Method and system for patterning a mask layer
a mask layer and mask technology, applied in the field of mask layer patterning, can solve the problems of increasing run time and process errors, limiting layer-to-layer accuracy, and causing various difficulties
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[0030]The presently described embodiments use a printing process, e.g. a wax printing technique, to pattern a mask layer (such as a soldermask layer) of, for example, a printed circuit. Substantially all other conventional processes in developing soldermask and exposure processes can be maintained. According to the presently described embodiments, each printed circuit, e.g. a printed circuit board (PCB), will have a unique pattern that matches uniform and non-uniform runout. The pattern, in one form, is comprised of single drops of wax having a specified gap therebetween to make the process transparent to the current industry practice. Furthermore, the single drops can be used for both large and small areas without any development time differences. In at least one form, the wax pattern and the soldermask in the gap are removed during development.
[0031]One advantage is that large areas and small areas can be patterned without loading effect and can be patterned evenly, due to uniform...
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