached to the matching substrate sites.

A flexible wiring member which connects a device and an external signal source has a plurality of wire members in which a plurality of wires are formed on one surface of a substrate, and a plurality of wire members is stacked to face the device. A plurality of bumps for connecting with the device are provided to the wires on a surface, of the wirings, facing the device. Bumps of one of the wire members overlapping with the other of the wire members face the device via the through hole formed in the other of the wire members. Accordingly, it is possible to realize high densification of wires in the flexible wiring while suppressing a rise in a cost.

In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.

There is disclosed a mobile terminal including a display unit comprising a drive IC provided in a predetermined portion, a frame provided in a rear surface of the display unit, a flexible printed circuit board having one portion connected to the drive IC of the display unit and the other portion bent toward the rear surface of the display unit, a main board coupled to the frame and configured to control the drive IC via the flexible printed circuit board, and a heat transfer sheet configured to cover a front surface of the display unit and a predetermined portion of the first surface of the flexible printed circuit board, wherein at least predetermined portion of the heat transfer sheet is in contact with the frame, so that the heat generated in the drive IC and the light source of the display unit may be transferred to the frame and that the performance deterioration of the mobile terminal caused by the local overheat may be reduced and the difficulty in the user's holding the mobile terminal may be also reduced.

The invention relates to a printed circuit board arrangement, more particularly a multilayer printed circuit board. The printed circuit board arrangement comprises at least two printed circuit boards which are arranged parallel to one another and connected to one another. According to the invention, in the case of the printed circuit board arrangement of the type mentioned initially, at least one surface region of one printed circuit board is connected to another printed circuit board of the printed circuit board arrangement by means of an element embodied in an elastic and / or damping fashion in such a way that an oscillatory system, more particularly a spring-mass system, an oscillatory bending strip or a flexurally oscillatory board is formed by means of the surface region of the printed circuit board and the element.

A printed circuit board assembly includes: a first signal terminal row including a plurality of first signal terminals connected to a plurality of signal wirings of a flexible printed circuit board (FPCB), respectively; a first ground terminal row spaced from the first signal terminal row and including a plurality of first ground terminals connected to a plurality of ground wirings of the FPCB, respectively; a second signal terminal row including a plurality of second signal terminals connected to a plurality of signal wirings of a printed circuit board (PCB), respectively; and a second ground terminal row spaced from the second signal terminal row and including a plurality of second ground terminals connected to a plurality of ground wirings of the PCB, respectively. The first ground terminal row is closer to an end portion of the FPCB than the first signal terminal row.

Methods for assembling a stack package for a high density IC module on a PCB include the steps of assembling a first layer of the stack package on the PCB, assembling a second layer of the stack package on the first layer and assembling a third layer of the stack package on the second layer, such that each layer is provided in electrical communication with the PCB. Additional layers may be added to the stack package.

A dynamically flexible article or device, such as an armband, includes a flexible electronic component, such as a flexible electronic display, and a flexible support structure coupled to the flexible electronic component, wherein the flexible support and the flexible electronic component are flexible along two dimensions to thereby be able to conform to a complex curved surface. The flexible support includes bending limiting structure that constrains bending of the flexible electronic component to prevent undesirable bending.

Methods for assembling a stack package for a high density IC module on a PCB include the steps of assembling a first layer of the stack package on the PCB, assembling a second layer of the stack package on the first layer and assembling a third layer of the stack package on the second layer, such that each layer is provided in electrical communication with the PCB. Additional layers may be added to the stack package.

The invention relates to a millimeter wave active antenna unit and an inter-PCB (Printed Circuit Board) interconnection structure. The inter-PCB interconnection structure comprises a main board and anAIP (Antenna in package) antenna module. The main board is a first multilayer PCB and provided with a signal transmission line and a first pad electrically connected with the signal transmission line. The AIP antenna module is a second multilayer PCB and provided with a second pad, an impedance matching transmission branch, an impedance line and a signal processing circuit. The main board and theAIP antenna module adopts a mode of direct welding interconnection between the multilayer PCBs, thereby saving an expensive millimeter wave interconnection assembly on the one hand, and thus being very low in cost; On the other hand, the mode of direct welding between the boards improves the reliability of the product, the interconnection design between the multilayer PCBs can be realized, and the integration between the multilayer PCBs is greatly improved, thereby being conducive to the miniaturization design of millimeter wave equipment. In addition, the second pad and the signal processingcircuit are provided with the impedance matching transformation branch and the impedance line therebetween, thereby being suitable for a wider frequency range and a wider lamination number range.

In a particular embodiment, a device includes a low-loss substrate, a first inductor structure, and an air-gap. The first inductor structure is between the low-loss substrate and a second inductor structure. The first inductor structure is aligned with the second inductor structure to form a transformer. The air-gap is between the first inductor structure and the second inductor structure.

A high impedance surface and a method of making same. The surface includes a molded structure having a repeating pattern of holes therein and a repeating pattern of sidewall surfaces, the holes penetrating the structure between first and second major surfaces thereof and the sidewall surfaces joining the first major surface. A metal layer is put on said molded structure, the metal layer being in the holes, covering at least a portion of the second major surface, covering the sidewalls and portions of the first major surface to interconnect the sidewalls with other sidewalls via the metal layer on the second major surface and in the holes.

A tiled display including discrete luminous sources distributed over at least two adjacent flexible display tiles, each of the flexible display tiles being configured to drive the discrete luminous sources on it when connected to a power supply and when receiving data and control signals. The power, data and control signals are provided to the tiles through conducting tracks formed on a carrier substrate, where an electrical connection between a first conductor on the carrier substrate and a second conductor on a tile is established by using a connecting element having a resilient means keeping it pressed and in contact with a surface of the first conductor or second conductor. Additionally, a carrier substrate and to a flexible display tile for use in such tiled displays.

There is disclosed a mobile terminal including a display unit comprising a drive IC provided in a predetermined portion, a frame provided in a rear surface of the display unit, a flexible printed circuit board having one portion connected to the drive IC of the display unit and the other portion bent toward the rear surface of the display unit, a main board coupled to the frame and configured to control the drive IC via the flexible printed circuit board, and a heat transfer sheet configured to cover a front surface of the display unit and a predetermined portion of the first surface of the flexible printed circuit board, wherein at least predetermined portion of the heat transfer sheet is in contact with the frame, so that the heat generated in the drive IC and the light source of the display unit may be transferred to the frame and that the performance deterioration of the mobile terminal caused by the local overheat may be reduced and the difficulty in the user's holding the mobile terminal may be also reduced.

Disclosed is an organic EL illumination device-which is provided with: an organic EL element (13) on a glass substrate (10); and a plurality of anode terminal electrodes (11) and cathode terminal electrodes (12) for evenly supplying current to the aforementioned organic EL element (13) on the aforementioned glass substrate (10)-wherein the organic EL illumination device is provided with a wiring board (1) to which a circuit having anode wiring (1a) corresponding to the position of each of the aforementioned anode terminal electrodes (11), and a circuit having cathode wiring (1b) corresponding to the position of each of the aforementioned cathode terminal electrodes (12) are formed.

Method and devices are provided that integrate various internal channels and inlet and outlet ports, configured to operate with air or fluidics, with electrical circuitry. The devices comprise internal channels and outlet / inlet ports that are integrated into multiple layers of printed circuit boards. A multi-layer printed circuit board assembly is produced by laminating the plurality of layers together. The multi-layer printed circuit board assembly can accommodate a variety of off-the-shelf components, as well as electrical circuits and electronic components.

A stacked package module is disclosed, which comprises: a first package structure comprising a first circuit board with a first chip embedded therein, wherein the first chip has a plurality of electrode pads, the first circuit board comprises a first surface, an opposite second surface, a plurality of first conductive pads on the first surface, a plurality of second conductive pads on the second surface, a plurality of conductive vias, and at least one circuit layer, and the electrodes of the first chip directly electrically connect to the conductive pads on the surfaces of the circuit board through the conductive vias and the circuit layer within the circuit board; and a second package structure electrically connecting to the first package structure through a plurality of solder balls to make package on package. The stacked package module provided by this invention has characteristics of compact size, high performance, and high flexibility.

A method of determining curing conditions is for determining the curing conditions of a thermosetting resin to seal a conductive part between a substrate and an electronic component. A curing degree curve is created. The curing degree curve indicates, with respect to each of heating temperatures, relationship between heating time and curing degree of the thermosetting resin. On the basis of the created curing degree curve, a void removal time of a void naturally moving upward in the thermosetting resin, at a first heating temperature, is calculated. The first heating temperature is one of the heating temperatures.

A radio frequency transmission structure couples a RF signal between a first and a second radiating elements arranged at a first and a second sides of a first dielectric substrate, respectively. The RF coupling structure comprises: a hole arranged through the first dielectric substrate, a first electrically conductive layer arranged on a first wall of the hole to electrically connect a first and a second signal terminals, a second electrically conductive layer arranged on a second wall of the hole opposite to the first wall to electrically connect a first and a second reference terminals. The first electrically conductive layer is separated from the second electrically conductive layer. The hole extends beyond the first wall away from the second wall.

The present invention discloses a printed circuit board and a method for fabricating the same, and an apparatus for fabricating printed circuit board. The printed circuit board includes a substrate having an upper surface; a first trench recessed from the upper surface of the substrate; a first via formed in the first trench and penetrating through the substrate; and a first conductive layer disposed in the first trench and the first via, the first trench being electrically connected to the first via. A method for fabricating the printed circuit board and an apparatus for fabricating the printed circuit board are also disclosed. The method and device utilize an ink-jet printing technology to fabricate the printed circuit board, can substantially simplify a technological process of the printed circuit board, and compared with a traditional technological process, can save many complex processes, improve the technological process and cost effectiveness, and reduce the pollution problem in a fabricating process.

A printed circuit board having two completed printed circuit board elements which consists of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression containing the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and the printed circuit board elements are connected with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of the component in the printed circuit board. Furthermore, a printed circuit board of this type also contains an electronic component integrated therein.