740results about "Printed circuit grounding" patented technology

An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.

A head gimbal assembly for a disk drive. The head gimbal assembly includes a trace suspension assembly backing layer including a gimbal. The trace suspension assembly backing layer is formed of a conductive material having a first oxidation rate. The head gimbal assembly further includes a gimbal conductive layer disposed upon the gimbal and formed of a conductive material having a second oxidation rate lower than the first oxidation rate. The head gimbal assembly further includes a slider supported by the gimbal. The head gimbal assembly further includes a conductive compound disposed between the gimbal conductive layer and the slider for electrically grounding the slider to the trace suspension assembly backing layer.

An electronic device has a chassis, and a printed wiring board (PWB) having a hole. A fastener is installed in the hole thereby securing the PWB to the chassis. A pair of conductive traces is formed in the PWB. A cap, being an amount of conductive glue, covers a part of the fastener and fills an electrically insulating gap between the two traces, to thereby form a conductive path that connects the two traces. A sensing circuit is coupled to the traces, to detect a change in impedance of the path and signal a tamper event alert. Other embodiments are also described and claimed.

Method and apparatus are presented for electrically coupling a slider to ground. In one embodiment, a bonding pad is provided on a side of the slider body separate from the bonding pad(s) used for read / write signals. This separate bonding pad is electrically coupled within the slider body to components that are to be coupled to ground. A separate conductor provided on the suspension (e.g., a trace, a flex circuit, etc.) may be electrically coupled to the separate bonding pad via gold ball bonding. The conductor is also coupled to ground in the hard-disk drive device (e.g., via the preamplifier). The use of the separated bonding pad and trace may negate the need to use a conductive adhesive to electrically ground the slider via its attachment to the tongue of a slider.

A modular material antenna assembly is provided that includes an antenna block having a portion with a shape that interlocks with a corresponding portion of an electrically non-conductive frame and secures the antenna block to the electrically non-conductive frame. The electrically non-conductive frame is attached to an interior of an electrically conductive housing so that the electrically non-conductive frame and the electrically conductive housing form an integrated structure. An antenna flex is then mechanically secured to the antenna block. The antenna flex may also be electrically connected to a circuit board. The frame is designed to support a cover glass for the portable electronic device and may be affixed to a housing. The dielectric constant of the antenna block is substantially less than the dielectric constant of the frame.

A lightweight radio / CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.

A coupling and grounding structure of a plasma display device for grounding a circuit board effectively, and fixing the circuit board stably. The plasma display device includes a plasma display panel having a display area, on which images are displayed; a chassis base coupled to a back surface of the plasma display panel; at least one circuit board, on which at least one electronic element for driving the plasma display panel is mounted, the circuit board having a conductive portion and at least one coupling hole to be coupled to the chassis base by a bolt member penetrating the coupling hole; and at least a conductive member which contacts the conductive portion and the bolt member in the coupling hole.

A fixing structure for a circuit board includes at least one board mounting hole in the circuit board, the board mounting hole having a guide hole and an insertion hole, and at least one board mounting member inserted through the board mounting hole, the board mounting member having a main body, a cover, and an insertion portion therebetween, wherein the insertion portion has a cross-sectional area smaller than either of the main body or the cover and is capable of fitting in the insertion hole of the board mounting hole.

The embodiments relates generally to the use of conductive connections for electrically grounding a series of conductive substrates. More specifically the embodiments teach configurations of conductive connections that do not overly constrain relative motion between the connected conductive substrates. Conductive pressure sensitive adhesive is used to attach opposing ends of the conductive connectors to the conductive substrates. A substrate portion of the conductive connectors is scored by a cutting device such as a die cutter to reduce rigidity of the substrate portion.

A DC bus for use in a power module includes a positive DC conductor bus plate parallel with a negative DC conductor bus plate. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.

The present invention provides a liquid crystal display device capable of protecting a printed circuit board from electromagnetic interference. The LCD device of the present invention includes a LCD panel for presenting an image, a backlight assembly for illuminating light to the LCD panel, a bottom chassis for securing the LCD panel and the backlight assembly, a first printed circuit board seated on a rear surface of the bottom chassis for generating signals to be supplied to the LCD panel on the basis of externally input signals, a first connector coupled with a signal transfer film which provides the input signal of the first printed circuit board, a shield case made of a conductive material for protecting an upper surface of the first printed circuit board, and a first conductive adhesive member interposed between the first connector and the shield case for discharging an electromagnetic wave from the first connector to the shield case.

Provided is a connector sheet exhibiting requisite conduction property for removal of electromagnetic wave noise and static electricity, allowing ground connection between a metal portion of a casing and a circuit board through a simple mounting operation, and capable of meeting requirement for a reduction in electronic apparatus size, and a portable electronic apparatus equipped with the same. The connector sheet is conductively connected to a metal casing and a ground-connecting portion of a circuit board through a conducting portion of a connector portion in which conductive particles are serially oriented. Further, the connector portion and a resin sheet are integrated with each other.

A field hardened industrial device is described with a housing of the device having electrically conductive walls surrounding a cavity with an open end. An electronics assembly is adapted to fit within the cavity. The device includes a circuit card assembly, which is a multi-layered printed wiring board with pass-through electrical connections and an embedded ground plane electrically coupled to the housing to shield the electronics assembly from electromagnetic interference and to provide environmental protection to the electronics assembly.

A circuit module includes a wiring substrate, an electronic component, a sealing layer, and a conductive shield. The wiring substrate has a mount surface. The electronic component is mounted on the mount surface. The sealing layer is formed of an insulating material, covers the electronic component, and has a first surface and a second surface, the first surface being opposite to the mount surface and having a first sealing area and a second sealing area, the second sealing area projecting from the first sealing area to an opposite side of the mount surface, the second surface being connected to the mount surface and the first surface. The conductive shield covers at least the second surface and the first sealing area of the first surface.

A field hardened industrial device is described with a housing of the device having electrically conductive walls surrounding a cavity with an open end. An electronics assembly is adapted to fit within the cavity. The device includes a circuit card assembly, which is a multi-layered printed wiring board with pass-through electrical connections and an embedded ground plane electrically coupled to the housing to shield the electronics assembly from electromagnetic interference and to provide environmental protection to the electronics assembly.

A circuit board for semiconductor package is designed to provide a complete grounding with corresponding equipment in the manufacture of the semiconductor package based on a circuit board, thereby preventing a breakdown of the circuit board or semiconductor chip caused by electrostatic charges. The printed circuit board for semiconductor package includes: a resinous substrate; a chip mounting region formed on the top surface of the resinous substrate for mounting a semiconductor chip thereon; a plurality of fine circuit patterns radially disposed in the circumference of the chip mounting region and extending to the edge of the chip mounting region; a plurality of ball lands formed in an array on the bottom surface of the resinous substrate, to be fused to conductive balls; a conductive via hole connecting the circuit patterns on the top surface of the resinous substrate to the ball lands on the bottom surface of the resinous substrate; a cover coat applied to the top and bottom surfaces of the resinous substrate to protect the circuit patterns from an external environment and make the ball lands open to the exterior; and a means for removing electrostatic charges provided at the edge of the substrate and connected to the plural circuit patterns to remove electrostatic charges in the manufacture of semiconductors.

The invention discloses a display panel and a display device, and belongs to the field of display technologies. The display panel comprises electrically conductive adhesion bodies, a chip on film, an electrically conductive layer, a first substrate and a second substrate. The first substrate is opposite to the second substrate, the chip on film is adhered at a step region of the first substrate, and the electrically conductive layer is positioned on the side, which is far away from the first substrate, of the second substrate; the chip on film comprises a grounding bonding pad, and the grounding bonding pad is arranged on the side, which is far away from the first substrate, of the chip on film; the electrically conductive adhesion bodies are electrically connected with the electrically conductive layer and are electrically connected with the grounding bonding pad. According to the technical scheme, the display panel and the display device have the advantages that the grounding bonding pad is arranged on the side, which is far away from the first substrate, of the chip on film, accordingly, the occupied area of the step regions can be reduced while static electricity is prevented, and frames of the display panel can be advantageously narrowed.

An electronic device has antennas formed from cavity antenna structures. The electronic device may have a metal housing. The metal housing may have an upper housing in which a component such as a display is mounted and a lower housing in which a component such as a keyboard is mounted. Hinges may be used to mount the upper housing to the lower housing for rotation about a rotational axis. Cavity antennas may be formed in a clutch barrel region located between the hinges and running along the rotational axis. A flexible printed circuit may be formed between the cavity antennas. Each cavity antenna may have a first end that is adjacent to one of the hinges and a second end that is adjacent to the flexible printed circuit. Cavity walls for the cavity antennas may be formed from metal housing structures such as metal portions of the lower housing.

A wiring and connection management system is disclosed. The system comprises a set of power distribution members that are attached to a substrate and are connected together, forming a power grid to distribute power across the substrate. The members include a number of connectors disposed at regular intervals along their lengths. Corresponding sets of cables and connectors on the substrate convey power from the members to areas on the substrate where power is desired. The substrate may be, for example, a shelving unit. The system provides a robust, flexible source of power that is easily installed with minimal training and is also easily maintained.

A peripheral circuit structure disposed on a substrate having an element region and a peripheral circuit region is provided. The peripheral circuit structure located in the peripheral circuit region includes first pads, second pads, a first trace, a second trace and third traces connected to the second pads and a device located in the element region. The first pads include a first ground pad and a second ground pad. The second pads are located between the first ground pad and the second ground pad. Two ends of the first trace are respectively electrically connected to the first ground pad and the second ground pad. Two ends of the second trace are respectively electrically connected to the first ground pad and the second ground pad, so that the second trace, the first trace, the first ground pad and the second ground form a closed loop.

A flexible connection substrate includes a first flexible substrate and a second flexible substrate. The first flexible substrate electrically connects first signal lines that are formed on a first circuit substrate to second signal lines that are formed on a second circuit substrate. The second flexible substrate is a flexible substrate for grounding, has a planar shape that is substantially the same as the first flexible substrate, and contains a conductive material throughout. The second flexible substrate connects to any of a plurality of grounding points that are formed on the first circuit substrate and any of a plurality of grounding points that are formed on the second circuit substrate. The first flexible substrate and the second flexible substrate are bonded to each other on one surface.

A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.

There is provided a voltage converter capable of reliably preventing malfunctions of an electronic circuit to stably maintain an accurate operation by suppressing high-frequency noise generated on an input side. A DC-DC converter 1 as a voltage converter includes an active component embedded substrate 2 having an IC chip 7 and an input-side capacitor Cin and an output-side capacitor Cout mounted thereon, and ground layers 33G-1 and 33G-2 and a ground layer 32G are formed therein so as to interpose the IC chip 7 therebetween. The input-side capacitor Cin is connected to the ground layer 33G-1, and the output-side capacitor Cout is connected to the ground layer 33G-2. Moreover, the ground layer 32G is connected to the terminals of the IC chip 7, and the input-side capacitor Cin and the output-side capacitor Cout are connected to each other by the ground layers 33G-1 and 33G-2.

A flat panel display module having anti-shock screw-tightening structure is provided. The flat panel display module includes a display panel, a flexible printed circuit, a printed circuit board, a back plate, a fastening element, and a flexible separator. The display panel has a signal connecting end. One end of the flexible printed circuit is electrically connected to the signal connecting end while the other end is electrically connected to the printed circuit board. The printed circuit board has a through hole. The back plate accommodates the display panel. The flexible printed circuit is disposed across the back plate so that the printed circuit board is parallel to the back plate. The fastening element which has a length greater than the thickness of the printed circuit board passes through the through hole and is secured to the surface of the back plate. The flexible separator is disposed between the back plate and the printed circuit board and pushes the printed circuit board away from the back plate so that the printed circuit board touches against the fastening element. The flat panel display module maintains a space between the printed circuit board and the back plate to accomplish the purpose of anti-shock.

The invention provides a liquid crystal display unit, which can prevent printed circuit board from being interfered by EM. The said liquid crystal display unit comprises LCD panel for displaying image; backlight assembly for lighting LCD panel; chassis for fixing panel and backlight assembly; a first printed circuit board mounted on the back of the chassis and for generating signal to be supplied to LCD panel based on the external input signal; and a first connector connecting with signal transmission film and the said signal transmission film for providing signal to the first printed circuit board; protecting envelope formed by electric conducting material and for protecting the top surface of the first printed circuit board; and a first conductive gluing piece between the first connector and protecting envelope and for discharging the electromagnetic wave from the first connector to the protecting envelope.

A printed circuit board assembly includes: a first signal terminal row including a plurality of first signal terminals connected to a plurality of signal wirings of a flexible printed circuit board (FPCB), respectively; a first ground terminal row spaced from the first signal terminal row and including a plurality of first ground terminals connected to a plurality of ground wirings of the FPCB, respectively; a second signal terminal row including a plurality of second signal terminals connected to a plurality of signal wirings of a printed circuit board (PCB), respectively; and a second ground terminal row spaced from the second signal terminal row and including a plurality of second ground terminals connected to a plurality of ground wirings of the PCB, respectively. The first ground terminal row is closer to an end portion of the FPCB than the first signal terminal row.

A lightweight radio / CD player for vehicular application is virtually “fastenerless” and includes a fold-up case formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case is of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. Side wall closure members are extruded of aluminum defining self-engaging attachment features for affixing to the case, providing electrical self-grounding with the wire screen and thermal grounding with internal power devices. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection.

Electronic devices may be provided with one or more electrical components that may be coupled to one or more circuit boards by flexible circuits that can have reduced ground lengths. Each flexible circuit can include at least one ground conductor that may run along its length and that may have at least one portion exposed for coupling to a grounding element that may also be coupled to a ground plane.