The present invention provides a
semiconductor test apparatus that can reduce influence of
noise in high-frequency measurement and that can be manufactured inexpensively by simplification of the constitution. A
semiconductor test apparatus according to the present invention is one for use in an electrical test of a
semiconductor wafer in which numerous integrated circuits each having
electrode pads are incorporated. It comprises a
probe card and a tester having a connection portion to the
probe card. The
probe card has numerous probes that can be connected to the
electrode pads of the semiconductor
wafer and a probe board having on one surface probe lands to which the probes are attached, having on the other surface tester lands corresponding to the probes, and having wiring paths each connecting the probe land and the tester land corresponding to each other. The tester is directly connected to the probe card as the connection portion contacts the tester lands.