168results about How to "Uniform layers" patented technology

A gas distributor for use in a semiconductor process chamber comprises a body. The body includes a first channel formed within the body and adapted to pass a first fluid from a first fluid supply line through the first channel to a first opening. A second channel is formed within the body and adapted to pass a second fluid from a second fluid supply line through the second channel to a second opening. The first and second openings are arranged to mix the fluids outside the body after the fluids pass through the openings.

The present invention is directed to providing a photo nanoimprint lithography which can form a more uniform base layer. A photo nanoimprint lithography according to the present invention includes the steps of discretely applying a photo-curable resist drop-wise onto a substrate, filling an asperity pattern of a mold with the photo-curable resist by bringing the mold having the asperity pattern formed therein into contact with the photo-curable resist, curing the photo-curable resist by irradiating the resist with a light and releasing from the mold the photo-curable resist which has been photo-cured, wherein an intermediary layer is formed on a surface of the substrate for maintaining a discrete placement of the photo-curable resist that has been instilled drop-wise on the substrate until the mold is brought into contact with the photo-curable resist that has been instilled drop-wise on the substrate.

A group-III nitride compound semiconductor device of the present invention comprises a substrate, an intermediate layer provided on the substrate, and a base layer provided on the intermediate layer in which a full width at half maximum in rocking curve of a (0002) plane is 100 arcsec or lower and a full width at half maximum in rocking curve of a (10-10) plane is 300 arcsec or lower. Also, a production method of a group-III nitride compound semiconductor device of the present invention comprises forming the intermediate layer by using a sputtering method.

A method for forming a SiGe epitaxial layer is described. A first SEG process is performed under a first condition, consuming about 1% to 20% of the total process time for forming the SiGe epitaxial layer. Then, a second SEG process is performed under a second condition, consuming about 99% to 80% of the total process time. The first condition and the second condition include different temperatures or pressures. The first and the second SEG processes each uses a reactant gas that includes at least a Si-containing gas and a Ge-containing gas.

An imaging member includes a surface layer comprising a fluoroelastomer-perfluoropolyether composite formed from a reaction mixture comprising a fluoroelastomer and a perfluoropolyether compound. Methods of manufacturing the imaging member and processes for variable lithographic printing using the imaging member are also disclosed.

A method of forming at least one wire on a substrate. The substrate includes at least one conductive region. An insulating layer is disposed on the substrate. At least one recess in the insulating layer exposes the conductive region. A barrier layer is formed on a surface of the insulating layer and the recess first. A continuous and uniform conductive layer is then formed on a surface of the barrier layer. A seed layer is thereafter formed on a surface of the conductive layer. Finally, a metal layer filling up the recess is formed on a surface of the seed layer.

A ultrasonic cleaning method is provided that performs ultrasonic cleaning without breaking a small and low-strength article-to-be-cleaned. It is a ultrasonic cleaning method that performs ultrasonic cleaning of an article-to-be-cleaned by a combination of a ultrasonic wave transmission medium and particles having a larger specific gravity than the ultrasonic wave transmission medium. The article-to-be-cleaned is cleaned by allowing at least a part of the article-to-be-cleaned to be in contact with a cleaning layer formed with the ultrasonic wave transmission medium and the particles where the mixing ratio of the particles to the ultrasonic wave transmission medium is 10 to 60 vol %, and imparting a ultrasonic wave to the cleaning layer. The particles mutually restrict their movements in a particle group thereby preventing the kinetic energy from becoming excessively large, and exhibit a frictional force and an impinging force suitable for removing the contaminant adhering to the surface without breaking the low-strength article-to-be-cleaned.

A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.

An inherently hydrophobic polymer membrane substrate having its surface rendered hydrophilic with a hydroxyalkyl cellulose and having a throughput greater than about 1500 L/m² is provided. A process for making the membrane also is provided which includes a step of autoclaving in boiling water and/or steam or submerging in boiling water. The membrane is useful for removing virus from a protein solution.

There are provided reactive metal powder atomization manufacturing processes. For example, such processes include providing a heated metal source and contact the heated metal source with at least one additive gas while carrying out the atomization process. Such processes provide raw reactive metal powder having improved flowability. The at least one additive gas can be mixed together with an atomization gas to obtain an atomization mixture, and the heated metal source can be contacted with the atomization mixture while carrying out the atomization process. Reactive metal powder spheroidization manufacturing processes are also provided.

A method of forming an alignment layer is described. A substrate comprising a display area and a non-display area is provided. A hydrophilic layer is formed on the substrate of the display area. A solution of an alignment material is dropped on the hydrophilic layer. The solution of the alignment material is solidified to form an alignment layer. Before dropping the solution of the alignment material on the hydrophilic layer, a hydrophobic layer may be formed on the substrate of the non-display area.

A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.

A method of and apparatus for dispensing photosensitive solution. substantially reduces the amount of air bubbles in the photosensitive solution during the dispensing operation. The photosensitive solution dispensing apparatus includes at least one supply vessel that contains the solution, a respective buffer tank that buffers the solution supplied from each supply vessel, a filter unit for filtering the solution, a pump for pumping the solution pumped from the buffer tank to the filter unit, a dispensing nozzle connected to the filter unit, and a dedicated bubble removal filter that is interposed between the buffer tank and the pump. The bubble removal filter is configured to remove air bubbles from the solution before the solution flows into the pump and is dispensed through the nozzle.

A phase retarder film is provided wherein at least one oblique evaporation layer comprising an inorganic dielectric mainly containing TiO2 is formed on at least one surface of a transparent polymer film with an intermediate layer between, the evaporation layer having positive refractive index anisotropy and a principal optic axis tilted 20 degrees to 70 degrees from a normal direction to said transparent polymer film. The phase retarder film is suitable for improving viewing angle characteristics of the TN-LCD.

A photosensitive compound whose size is smaller than conventional polymer for photoresist, and which has well-defined (uniform) structure, and a photoresist composition including the same are disclosed. The photosensitive compound represented by the following formula. Also, the present invention provides a photoresist composition comprising 1 to 85 wt % (weight %) of the photosensitive compound; 0.05 to weight parts of a photo-acid generator with respect to 100 weight parts of the photosensitive compound; and 10 to 5000 weight parts of an organic solvent.

In the formula, n is 0 or 1, x is 1, 2, 3, 4 or 5, y is 2, 3, 4, 5 or 6, z is 0, 1, 2, 3 or 4, R, R′ and R″ are independently hydrocarbon group of 1 to 30 carbon atoms, preferably 2 to 20 carbon atoms, and R′″ is a hydrogen atom or hydrocarbon group of 1 to 30 carbon atoms, preferably 2 to 20 carbon atoms.

A manufacturable method for forming a highly reliable electrical interconnection. An electrical interconnection pattern is first formed in a dielectric layer on a semiconductor substrate as recessed regions in the dielectric layer. A conductive layer primarily comprising copper is thereafter deposited over the surface and in the recessed regions of the dielectric layer. The conductive layer is then reflowed to fill the recessed regions of the dielectric layer with substantially no void formation. This reflow process may also be used to improve the step coverage of any such copper layer deposited over the surface of a substrate to be used in conjunction with alternate techniques for forming electrical interconnections including photoresist patterning and etch.

A mechanism for laying a strip on a receiving surface rotating about a first axis. The mechanism includes a laying head moving along a second axis oriented parallel to the axis of rotation of the surface and along a third axis oriented parallel to a radial direction passing through the point of contact between the receiving surface and a strip applicator of the laying head. The laying head is rotatable about a front axis oriented substantially perpendicular to the second and third axes and passing through the contact point. the laying includes a device for estimating the value of the of the angle α formed by a tangent to the transverse profile of the surface and the second axis. The movements of the laying head are determined by the value of the angle α in such a way as to displace the laying head in a direction parallel to the tangent following the transverse profile of the receiving surface.