Method for forming COF circuit

Abstract

The invention provides a method for forming a COF circuit and relates to the technical field of integrated circuits. The method for forming the COF circuit comprises steps that S1, a base material ispunched, and guide holes on two sides of the base material are punched; S2, photoresist printing of a punched product is performed, and a required photoresist pattern is printed on a surface of a copper foil and cured; S3, the product printed with the photoresist pattern is etched, and the copper which is not covered by the photoresist under the action of an etching solution is removed; and S4, afilm of the etched product is stripped, the photoresist pattern protected on the copper surface is removed, and the circuit pattern is exposed. The method is advantaged in that circuit forming is carried out in a printing manner, operations of exposure and development processes are omitted, so occurrence of bad short circuit conditions is reduced, cost of the exposure and development processes isgreatly saved, a product processing period can be shortened, and equipment cost is greatly reduced.

Description

Technical field [0001] The invention relates to the technical field of integrated circuits, and in particular to a method for forming COF lines. Background technique [0002] With the increasing portability and diversification of functions of electronic products, the requirements for integrated circuits are getting higher and higher. In order to meet these needs, the demand for COF packaging substrates is also increasing. The domestic COF industry is also rising. The COF processed by the RTR method is complicated in the process, and the tempo of each process varies greatly, especially the exposure process. The exposure process is an important part of the line forming process. In order to achieve the balance of the production line, it also requires a lot of equipment matching. the cost of. [0003] In the current COF production process, circuit formation is performed in accordance with the traditional exposure and development method, which has the following defects: [0004] ① The p...

AI Technical Summary

Problems solved by technology

[0004] ①The production speed of the exposure process is very slow, so in order to balance the production line, a large amount of equipment needs to be equipped here to meet the production capacity requirements, so the cost of equipment is very high;

[0005] ②If the energy of the exposure machine is unstable during the exposure process, it will cause poor exposure, and bad patterns will be obtained in the subsequent development, and the final circuit will also be bad;

[0006] ③If there are foreign objects in the production process, it will also cause defects in the exposure process, which will eventually lead to the appearance of a large number of defective products;

[0007] ④ Changes in process parameters during the development process will also cause poor development, which will eventually lead to poor open and short circuits in the product;

[0008] ⑤ During the development process, if the product has developer residue, it will also affect the subsequent circuit etching

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