The present invention provides an upper
electrode used in an
etching apparatus and the
etching apparatus including the upper
electrode, both of which can properly reduce intensity of
electric field of
plasma around a central portion of a substrate to be processed, thus enhancing in-plane uniformity of a
plasma process. In this apparatus, a recess, serving as a space for allowing a
dielectric to be injected therein, is provided around a central portion of the upper
electrode. A
dielectric supply passage configured for supplying the
dielectric into the space and a dielectric
discharge passage configured for discharging the dielectric from the space are connected with the space, respectively. With such configuration, the dielectric can be controllably supplied into the recess, such that in-plane distribution of the intensity of the
electric field can be uniformed, corresponding to in-plane distribution of the intensity of the
electric field of the
plasma generated under various
process conditions, such as a kind of each
wafer that will be etched, each
processing gas that will be used, and the like.