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5916results about "Picture frames" patented technology

Semiconductor die package using leadframe and clip and method of manufacturing

A clip structure for a semiconductor package is disclosed. The clip structure includes a major portion, at least one pedestal extending from the major portion, a downset portion, and a lead portion. The downset portion is between the lead portion and the major portion. The clip structure can be used in a MLP (micro-leadframe package).
Owner:SEMICON COMPONENTS IND LLC
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