The invention discloses an electroplating solution for enhancing the electrical conductivity of electronic copper foil, a preparation method and an electroplating process. The electroplating solution comprises the following components: a mixed solution of 100-150 parts of 1-ethyl-3-methylimidazolium chloride (EMIMCl) and 63-95 parts of absolute ethyl alcohol (AE) serves as a solvent, and 1-6 parts of anhydrous arsenic trichloride (AsCl3), 2-9 parts of anhydrous niobium pentachloride (NbCl5), 10.3-20.8 parts of a cosolvent and 0.1-0.5 part of an additive serve as solutes. According to the electroplating solution, the preparation method and the electroplating process, a NbAs alloy film layer is electrically deposited on the electronic copper foil, the electrical conductivity of the electronic copper foil is enhanced, the bonding capacity of the prepared NbAs alloy film layer and the electronic copper foil is high, the electrical conductivity and heat conductivity are high, the chemical stability is good, in addition, the process is simple, environmental pollution is avoided, the energy consumption is small, and the repeatability is high.