2760results about "Resilient/clamping means" patented technology

A method for packaging a semiconductor device includes connecting a plurality of wire leads to a corresponding plurality of electrical connection pads on the semiconductor device, covering at least a portion of the semiconductor device and at least a portion of each of the wire leads with an encapsulating material, and removing a portion of the encapsulating material and a portion of each of the wire leads to form a packaged semiconductor device wherein each of the wire leads has an exposed portion only at an end. The invention also includes a packaged semiconductor device having an integrated circuit device with a plurality of electrical connection pads, a plurality of wire leads coupled to the plurality of electrical connection pads, and a covering of encapsulating material covering at least a portion of the integrated circuit device and covering each of the wire leads, wherein each of the wire leads has an exposed end. The present invention contemplates wire bonding and encapsulation of individual die as well as multiple die on a single wafer.

An LED-based luminaire includes a driver configured to convert line voltage into a desired power configuration. Elongate fasteners attach one or more LED-based lighting modules to a mount member and also to energized poles of the power driver. The fasteners communicate electrical energy from the power driver to the lighting module. In one embodiment, the mount member functions as a heat sink, and it includes a bumpy surface coating having a texture with sufficient feature heights to enhance heat transfer between the heat sink and the surrounding environment.

A substrate for mounting a semiconductor chip having bumps using an adhesive thereon, said substrate being, for instance, provided with an insulating coating having an opening in the semiconductor chip mounting area so that the wiring conductors will not be exposed to the substrate surface near the boundary of the semiconductor chip mounting area, is improved in connection reliability and has high mass productivity.

A docking station is disclosed. The docking station has an adjustable opening that accommodates portable electronic devices with differing sizes and shapes. The opening is capable of expanding to accommodate larger devices and retracting to accommodate smaller devices while still supporting the portable electronic device in its proper position within the docking station.

Portable electronic devices are provided. Each device may be formed from two parts. A first part may be provided with components such as a display, a touch screen, a cover glass, and a frame. A second part may be provided with a plastic housing, circuit boards containing electrical components, and a bezel. Engagement members may be connected to the first and second parts. The engagement members may be formed from metal clips with holes and springs with flexible spring prongs that mate with the holes in the clips. The metal clips may be welded to frame struts on the frame and the springs may be welded to the bezel. During assembly, the first part may be rotated into place within the second part. Retention clips attached to the frame may be used to secure the two parts together. Assembly instructions and associated connector numbers may be provided within the devices.

A peripherals device for coupling with a handheld communication device includes an interface to the handheld communication device and a processor for performing functions complementary to the communications device. According to another embodiment, the peripherals device includes a conformal cavity for receiving a handheld communications device in a secure fashion. According to yet another embodiment, the peripherals device includes a data collection device for collecting data and using the interface for sending the collected data to a remote processor for further processing. The data collection device can include an image reader, a barcode reader, a signature capture device, an optical character recognition. In yet another embodiment, there is a power subsystem that powers the peripherals device and the handheld communications device. The power system has a low power state to conserve energy. In another embodiment, the peripherals device comprises a plurality of processors that automatically reconfigure themselves to work with the communication device to which the peripherals device is connected.

Disclosed is a LGA socket connector including an insulative housing (2), a stiffener (3), a clip (4), and a lever (5) defining thereof a driving portion (50) and a locking portion (52) linked thereto. The stiffener is configured to grasp a periphery of the housing. The clip and the locking portion of the lever are essentially pivotally moved about longitudinal ends of the housing respectively, but with the driving portion disposed adjacent one transverse side of the housing. At least one of the clip and the stiffener is provided with a recessed region (300) adjacent said transverse side of the housing, thereby preventing the whole connector from becoming inclined when the connector is horizontally locked and placed on the printed circuit board.

A semiconductor package assembly comprises a first conductive pad on a semiconductor substrate; a second conductive pad on a package substrate; a bump physically coupled between the first conductive pad and the second conductive pad, wherein the bump is substantially lead-free or high-lead-containing; the bump has a first interface with the first conductive pad, the first interface having a first linear dimension; the bump has a second interface with the second conductive pad, the second interface having a second linear dimension; and wherein the ratio of the first linear dimension and the second linear dimension is between about 0.7 and about 1.7.

To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one capacitor embedded in an interposer that lies between the die and a substrate. In an embodiment, the interposer is a multilayer ceramic structure that couples power and signal conductors on the die to corresponding conductors on the substrate. The capacitor is formed of at least one high permittivity layer and in an embodiment comprises several high permittivity layers interleaved with conductive layers. Alternatively, the capacitor can comprise at least one embedded discrete capacitor. Also described are an electronic system, a data processing system, and various methods of manufacture.

An exemplary housing mechanism (100) for an electronic device includes a front cover (10), a back cover (20), and an elastic sealing element (12). The front cover has a projecting edge (18) defined thereon. The back cover has a recessed edge (26) defined therein. The elastic sealing element has a tip portion (122) and is formed or sealed together with the front cover. The projecting edge of the front cover and the tip portion of the elastic sealing element are configured to be press fit into the recessed edge of the back cover.

Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and / or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates. Alternate card assembly structures comprise a stiffening structure and a compliant carrier structure, such as a decal or screen, which is fixedly attached to the probe chip substrate.

A PCB mounting apparatus includes a supporting plate (20) defining a number of through holes, a number of standoffs (50) engaging in the through holes, and a number of grounding members (60) attached to the standoffs. The standoff each includes a head (52) having a holding portion, a flange (54), a post (56), and a base (58). The grounding member each includes a first ring (62) supported on the flange, a second ring (68) supported on the base, and a band (66) connecting therebetween. The PCB (80) defines a number of fixing apertures (82). The combined standoff and grounding member is disposed in the through hole. The PCB is placed upon the supporting plate with the fixing apertures engaging the holding portions of the standoffs and contacts the first rings of the grounding members. The standoffs and the grounding members are made of conductive materials.

A method of fabricating a package for a micro-electromechanical systems (MEMS) device. A flex circuit interconnect subassembly for the package is made by placing a flex circuit on a pad insert, attaching a carrier insert to the pad insert to deflect the lead portions of the flex circuit, and applying a cover insert to the pad insert, after the attachment of the carrier insert, to re-deflect the lead portions of the flex circuit toward the device bond sites. The flex circuit interconnect subassembly may be combined with an electronic device die / carrier subassembly to form a completed electronic device package. The flex circuit interconnect subassembly and the die / carrier subassembly are joined using mechanical interlocking layers. The invention is particularly suited for making such an electronic device die / carrier subassembly which has a MEMS die permanently affixed to a carrier. The carrier is advantageously utilized during the process of releasing a protective coating from the surface of the MEMS die which support the various MEMS components. The MEMS components on the MEMS die are hermetically sealed, such as by bonding a cover to the upper package body or the lower package body. The cover may have features such as ports which allow the MEMS components to interact with the external environment.

Resistance and parasitic inductance resulting from interconnection of semiconductor chips in power modules are reduced to negligible levels by a robust structure which completely avoids use of wire bonds through use of ball bonding and flip-chip manufacturing processes, possibly in combination with chip scale packaging and hourglass shaped stacked solder bumps of increased compliance and controlled height / shape. Turn-off voltage overshoot is reduced to about one-half or less than a comparable wire bond packaged power module. Hourglass shaped solder bumps provide increased compliance and reliability over much increased numbers of thermal cycles over wide temperature excursions.