The invention discloses an organic
silicone modified phenolic resin encapsulating material and a preparation method and usage thereof. The encapsulating material comprises the following components in parts by weight: 15-19 parts of modified phenolic resin, 3-5 parts of
titanium white, 1-2 parts of organic
silicon, 50-64 parts of
silicon micro
powder, 5 parts of
pigment, 3 parts of thixotropic agent, 5 parts of
drying agent and 4-7 parts of curing agent. The preparation method of the encapsulating material comprises the following steps: spraying,
extrusion, crushing and ball milling. The encapsulating material has the advantages of
high pressure resistance,
temperature difference resistance, good insulating property, good
moisture proof performance, high
mechanical strength, quick natural
drying, stable electric property, good adhesion, no
cracking before and after curing, no color variation and the like, the production efficiency is increased by 20%, the output rate is improved by 10%, the manufacturing cost is reduced, the encapsulated product has a bright and attractive surface, is green and environment-friendly, and can replace an imported encapsulating material. The organic
silicone modified phenolic resin encapsulating material is mainly used for the dipping encapsulation of porcelain medium capacitors,
ceramic filters, thermistors and other electronic components.