The present invention discloses a substrate within a Ni / Au structure electroplated on electrical contact pads and a method for fabricating the same. The method comprises: providing a substrate with a circuit
layout pattern and forming a conducting film on the surface of the substrate; depositing a first
photoresist layer within an opening on said electrical conducting film surface to
expose a portion of said circuit
layout pattern to be electrical contact pads; removing the exposed conducting film uncovered by the first
photoresist layer; depositing a second
photoresist layer, covering the conducting film exposed in the openings of the first photoresist layer;
electroplating Ni / Au covering the surface of the electrical contact pads; removing the first and second photoresists, and the conducting film covered by the photoresists; depositing
solder mask on the substrate within an opening to
expose said electrical contact pads. It improves the electrical
coupling between gold wires and the electrical contact pads of the substrate, prevents the electrical contact pads from oxidation, and insurances the electrical
interconnection performance.