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456 results about "De wetting" patented technology

A method of driving an active matrix electro-wetting on dielectric device and an active matrix electro-wetting on dielectric device

ActiveUS20180078934A1Minimizes physical sizeMinimizing size of whole arrayCellsStatic indicating devicesDielectricElectricity
A method of driving an active matrix electro-wetting on dielectric (AM-EWOD) device comprises (i) setting a reference electrode to a first reference voltage; (ii) writing a set of data to array element electrodes of array elements of the device; and (iii) either (a) maintaining the voltages written to the array element electrodes until a time t0 or (b) re-writing the set of data N−1 times (where N≧2). The reference electrode is then set to a second reference voltage different from the first reference voltage, and features (i) to (iii) are repeated. When the data are first written, there is a delay between the time when the voltage on the reference electrode is transitioned and the time when a given array element is next written with data. Feature (iii) allows the time for which the correct data values are held to be increased relative to the time for which incorrect data values may possibly be held, so that the time for which an element may be in an incorrect state can be made insignificant in terms of its effect on unwantedly perturbing droplet operations.
Owner:SHARP LIFE SCI EU LTD

Black pigment ink for ink-jet printer and method for preparing the same

The invention provides a black ink for ink-jet printers, which comprises 10-30% of carbon black, 0.1-1.25% of amphiprotic polymerized substance, 0.1-1.5% of levelling agent, 10-30% of wetting agent, 0.05%-0.5% of defoaming agent and deionized water, 20-33% of carbon black dispersion liquid, 0.05-2% of surface active agent, 5-50% of humectant, 0.1-2% of pH regulator, 0.5-2% of drier, 0.1-0.5% of preservative agent, 0.1-0.5% of mold preventive, 0.01-0.5% of chelating agent, 0.1-2% of resin and deionized water.
Owner:大连思创信息材料有限公司

Semiconductor device and method of fabricating the same

A semiconductor device having a contact structure that can exhibit superlative step coverage without causing voids or wiring discontinuities, using aluminum or aluminum alloys as a conductive substance for via-holes. A method of fabricating the semiconductor device comprises, for at least one layer of wiring regions above the first wiring region on a semiconductor substrate, the following steps (a) to (f): (a) a step of forming a via-hole in a second interlayer dielectric formed above the first wiring region on a semiconductor substrate; (b) a degassing step for removing gaseous components included within the interlayer dielectric by a heat treatment under reduced pressure and at the substrate temperature of 300 DEG C. to 550 DEG C.; (c) a step of forming a wetting layer on the surface of the interlayer dielectric and the via-hole; (d) a step of cooling the substrate to a temperature of no more than 100 DEG C.; (e) a step of forming a first aluminum layer comprising one of aluminum and an alloy in which aluminum is the main component on the wetting layer at a temperature of no more than 200 DEG C.; and (f) a step of forming a second aluminum layer comprising one of aluminum and an alloy in which aluminum is the main component on the first aluminum layer at a temperature of at least 300 DEG C.
Owner:SEIKO EPSON CORP

Ultrafine fluid jet apparatus

An ultrafine fluid jet apparatus comprising a substrate arranged near a distal end of an ultrafine-diameter nozzle to which a solution is supplied, and an optional-waveform voltage is applied to the solution in the nozzle to eject an ultrafine-diameter fluid droplet onto a surface of the substrate; wherein an electric field intensity near the distal end of the nozzle according to a diameter reduction of the nozzle is sufficiently larger than an electric field acting between the nozzle and the substrate; and wherein Maxwell stress and an electro-wetting effect being utilized, a conductance is decreased by a reduction in the nozzle diameter or the like, and controllability of an ejection rate by a voltage is improved; and wherein landing accuracy is exponentially improved by moderation of evaporation by a charged droplet and acceleration of the droplet by an electric field.
Owner:SIJTECH +1

Micro-fluidic chip based on SERS detection, preparation method and application thereof

The invention relates to a micro-fluidic chip based on SERS detection, a preparation method and an application thereof. The preparation method comprises the steps of preparing a super-hydrophobic titanium dioxide solution, preparing a substrate with a super-hydrophobic layer and preparing a chip, wherein the chip comprises the substrate and a T-shaped runner arranged on the surface of the substrate; the interior of the runner is super-hydrophilic and the exterior of the runner is super-hydrophobic; two ends of a cross runner of the T-shaped runner are used as two runner inlets; a detection area is arranged at the tail end of a vertical runner; super-hydrophobic micro-patterns are distributed in the cross runner of the T-shaped runner; the micro-patterns are divided into a plurality of areas from two ends to the center; the intervals of the super-hydrophobic patterns in each area are equal to each other; the pattern interval gradient between area and area along the direction from two ends to the center is increased; a wetting gradient from lyophobic state to hydrophilic state is formed in the cross runner from two ends to the center; the vertical runner is designed as a wedge-shaped runner. The micro-fluidic chip based on SERS detection has the beneficial effects that the surface wetting gradient and the wedge-shaped structure runner are combined for realizing the automatic transportation of drop to the detection area and the cost of micro-fluid driving is greatly reduced.
Owner:ZHEJIANG UNIV OF TECH +1

Super-hydrophobic porous membrane as well as preparation method and application thereof

The invention discloses a super-hydrophobic porous membrane as well as a preparation method thereof. A micro molding technology and a phase separation technology are combined, a membrane scraping bottom plate on which a membrane casting solution is scraped is placed in a water bath at the preset temperature for phase separation membrane formation, a formed membrane material is stripped, and the super-hydrophobic porous membrane is obtained. The membrane scraping bottom plate is a grooved soft template produced with a reverse mold process, the super-hydrophobic porous membrane produced throughthe grooved soft template comprises micron-size surface bulges which are consistent in size and arranged regularly, and the distance between adjacent surface bulges is micron-sized. The surface morphology of the membrane material is reconstructed, the super-hydrophobic porous membrane with multiple scales is prepared while additional modifiers are not added, and the super-hydrophobic porous membrane can be applied to a membrane distillation technology, has the advantages of high hydrophobicity, pollution resistance, wetting resistance and the like and thus has high salt resistance, and a novelmembrane production technology is provided for industrialization of membrane distillation and is low in cost and prone to mass production.
Owner:SHANGHAI ADVANCED RES INST CHINESE ACADEMY OF SCI +1

Programmable control micro-fluidic chip based on liquid-liquid electrowetting effect

The invention provides a programmable control micro-fluidic chip based on a liquid-liquid electrowetting effect. The programmable control micro-fluidic chip comprises a lower substrate, a drive electrode array, a lower substrate hydrophobic insulating layer, at least one liquid drop, an upper substrate hydrophobic layer, a conductive layer and an upper substrate from bottom to top, wherein cofferdams are added to the peripheries of the upper substrate and the lower substrate to form a closed cavity. The hydrophobic insulating layer is formed by a porous polymer film and a liquid capable of improving electric wettability and has the advantages of being good in electric wetting reversibility, reusable and resistant to voltage breakdown, high temperature and chemical reagents, the effect of the hydrophobic insulating layer is not affected after long-time storage, so that the service life of a device is prolonged, the efficiency of the device is improved, and the application range of the device is broadened; besides, the pressing mode of the drive electrode array can be programmed, therefore, operation processes such as rapid movement, combination, reaction and the like of different liquid drops are executed in different positions according to preset parameters.
Owner:INT ACAD OF OPTOELECTRONICS AT ZHAOQING SOUTH CHINA NORMAL UNIV

Precision electroplated solder bumps and method for manufacturing thereof

A method for fabrication of a solder bump, comprising applying preferably an insulating film, followed by applying a multilayer underbump metallization, a layer of a photoresist, and a thin layer of titanium on a substrate containing, preferably, III-V semiconductor circuits. The multilayer UBM pad, preferably comprising a 0.02 to 0.05 micrometer thick layer of titanium, a 0.5 to 1.0 micrometer thick layer of nickel and a 0.1 to 0.2 thick layer of gold. The protective film with the thickness of preferably 0.5 to 40 micrometer comprises a photoresist. After the solder has been electroplated, the protective film is removed, preferably by dry etching or with a solvent. The titanium film serves a dual function of being a membrane for electroplating of the solder and of being a non-wettable dam for wetting back of the plated solder. The titanium film with the thickness of 200 to 1,000 Angstroms is preferably deposited by evaporation. After the solder has been electroplated, much of the titanium film is removed, preferably by wet etching or dry etching, leaving only a band of titanium that surrounds the disk of solder. A multilayer solder bump structure for III-V semiconductor circuits manufactured using this method, comprising, preferably, an insulating film, a multilayer underbump metallization layer, and remnants of the thin titanium film.
Owner:HRL LAB

Water-based composite passivation solution for galvanized steel plate and preparation method of water-based composite passivation solution

The invention relates to a water-based composite chromium-free passivation solution for a galvanized steel plate. The passivation solution contains 10-30g / L of sodium molybdate, 0-10g / L of sodium phosphate, 5-10g / L of organic phosphoric acid, 1-10g / L of fluotitanic acid, 5-15g / L of a silane coupling agent, 5-20g / L of sodium metasilicate, 0.1-1% of a wetting dispersant and the balance of deionized water. The passivation solution provided by the invention consists of an organic phosphoric acid-molybdate system in match with the modified hydrolysis type silane coupling agent and a nano-inorganic filler, does not contain a chromate and is in line with ROHS requirements; the passivation and drying curing time is short, the degree of stability is high, the quality of a film layer is good, the white rust area in a 72h salt fog test does not exceed 5%, the cost is relatively low, a passivation process device does not need to be changed, and continuous passivation can be realized by using a hexavalent chromium passivation device in early period.
Owner:北京蓝星清洗有限公司

Aerogel composite and method for preparing same

A method of preparing an aerogel composite, which includes a wetting pretreatment step for suppressing the generation of air bubbles in a fibrous material such as a mat, and a step of impregnating the fibrous material with a precursor by injecting the precursor in a vessel under a reduced pressure. The method provides a high quality, high insulation aerogel-impregnated composite without air bubbles.
Owner:SKC CO LTD

Spray gun

ActiveUS7431223B2Increased rate of transportationIncrease pump speedSpray nozzlesFluid dynamicsEngineeringViscous medium
A spray gun for spraying paints and similar viscous media that can be propelled pneumatically, comprising a gun housing for accommodating components of the spray gun that effect propulsion, mixture and / or metering, a handle projecting from the gun housing, and a reservoir tank removably attached to the gun housing for holding the medium to be processed, with the housing of the spray gun provided with an air guidance duct through which the compressed air responsible for atomization flows to an atomizer nozzle, wherein surfaces of the air guidance duct and / or atomizer nozzle, and / or an air cap, which come into contact with the stream of compressed air, or are wetted, are provided wholly or in part with a structured surface in the form of indentations and / or protrusions worked into the surfaces.
Owner:J WAGNER GMBH
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