The invention discloses a non-photopolymerization PCB solder resist ink windowing and solder resist oil bridge process, which is used for high-precision PCB micro bonding pad solder resist ink windowing and solder resist oil bridge, and comprises the following steps of S1, manufacturing a blocking point screen, S2, silk-screening ink, S3, carrying out pre-baking treatment, S4, carrying out ink leveling treatment, and leveling the pre-baked solder resist ink by adopting an ink leveling machine, S5, drying and curing treatment: carrying out high-temperature drying and curing on the printed circuit board with the ink leveled, S6, grinding treatment: grinding the ink on the copper surface of the bonding pad to completely expose the copper layer of the bonding pad, and S7, cleaning and drying treatment: cleaning and drying the ground PCB through a horizontal surface cleaning machine, and carrying out micro-etching leveling and cleaning on the exposed copper surface by using a micro-etching leveling liquid and high-pressure water. The process is suitable for any-sizepad windowing and solder resist oil bridge manufacturing, and a powerful quality guarantee is provided for electronic products which are more and more integrated and precise.